The subject matter herein generally relates to a housing, an electronic device employing the housing, and a manufacture method of the housing.
Metal housings of electronic devices are more and more important nowadays. The metal housing may affect antennas in the electronic device. It is general to use plastic injection to connect the antenna and the metal housing when manufacturing process for improving a performance of the antenna. However, some other material may filter into a conjunction portion of the plastic and the metal, which affects a conjunction of the plastic and the metal. In addition, a color and a brightness of the plastic and the metal may have a great difference using the traditional manufacturing process.
Many aspects of the disclosure can be better understood with reference to the following figures. The components in the figures are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. In addition, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. Also, the description is not to be considered as limiting the scope of the embodiments described herein. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features of the present disclosure.
The term “comprising,” when utilized, means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in the so-described combination, group, series and the like.
The housing 13 is a thin sheet. In at least one embodiment, the housing 13 is a back cover of the electronic device.
The base 131 is made of conductive material, such as metal, metal glass, a mix material of metal and ceramic, and carbon fiber plate, the metal material can be such as aluminium, aluminium alloy, titanium, titanium alloy, magnesium, magnesium alloy, zinc, zinc alloy, zirconium, columbium, and stainless steel.
The side surface 1313 having the slot 132 and the surface having the groove 1315 cooperatively form a non-conductive film 133 by surface treatment. A thickness of the non-conductive film 133 can be about 5 micron to 1 millimeter. Preferably, the thickness of the non-conductive film 133 is about 10 to 500 micron. The antenna 15 is received in the slot 132. The non-conductive film 133 covers and combines with the antenna 15. That is, the non-conductive film 133 internally connects the antenna 15 and externally connects the base 131.
The non-conductive film 133 is made of non-conductive material, such as aluminum oxide, titanium, magnesium oxide, zinc oxide, zirconium oxide, columbium oxide, and iron oxide.
When the base 131 is made of metal material, the material of the non-conductive film 133 is selected as the corresponding metal oxide. Thus, the non-conductive film 133 and the base 131 have similar appearances and colors.
The non-conductive film 133 covers the antenna 15 to insulate the antenna 15 from the base 131. Thus, the base 131 made of metal material may not affect the antenna 15 transmitting and receiving signals. In addition, the antenna signals may be transmitted though the non-conductive film 133, which to improve radiation efficiency for the electronic device.
The surface of the antenna 15 connecting the non-conductive film 133 includes at least one inlay 151 corresponding to the groove 1315, the non-conductive film 133 is sandwiched between the antenna 15 and the surface having the groove 1315. Thus, the antenna 15 is firmly coupled to and insulated from the base 131. In at least one embodiment, the inlay 151 is a ring shape and is inserted into the groove 1315.
In other embodiments, the shape of the antenna 15 can be adjusted and a shape of the slot 132 can be adjusted accordingly. In other embodiments, the groove 1315 on the base 131 and the inlay 151 of the antenna 15 can be ignored.
A manufacture method of the housing 13 of the electronic device 100 is described as follows:
Referring to
The base 131 is made of conductive material.
Referring to
Referring to
Referring to
Referring to
The housing 23 includes a frame 231, the frame 231 includes two opposite arms 2311 and a middle board 2312 connecting the two arms 2311. Each arm 2311 includes a first surface 2313 and a second surface 2314 opposite to the first surface 2313. The first surface 2313 is an external surface and the second surface 2314 is an internal surface of the arms 2311.
The frame 231 is made of conductive material, such as metal, metal glass, a mix material of metal and ceramic, and carbon fiber plate, the metal material can be such as aluminium, aluminium alloy, titanium, titanium alloy, magnesium, magnesium alloy, zinc, zinc alloy, zirconium, columbium, and stainless steel. The arm 2311 forms a plurality of slots 2315 by cutting throughout the first surface 2313 and the second surface 2314. Each slot 2315 separates the arms 2311 into two sections. A width of each slot 2315 can be 100 micron to 5 millimeter. The slots 2315 are corresponding to the antenna 27. In at least one embodiment, the arms 2311 include four slots 2315 and every two slots 2315 are formed on one arm 2311.
A non-conductive film 2317 is formed on a surface of the slots 2315 by surface treatment. The non-conductive film 2317 is filled in the slots 2315 to connect and insulate opposite ends of the arm 2311. A width of the non-conductive film 2317 can be 50 micron to 5 millimeter.
In other embodiments, the non-conductive film 2317 can be formed on the middle board 2312 to improve a conjunction of the non-conductive film 2317 and the arms 2311.
The non-conductive film 2317 is made of non-conductive material, such as aluminum oxide, titanium, magnesium oxide, zinc oxide, zirconium oxide, columbium oxide, and iron oxide, to connect and insulate opposite sides of the frame 231.
When the frame 231 is made of metal material, the material of the non-conductive film 2317 is selected as the corresponding metal oxide. Thus, the non-conductive film 2317 and the frame 231 have similar appearances and colors.
The slot 2315 and the non-conductive film 2317 are corresponding to the antenna 27, thus antenna signals may be transmitted though the non-conductive film 2317, which to improve radiation efficiency for the electronic device 200.
A manufacture method of the housing 23 of the electronic device 200 of second embodiment is described as follows:
Referring to
Referring to
Referring to
In other embodiments, the non-conductive film 2317 can be formed on the middle board 2312 to improve a conjunction of the non-conductive film 2317 and the arms 2311.
In some cases, some material may overflow from the slots 2315 when forming the non-conductive film 2317 and be formed on the first surface 2313.
The surface treatment can be chemical treatment, anodic oxidation treatment, microarc oxidation treatment, vacuum coating treatment, or spraying treatment. The non-conductive film 2317 is made of non-conductive material, can be such as aluminum oxide, titanium, magnesium oxide, zinc oxide, zirconium oxide, columbium oxide, and iron oxide.
Referring to
The slot 2315 and the non-conductive film 2317 are corresponding to the antenna 27, thus antenna signals may be transmitted though the non-conductive film 2317, which to improve radiation efficiency for the electronic device 200.
The housing 33 includes a frame 331, the frame 331 includes two opposite arms 3311 and a middle board 3312 connecting the two arms 3311. The arms 3311 include a first surface 3313 and a second surface 3314 opposite to the first surface 3313. The first surface 3313 is an external surface and the second surface 3314 is an internal surface of the arms 3311.
The frame 331 is made of conductive material, such as metal, metal glass, a mix material of metal and ceramic, and carbon fiber plate, the metal material can be such as aluminium, aluminium alloy, titanium, titanium alloy, magnesium, magnesium alloy, zinc, zinc alloy, zirconium, columbium, and stainless steel.
Cooperatively referring to
A non-conductive film 3318 is formed on the side surface 3316 by surface treatment. The non-conductive film 3318 is filled in the slot 3315. A thickness of the non-conductive film 3318 can be 50 micron to 1 millimeter. Preferably, the thickness of the non-conductive film 3318 is 10 micron to 500 micron. The non-conductive film 3318 is made of non-conductive material, such as aluminum oxide, titanium, magnesium oxide, zinc oxide, zirconium oxide, columbium oxide, and iron oxide.
When the frame 331 is made of metal material, the material of the non-conductive film 3318 is selected as the corresponding metal oxide. Thus, the non-conductive film 3318 and the frame 331 have similar appearances and colors.
Cooperatively referring to
In other embodiments, the shape of the antenna 37 can be adjusted and a shape of the groove 3315 can be adjusted accordingly.
A manufacture method of the housing 33 of the electronic device 300 is described as follows:
Referring to
Referring to
Referring to
The non-conductive film 3318 can also be formed on the middle board 3312 to improve a conjunction of the non-conductive film 3318 and the frame 331. The surface treatment can be chemical treatment, anodic oxidation treatment, microarc oxidation treatment, vacuum coating treatment, or spraying treatment.
Referring to
Referring to
The slot 3315 and the non-conductive film 3318 are corresponding to the antenna 37, the antenna signal may be transmitted via the non-conductive film 3318 to improve radiation efficiency of the electronic device 300.
It is believed that the embodiments and their advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the scope of the disclosure or sacrificing all of its advantages, the examples hereinbefore described merely being illustrative embodiments of the disclosure.
Number | Date | Country | Kind |
---|---|---|---|
201510265280.3 | May 2015 | CN | national |