Patent Application
20090009935
1. Field of the Invention
The present invention generally relates to housings, and particularly, to a housing for an electronic device, and to a method for making the housing injection molding process.
2. Discussion of the Related Art
Nowadays, metal parts are usually used to create housings for electronic devices to improve decorative appearance of the housings. However, the metal parts are typically exposed on the outer area of the housing. The metal parts are prone to be abraded or corroded to diminish metal luster during use. Furthermore, the metal parts exposed out of the housings are prone to be inducted to carry static electricity, thereby may cause failure in electrical elements received in the housings.
Therefore, an improved housing for an electronic device is desired in order to overcome the above-described shortcomings.
In one embodiment thereof, a housing for an electronic device is provided. The housing for an electronic device includes a transparent substrate and a decorative part. The transparent substrate is made of a transparent moldable material. The transparent substrate includes an outer portion and an inner portion. The decorative part is received in the inner portion of the transparent substrate. The substrate is injection molded to enclose the decorative part.
Other advantages and novel features will become more apparent from the following detailed description of preferred embodiments when taken in conjunction with the accompanying drawings.
Many aspects of the housing for an electronic device can be better understood with reference to the following drawing. The components in the drawing are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the housing for an electronic device. Moreover, in the drawing like reference numerals designate corresponding parts throughout the several views.
Referring to
The substrate 10 includes an outer portion 11 and an inner portion 12 on the opposite side to the outer portion 11. The decorative part 20 is received in the inner portion 12 of the substrate 10. The substrate 10 is made of a transparent moldable material selected from a group consisting of polycarbonate, polymethyl methacrylate, polystyrene, polyvinyl chloride, silicon gel, or any desired combination thereof. The substrate 10 is molded to enclose the decorative part 20 therein via injection molding process. The decorative part 20 is selected from a group consisting of metal, ceramic, plated articles, and glass.
During use of the housing 100, the decorative part 20 is received in the inner portion 12 of the substrate 10, thereby prevents the decorative part 20 from being abraded or corroded.
An exemplary method for making the housing 100 is provided. Firstly, referring to
Secondly, referring to
Thirdly, a clear molten plastic is injection molded into the molding cavity 36 to enclose the decorative part 20, thereby forming the substrate 10.
Finally, referring to
It should be understood that after the substrate 10 being formed, the mold core 342 could further be moved to compress the substrate 10 so as to reduce the stress generated between the substrate 10 and the decorative part 20. Thus, any potential image aberration caused by the birefringence of the substrate 10 can be reduced.
It should be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
| Number | Date | Country | Kind |
|---|---|---|---|
| 200710076371.8 | Jul 2007 | CN | national |
This application is related to a co-pending U.S. patent application Ser. No. (Attorney Docket No. US14154), entitled “HOUSING FOR AN ELECTRONIC DEVICE, ELECTRONIC DEVICE USING THE HOUSING, AND METHOD FOR MAKING THE HOUSING”, by Che-Yuan Hsu et al. This application is also related to another co-pending U.S. patent application Ser. No. (Attorney Docket Nos. US14159), entitled “HOUSING FOR ELECTRONIC DEVICES, ELECTRONIC DEVICE USING THE HOUSING AND METHOD FOR MAKING THE HOUSING”, by Che-Yuan Hsu et al. Such applications have the same assignee as the present application and have been concurrently filed herewith. The above-identified applications are incorporated herein by reference. This application claims all benefits accruing under 35 U.S.C. §119 from China Patent Application No. 200710076371.8, filed on Jul. 4, 2007 in the China Intellectual Property Office, the disclosure of which is incorporated herein by reference.
