FIG. 1 is a top perspective view of a housing for electronic communication devices embodying our new design;
FIG. 2 is a rear elevation view thereof;
FIG. 3 is a top plan view thereof;
FIG. 4 is a front elevation view thereof;
FIG. 5 is a bottom plan view thereof; and,
FIG. 6 is a side elevation view thereof, the other side being a mirror image thereof.