1. Technical Field
The present disclosure generally relates to a housing for electronic devices and a method for making the housing.
2. Description of Related Art
Housings for electronic devices having decorative patterns can be more appealing to consumers. Typically, patterns are formed by anodizing, electrophoresis, or painting on metal housings. A multiple-anodizing process may be used to achieve a pattern having a gradual color change. However, the multiple-anodizing process can be complicated.
Therefore, there is room for improvement within the art.
Many aspects of the housing for electronic device and method for making the housing can be better understood with reference to the following drawings. The components in the drawings are not necessarily to scale, the emphasis instead being placed upon clearly illustrating the principles of the present housing and method for making the housing.
The substrate 11 has a plurality of recesses 112 formed on an outer surface 110 thereof. The recesses 112 may have an average width of about 0.02 mm-0.04 mm. The average depth of the recesses 112 may be about 0.05 mm-0.1 mm. The distance between each two adjacent recesses 112 may be about 0.2 mm-2 mm. The distance between each two adjacent recesses 112 can gradually change (increase or decrease) from a first end 115 of the outer surface 110 to a second end 116 opposite to the first end 115 of the outer surface 110. However, even with the change in distance between each two adjacent recesses 112, the distance between each two adjacent recesses 112 may be about 0.2 mm-2 mm. Referring to
The protective layer 14 may be a transparent polyurethane layer. The thickness of the protective layer 14 may be about 20 μm-30 μm. The protective layer 14 protects the outer surface 110 from damage.
Referring to
An exemplary method for making the housing 10 may include the following steps.
The substrate 11 having the outer surface 110 is provided. The substrate 11 may be made of metal, such as stainless steel, titanium, titanium alloy, aluminum alloy, and magnesium alloy. The substrate 11 may be formed by punching.
A plurality of recesses 112 are formed by laser engraving. A laser engraving machine (not shown) may be used. The operation of the laser engraving machine is numerically controlled. A pattern is first converted into digital data, then the laser engraving machine engraves the outer surface 110 of the substrate 11 in accordance with the digital data to produce the recesses 112. The pattern is defined by the combination of the recesses 112. The recesses 112 may have an average width of about 0.02 mm-0.04 mm. The average depth of the recesses 112 may be about 0.05 mm-0.1 mm. The distance between each two adjacent recesses 112 may be about 0.2 mm-2 mm, and the recesses 112 are dispersed on the outer surface 110 with a dispersing gradual change of density as described above.
The laser engraving process may be carried out under the following parameters: a frequency of about 1000 Hz-30000 Hz, a power of about 5 W-20 W, a scanning rate of about 200 mm/s-500 mm/s, a scanning energy of about 0.2 millijoules (mJ)-2 mJ, and a focused diameter of a laser beam of about 0.02 mm-0.04 mm.
The protective layer 14 is formed on the substrate 11 such as by spray painting. The protective layer 14 may have a thickness of about 20 μm-30 μm.
The method for making the housing 10 may further include forming a color layer 12 between the substrate 11 and the protective layer 14, before forming the protective layer 14. The color layer 12 may be formed by spray painting, ink printing, or vacuum deposition. The color layer 12 may be coated on the entire outer surface 110. Alternatively, the color layer 12 may be coated only in the recesses 112.
It should be understood that the protective layer 14 may be omitted, thus the step of forming the protective layer 14 may be omitted.
It is believed that the exemplary embodiment and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the disclosure or sacrificing all of its advantages, the examples hereinbefore described merely being preferred or exemplary embodiment of the disclosure.
Number | Date | Country | Kind |
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201110080427.3 | Mar 2011 | CN | national |