1. Field of the Invention
The present disclosure generally relates to housings for electronic devices, more particularly, to a housing for an electronic device and a method for making the same.
2. Description of related art
Currently, portable electronic devices with wireless communication capability, such as mobile phones, are widely used. Consumers often select a portable electronic device with good quality and an attractive appearance. A typical method for making an attractive housing for the portable electronic device is the In-Mold Labeling (IML) process. The process is carried out by molding a plastic substrate to combine with a plastic film in a mold. Before molding, a pattern is printed on the plastic film. After the molding, the pattern is sandwiched between the film and the molded plastic substrate and thus prevents it from erosion.
However, during the molding process, the film is bent with a three-dimensional structure to mate with the three dimensional plastic substrate. The film is generally thin and is prone to tear or be distorted.
Therefore, there is room for improvement within the art.
Many aspects of the disclosed the housing for electronic device and method for making the same can be better understood with reference to the following drawings. These drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the exemplary the housing for electronic device and method for making the same. Moreover, in the drawings like reference numerals designate corresponding parts throughout the several views. Wherever possible, the same reference numbers are used throughout the drawings to refer to the same or like elements of an embodiment.
The exemplary housing 10 as disclosed is suitable for an electronic device such as a mobile phone, portable computer, and other devices.
Referring to
Referring to
It is to be understood that the steps to fabricate the housing 10 can be changed, such as the screen ink layer 104 can be formed on the inner surface 1022, and then the bottom ink layer 108 is formed, and finally the outer ink layer 106 is formed.
It is to be understood that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of structures and functions of various embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the present disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Number | Date | Country | Kind |
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200910302149.4 | May 2009 | CN | national |