FIG. 1 is a side elevation of a housing for electronic device showing our new design;
FIG. 2 is a top plan view thereof;
FIG. 3 is a side elevation of the side opposite that shown in FIG. 1;
FIG. 4 is an end elevation thereof;
FIG. 5 is a bottom plan view thereof;
FIG. 6 is an end elevation of the end opposite that shown in FIG. 4; and,
FIG. 7 is a perspective view thereof.
Portions of each of the figure drawing are stippled to indicate a contrast in surface finish.