TREA

Housing for electronic modules with cooling fins

Follow

Information

  • Patent Grant
  • D722577
  • Patent Number
    D722,577
  • Date Filed
    Thursday, January 9, 2014
    11 years ago
  • Date Issued
    Tuesday, February 17, 2015
    10 years ago
  • US Classifications
    Field of Search
    • US
    • D13 179
    • 165 080300
    • 165 104260
    • 165 104330
    • 165 122000
    • 165 151000
    • 165 185000
    • 257 706000
    • 257 707000
    • 257 718-722
    • 361 695000
    • 361 697000
    • 361 700000
    • 361 702000
    • 361 704000
    • 361 709000
    • 361 710000
    • 361 711000
    • 361 719000
    • CPC
    • F28D1/0246
    • F28D1/0426
    • F28D15/02
    • F28D15/0266
    • F28D15/0275
    • F28D15/04
    • F28F13/003
    • F28F13/12
    • F28F1/325
    • F04D25/0613
    • F04D25/068
    • F04D29/281422
    • F21V29/2293
    • F21V29/2231
    • G03B21/16
    • G06F1/20
    • G06F1/203
    • H01L23/34
    • H01L23/367
    • H01L23/3672
    • H01L23/40
    • H01L23/4006
    • H01L23/4093
    • H01L23/427
    • H01L23/467
    • H05K7/20
    • H05K7/20127
    • H05K7/20145
    • H05K7/20154
    • H05K7/20172
    • H05K7/20336
  • International Classifications
    • 1303
    • Term of Grant
      14Years
Information
Abstract
Description


FIG. 1 is a front view of a design for a housing for electronic modules with cooling fins according to the present disclosure.



FIG. 2 is a back view of the housing for electronic modules with cooling fins of FIG. 1.



FIG. 3 is a left view of the housing for electronic modules with cooling fins of FIG. 1.



FIG. 4 is a right view of the housing for electronic modules with cooling fins of FIG. 1.



FIG. 5 is a top view of the housing for electronic modules with cooling fins of FIG. 1.



FIG. 6 is a bottom view of the housing for electronic modules with cooling fins of FIG. 1; and,



FIG. 7 is a perspective view of the housing for electronic modules with cooling fins of FIG. 1.


The solid lines in FIGS. 1-7 illustrate a housing for electronic modules with cooling fins according to the present disclosure. The broken lines form no part of the claimed design.


Claims
  • The ornamental design for a housing for electronic modules with cooling fins, as shown and described.
Priority Claims (1)
Number Date Country Kind
2 273 391 Jul 2013 EP regional
US Referenced Citations (16)
Number Name Date Kind
3592260 Berger Jul 1971 A
D368253 Graves Mar 1996 S
D403666 Maack et al. Jan 1999 S
6144092 Kappes et al. Nov 2000 A
D449587 Cronin Oct 2001 S
6313399 Suntio et al. Nov 2001 B1
6326761 Tareilus Dec 2001 B1
6421239 Huang Jul 2002 B1
D483019 Cook et al. Dec 2003 S
6671177 Han Dec 2003 B1
6778390 Michael Aug 2004 B2
6847525 Smith et al. Jan 2005 B1
D627316 Theisen et al. Nov 2010 S
20080291632 Bremicker et al. Nov 2008 A1
20110051370 Leutwein Mar 2011 A1
20120103589 Sohn et al. May 2012 A1