Patent Application
20060082986
The present invention relates to a memory card including a housing having at least one recess covered by a thinner portion so as to accommodate a chip of regular size on the circuit board.
A conventional memory card 10 used in digital cameras, PDAs, cellular phones or handy computers is shown in
The memory cards has a standard thickness of so that the thickness of the IC chips 12 is limited within a small range and this requires special material and machine to make. A high manufacturing cost is expected and the source for having these IC chips becomes limited. Besides, only 0.2 mm to 0.3 mm of thickness is allowed for the outer housing 13 and the thin outer housing is difficult to be manufactured and suffered by high manufacturing cost.
The present invention intends to provide a housing for a memory card and the housing includes at least one recess defined in an underside thereof and covered by a very thin layer of the material of the housing so that a chip of regular size can be used in the memory card.
The present invention relates to a memory card that comprises a base plate and IC chips are connected on the base plate. A housing is mounted to the base plate and includes at least one recess defined in an underside thereof so as to accommodate at least one of the IC chips therein. The at least one recess is sealed by a top which is in flush with a top surface of the housing.
The primary object of the present invention is to provide a housing of a memory card and the housing includes recesses for receiving chips of regular sizes.
The present invention will become more obvious from the following description when taken in connection with the accompanying drawings which show, for purposes of illustration only, a preferred embodiment in accordance with the present invention.
Referring to
A housing 24 is mounted to the base plate 21 and includes two recesses 240 defined in an underside of the housing 24. The recesses 240 are located corresponding to the flash memory 231 and controller chip 232 of regular sizes. The recesses 240 are sealed by two respective tops 241. The top surface of the top 241 is in flush with the top surface of the housing 24.
By this arrangement, the flash memory 231 and controller chip 232 can be purchased without extra payment for the minimized sizes, so that the cost for the chips can be reduced. The standard thickness of the memory card is 1.4 mm with a plus and minus tolerance of 0.1 mm. Generally, the base plate 21 is 0.3 mm in thickness and the height from the top surface of the base plate 21 to the top surface of the housing 24 is 1.1 mm. The top 241 is less than 0.1 mm so that the thickness of the flash memory 231 and controller chip 232 can be 1.0 mm.
The housing 24 can be made by way of plastic injection so that the number of the recesses 240 can be easily made and the manufacturing cost is affordable.
While we have shown and described the embodiment in accordance with the present invention, it should be clear to those skilled in the art that further embodiments may be made without departing from the scope of the present invention.
