Housing module for an electronic device

Information

  • Patent Grant
  • D957402
  • Patent Number
    D957,402
  • Date Filed
    Friday, November 22, 2019
    5 years ago
  • Date Issued
    Tuesday, July 12, 2022
    2 years ago
  • US Classifications
    Field of Search
    • US
    • D14 125-134
    • D14 137
    • D14 138 R
    • D14 138 AA
    • D14 138 AB
    • D14 138 AC
    • D14 138 AD
    • D14 138 G
    • D14 147
    • D14 2031-2038
    • D14 217
    • D14 218
    • D14 2381
    • D14 247
    • D14 248
    • D14 250
    • D14 257
    • D14 299
    • D14 315-318
    • D14 332
    • D14 336
    • D14 341-347
    • D14 371
    • D14 374-377
    • D14 388
    • D14 389
    • D14 420
    • D14 424
    • D14 426
    • D14 429
    • D14 432
    • D14 489
    • D14 492
    • D14 496
    • D14 425
    • D14 433-453
    • D14 464
    • D14 468
    • D14 469
    • D14 471
    • D14 511
    • D06 300-310
    • D10 50
    • D10 65
    • D10 98
    • D10 1041
    • D16 241
    • D17 24
    • D17 99
    • D18 46
    • D18 6
    • D20 10
    • D20 19
    • D20 39
    • D21 329
    • D21 330
    • D21 517
    • CPC
    • A63H33/3016
    • G06F1/1613
    • G06F1/1641
    • G06F1/1643
    • G06F1/1647
    • G06F1/1626
    • G06F3/04883
    • G06F3/0486
    • G06F3/04847
    • G06F3/04845
    • G06F3/0484
    • G06F3/04817
    • H04B1/3838
    • H04M1/0235
    • H04M1/0237
    • H04M1/0239
    • H04M1/0268
    • H04M1/027
    • H04M1/0295
    • H04M1/02
    • H04M1/0279
    • H04M1/0277
    • H04M1/0266
    • H04M1/0202
    • H04M1/026
    • H04M1/0281
    • H04M1/0283
    • H04N13/045
    • H05K5/0017
    • H05K5/02
    • H05K5/0217
    • H05K5/0004
  • International Classifications
    • 1402
    • Term of Grant
      15Years
Abstract
Description


FIG. 1 is a bottom and front perspective view of a housing module for an electronic device showing the claimed design;



FIG. 2 is a top and rear perspective view thereof;



FIG. 3 is a front elevation view thereof;



FIG. 4 is a rear elevation view thereof;



FIG. 5 is a left side elevation view thereof;



FIG. 6 is a right side elevation view thereof;



FIG. 7 is a top plan view thereof; and,



FIG. 8 is a bottom plan view thereof.


The broken lines in the figures show portions of the housing module for an electronic device that form no part of the claimed design.


Claims
  • The ornamental design for a housing module for an electronic device, as shown and described.
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