Housing module for an electronic device

Information

  • Patent Grant
  • D1049117
  • Patent Number
    D1,049,117
  • Date Filed
    Friday, April 1, 2022
    2 years ago
  • Date Issued
    Tuesday, October 29, 2024
    17 days ago
  • US Classifications
    Field of Search
    • US
    • D14 138 R
    • D14 138 G
    • D14 138 AA
    • D14 138 AB
    • D14 138 AC
    • D14 138 AD
    • D14 138 C
    • D14 248
    • D14 2031
    • D14 2033
    • D14 2034
    • D14 2037
    • D14 439
    • D14 426
    • D14 348
    • D14 341
    • D14 496
    • D10 50
    • D10 1041
    • D20 10
    • D21 329
    • CPC
    • G06F1/1613
    • G06F1/1626
    • G06F1/1692
    • G06F2200/1633
    • H04M1/0283
    • H04M1/0279
    • H04M1/0202
    • H04M1/0266
    • H04M1/027
  • International Classifications
    • 1402
    • Term of Grant
      15Years
      Disclaimer
      This patent is subject to a terminal disclaimer.
Abstract
Description


FIG. 1 is a bottom and front perspective view of a housing module for an electronic device showing the claimed design;



FIG. 2 is a top and rear perspective view thereof;



FIG. 3 is a front elevation view thereof;



FIG. 4 is a rear elevation view thereof;



FIG. 5 is a left side elevation view thereof;



FIG. 6 is a right side elevation view thereof;



FIG. 7 is a top plan view thereof; and,



FIG. 8 is a bottom plan view thereof.


The broken lines in the figures show portions of the housing module for an electronic device that form no part of the claimed design.


Claims
  • The ornamental design for a housing module for an electronic device as shown and described.
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Continuations (1)
Number Date Country
Parent 29714459 Nov 2019 US
Child 29833186 US