This application is based on and claims priority under 35 U.S.C. § 119 to Korean Patent Application Nos. 10-2023-0135395, filed on Oct. 11, 2023, and 10-2023-0186295, filed on Dec. 19, 2023, in the Korean Intellectual Property Office, the disclosures of which are incorporated by reference herein in their entireties.
Embodiments of the inventive concept relate to a hybrid buck converter, and more particularly, to a hybrid buck converter for high-speed transient response and high dynamic efficiency, and an operating method thereof.
High-performance parallel processing technologies, such as artificial intelligence and machine learning, have become common and are spreading to various areas besides image and speech recognition. Due to the nature of having to process a large amount of data at high speed, the use of a processor for high-performance computing is desired, and technical demands to be overcome are emerging. For example, the amount of power required by processors for high-performance computing is constantly increasing. In proportion to increasing power demand, high thermal design power and high heat consumption costs may be incurred, and many resources may be consumed for heat dissipation.
Dynamic voltage scaling technology in which power is varied according to processing throughput to effectively control power utilization may be used in high-performance computing processors, and to achieve higher efficiency, it may be necessary to improve the tracking speed of dynamic voltage scaling. A hybrid buck converter that adds a shunt regulator in parallel to the buck converter has been proposed to increase the tracking speed of dynamic voltage scaling.
However, compared to a buck converter that has an ideal power conversion efficiency of 100%, efficiency of the proposed hybrid buck converter exponentially decreases due to the frequent operation of the shunt regulator that causes power loss. Therefore, it may be necessary to reduce such efficiency reduction in hybrid buck converters that support dynamic voltage scaling.
The inventive concept provides a hybrid buck converter with high dynamic efficiency while maintaining a high-speed transient response, a method of operating the hybrid buck converter.
According to an aspect of the inventive concept, there is provided a hybrid buck converter including a buck converter including a first P-channel metal oxide semiconductor (PMOS) transistor and a second PMOS transistor electrically connecting a power supply voltage node with a first switching node, a first N-channel metal oxide semiconductor (NMOS) transistor and a second NMOS transistor electrically connecting a ground node with the first switching node, and an inductor electrically connecting the first switching node with a second switching node, a third NMOS transistor electrically connecting the second switching node with a first output node, a third PMOS transistor electrically connecting the second switching node with a second output node, a shunt regulator that is driven based on a second output voltage corresponding to the second output node, a first pulse width modulation (PWM) controller that adjusts the magnitude of an inductor current passing through the inductor based on a pulse width control of the first PMOS transistor and the first NMOS transistor, and a second PWM controller that adjusts the magnitude of the second output voltage based on a pulse width control of the first PMOS transistor and the first NMOS transistor.
According to another aspect of the inventive concept, there is provided an operation method of a hybrid buck converter, the operation method including determining whether an inductor current passing through an inductor of the buck converter is N times a shunt current output from the shunt regulator, performing a pulse width control between an high-side switching element and a low-side switching element of the buck converter according to the determining, performing a pulse width control between a third NMOS transistor and a third PMOS transistor based on the comparison result of a second output voltage and a second reference voltage, wherein the high-side switching element may electrically connect a power supply voltage with a first switching node corresponding to a first end of the inductor, the low-side switching element may electrically connect a ground node with the first switching node, the third PMOS transistor may electrically connect a second output node corresponding to the second output voltage with a second switching node corresponding to a second end of the inductor, and the third NMOS transistor may electrically connect the second switching node with a first output node corresponding to a first output voltage.
Embodiments of the inventive concept will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings in which:
Hereinafter, embodiments of the inventive concept will be described in detail with reference to the accompanying drawings. The same reference numerals are used for the same components in the drawings, and duplicate descriptions thereof are omitted. As used herein, the term “and/or” includes any and all combinations of one or more of the associated listed items. It is noted that aspects described with respect to one embodiment may be incorporated in different embodiments although not specifically described relative thereto. That is, all embodiments and/or features of any embodiments can be combined in any way and/or combination. In the present specification, although terms such as first and second are used to describe various elements or components, it goes without saying that these elements or components are not limited by these terms. These terms are only used to distinguish a single element or component from other elements or components.
Referring to
In various embodiments, the electronic device 100 may include various electronic devices portable by a user. For example, the electronic device 100 may be a mobile device, such as a smartphone, a tablet personal computer PC, a mobile phone, a personal digital assistant (PDA), a laptop, a wearable device, a global positional system (GPS) device, an e-book terminal, a digital broadcast terminal, an MP3 player, a digital camera, or the like. For another example, the electronic device 100 may be an electric vehicle.
According to an embodiment, the electronic device 100 may include a power management integrated circuit (PMIC) 101. The PMIC 101 may be implemented as an integrated circuit chip and may be mounted on a printed circuit board (PCB). The PMIC 101 may charge the battery 103 by receiving power from the external power source 110 and transmitting the received power to the battery 103, and may transmit power to a system load 102 to control the electronic device 100 to perform various functions. A detailed configuration of the PMIC 101 will be described below in
In addition, the electronic device 100 may include the battery 103. The battery 103 may include at least one battery cell. For example, the battery 103 may correspond to a multi-cell battery including a plurality of battery cells electrically connected in series to each other. As another example, the battery 103 may correspond to a single cell battery including one battery cell. The battery 103 may receive power through the PMIC 101 when the electronic device 100 is electrically connected to the external power source 110. The battery 103 may provide power to the system load 102 to control the electronic device 100 to perform various functions when the electronic device 100 is not connected to the external power source 110.
In addition, the electronic device 100 may include the system load 102. Although not shown, the system load 102 may include components other than the PMIC 101 and the battery 103 in the electronic device 100. For example, the system load 102 may include a display, an application processor, a communication processor, a speaker, a memory, and the like. That is, the system load 102 may refer to chips, modules, operation blocks, function blocks, and intellectual property (IP) blocks included in the electronic device 100. The system load 102 may receive power from the external power source 110 or the battery 103 and provide various functions to users. For example, a monitor of the system load 102 may provide visual recognition to the user by displaying an object through the display, the communication processor may transmit and receive data by exchanging wireless signals with external devices, and the application processor may perform various operations.
In addition, the electronic device 100 may include a receptacle interface 104. The receptacle interface 104 may electrically connect the electronic device 100 with the external power source 110 through a universal serial bus (USB) cable. In an embodiment, the receptacle interface 104 may correspond to a USB type-C interface, and the USB cable may correspond to a USB type-C cable. The USB Type-C interface may be implemented based on the definition of USB 2.0, USB 3.1, or USB 3.2. The receptacle interface 104 may include a plurality of pins. The plurality of pins may include a pin for power supply, a pin for data transmission, and a configuration channel (CC) pin.
The external power source 110 may supply power to the electronic device 100. According to various embodiments, the external power source 110 may include a travel adaptor (TA) 111 and a wireless charger 111. Instead of supplying power through a wire, the wireless charger 112 may wirelessly transmit power through air to charge the electronic device 100. According to various embodiments, the wireless charger 112 may transmit power based on various wireless charging methods such as a magnetic induction method, a magnetic resonance method, and an electromagnetic induction method, and a non-radioactive wireless charging method (WiTricity).
The TA 111 may supply power through a wire connected to the PMIC 101 of the electronic device 100. The TA 111 may convert power supplied from alternating-current (AC) 110V to 220V, which may be a household power source, or other power supply devices (e.g., a computer) into direct-current (DC) power required for charging the battery 103 and provide the converted DC power to the electronic device 100. According to various embodiments, the receptacle interface 104 may be electrically connected to an output terminal of an auxiliary battery.
A PMIC 200 of
The ICL 210 may adjust the magnitude of the input current. For example, when the system load 102 also operates at the same time as the battery 103 is charged, the magnitude of the input current input to the PMIC 200 may correspond to a sum of a charging current for charging the battery and a load current transmitted to the system load 102. When the magnitude of the input current increases, the overload of the PMIC 101 may increase the risk of a fire. Therefore, the ICL 210 may control the magnitude of the input current not to exceed a predetermined magnitude. Although not shown, the ICL 210 may include an internal transistor resistance. When the magnitude of the input current exceeds a predetermined magnitude, the magnitude of the internal transistor resistance may be increased according to a control signal received from the control circuit 220. Because the magnitude of the external power voltage is constant, the magnitude of the input current may be reduced by increasing the magnitude of the internal transistor resistance.
The control circuit 220 may control the overall operation of the PMIC 200. The control circuit 220 may communicate with the TA 111 through the receptacle interface 104. For example, the control circuit 220 may control the output voltage and output current of the TA 111 by transmitting control information to the TA 111.
The switching charger 240 includes a buck converter, and may step down an input voltage, and adjust a charging current by adjusting a cycle of the buck converter. Because the switching charger 240 includes an inductor, it may not be possible to remove a switching loss and a conduction loss caused by the resistance component of the inductor itself. Accordingly, the charging efficiency of the switching charger 240 may be lower than that of the direct charger 230.
The direct charger 230 may directly transmit an input voltage to the battery 103 via a cap divider. Because the direct charger 230 includes only a transistor and a capacitor, the switching loss and the conduction loss due to the resistance component of the inductor itself may be saved. Because the input voltage may be directly transmitted to the node of the battery 103 through the cap divider, the direct charger 230 may be suitable for a high-efficiency charging system.
The fuel gauge 260 may sense a state of the battery 103. For example, the fuel gauge 260 may sense a state of charge (SoC), a charge voltage, a charge current, and a battery temperature of the battery 103. The SoC is a ratio of the current capacity to the maximum capacity of the battery 103, and may be defined in units of a percentage (%).
Although not shown, the fuel gauge 260 may include an analog-to-digital converter (ADC). The fuel gauge 260 may digitally convert analog information of sensed voltage, current, and temperature through the ADC and transmit the digital information to the direct charger 230, the switching charger 240, and/or the system load 102. The fuel gauge 260 may be implemented as part of an integrated circuit chip and may be mounted on a printed circuit board. However, embodiments are not limited thereto, and the fuel gauge 260 and the PMIC 200 may be implemented as different integrated circuits or integrated circuit chips.
The power meter 250 may obtain information on an input/output voltage and current. The power meter 250 may sense the magnitude of the voltage and current input to the PMIC 200, and the magnitude of the voltage and current transmitted to the system load 102.
Although not shown, the power meter 250 includes an ADC, and may digitally convert information on the sensed voltage, current, and power using the ADC and transmit the digital information to the direct charger 230, the switching charger 240, and/or the system load 102. The power meter 250 may be implemented as part of an integrated circuit chip and may be mounted on a printed circuit board. However, embodiments are not limited thereto, and the power meter 250 and the PMIC 200 may be implemented as different integrated circuits or integrated circuit chips.
Although not shown, the PMIC 200 may further include a circuit or block that supports at least one of various functions such as an under-voltage lockout (UVLO) function, an over-current protection (OCP) function, an over-voltage protection (OVP) function, a soft-start function that reduces rush current, a foldback current limit function, a Hiccup Mode function for short-circuit protection, an over-temperature protection (OTP) function, etc., to operate properly even under power savings conditions.
According to an embodiment, the switching charger 240 may include a DC-DC converter. For example, the DC-DC converter may correspond to a hybrid buck converter. The hybrid buck converter is a type of heterogeneous-parallel converter, and may refer to, for example, a DC-DC converter in which different buck converters and shunt regulators are connected in parallel. Hereinafter, a hybrid buck converter according to a comparative example and a hybrid buck converter according to embodiments of the inventive concept will be described.
Referring to
The buck converter 310 may include a PMOS transistor MP, an NMOS transistor MN, an inductor L, and a capacitor COUT. The PMOS transistor MP and the NMOS transistor MN may be alternately turned on. For example, if the load current ILOAD input to the system load 102 needs to be increased, the PMOS transistor MP and the NMOS transistor MN may be alternately turned on such that the time for the PMOS transistor MP to be turned on increases and the time for the NMOS transistor MN to be turned on decreases. For another example, if the load current ILOAD input to the system load 102 needs to be decreased, the PMOS transistor MP and the NMOS transistor MN may be alternately turned on such that the time for the PMOS transistor MP to be turned on decreases and the time for the NMOS transistor MN to be turned on increases.
The shunt regulator 320 may include a PMOS transistor MPH and an NMOS transistor MNH. The shunt regulator 320 may control the PMOS transistor MPH and the NMOS transistor MNH for a high-speed transient response. For example, if the load current ILOAD input to the system load 102 needs to be increased, the shunt regulator 320 may control the PMOS transistor MPH to be turned on to add the charge current ICH to the transient load current ILOAD so that the load current ILOAD quickly enters a steady state. For another example, if the load current ILOAD input to the system load 102 needs to be decreased, the shunt regulator 320 may control the NMOS transistor MNH to be turned on to subtract the discharge current IDCH from the transient load current ILOAD so that the load current ILOAD quickly enters a steady state.
Referring to
Referring to
According to an embodiment, a first NMOS transistor MN1 and a second NMOS transistor MN2 of the hybrid buck converter 400 may be referred to as a low-side switching element. A first PMOS transistor MP1 and a second PMOS transistor MP2 of the hybrid buck converter 400 may be referred to as a high-side switching element.
According to an embodiment, the hybrid buck converter 400 may further include the third NMOS transistor MN3, the third PMOS transistor MP3, and the coupling capacitor CC of the second output capacitor COUT2. The third NMOS transistor MN3 may be electrically connected between the second switching node LX2 and the first output node OUT1. The third PMOS transistor MP3 may be electrically connected between the second switching node LX2 and the second output node OUT2. According to an embodiment, the third NMOS transistor MN3 and the third PMOS transistor MP3 may be alternately turned on. As the third NMOS transistor MN3 and the third PMOS transistor MP3 are alternately turned on, the voltage level of the second output node OUT2 may be controlled. A voltage of the second output node OUT2 may correspond to the second output voltage VOUT2. The second output node OUT2 may be a node for driving the shunt regulator 420. That is, the shunt regulator 420 may be driven based on the second output voltage VOUT2. The coupling capacitor CC is a capacitor for coupling between the first output node OUT1 and the second output node OUT2. The coupling capacitor CC may correspond to an electrical path through which an AC current between the first output voltage VOUT1 of the first output node OUT1 and the second output voltage VOUT2 of the second output node OUT2 passes. That is, the first output voltage VOUT1 and the second output voltage VOUT2 may be regulated based on the duty cycles of the third PMOS transistor MP3 and the third NMOS transistor MN3, the first output capacitor COUT1, the second output capacitor COUT2, and the coupling capacitor CC.
According to an embodiment, the hybrid buck converter 400 may further include a fourth NMOS transistor MN4 and a third output capacitor COUT3. The fourth NMOS transistor MN4 may electrically connect the first switching node VX1 with the third output node OUT3. The fourth NMOS transistor MN4 may be turned on or off based on the voltage level of the third output capacitor COUT3. For example, when the third output capacitor COUT3 is charged and the voltage level of the third output node OUT3 exceeds a first threshold value, the fourth NMOS transistor MN4 may be turned on. When the fourth NMOS transistor MN4 is turned on, the inductor current IIND may be generated using the charge stored in the third output capacitor COUT3. That is, the fourth NMOS transistor MN4 may store the discharged current through the third output capacitor COUT3, and when the charge stored in the third output capacitor COUT3 exceeds a predetermined reference, the fourth NMOS transistor MN4 may be turned on to reuse the stored charge as the inductor current IIND. A detailed description thereof will be described below with reference to
According to an embodiment, the shunt regulator 420 may include a coarse regulator 421 and a fine regulator 423. The coarse regulator 421 may include a coarse PMOS transistor MCP connecting the second output node OUT2 with the first output node OUT1 and a coarse NMOS transistor MCN connecting the first output node OUT1 with the third output node OUT3. The coarse PMOS transistor MCP may adjust the magnitude of the charge current for regulating the voltage level of the first output node OUT1. For example, the coarse PMOS transistor MCP may include 32 PMOS transistors. The coarse PMOS transistor MCP may control the magnitude of the shunt current ISHUNT input to the first output node OUT1 based on the turn-on or turn-off of the 32 PMOS transistors. For example, as the number of turned-on transistors among the 32 PMOS transistors increases, the charge current input to the first output node OUT1 increases, thereby increasing the magnitude of the shunt current ISHUNT.
The coarse NMOS transistor MCN may adjust the magnitude of the discharge current for regulating the voltage level of the first output node OUT1. For example, the coarse NMOS transistor MCN may include 32 NMOS transistors. The coarse NMOS transistor MCN may control the magnitude of the shunt current ISHUNT input to the first output node OUT1 based on the turn-on or turn-off of the 32 NMOS transistors. For example, as the number of turned-on transistors among the 32 NMOS transistors increases, the discharge current discharged from the first output node OUT1 to the third output node OUT3 increases, and the magnitude of the shunt current ISHUNT may decrease.
The fine regulator 423 may include a fine PMOS transistor MFP connecting the second output node OUT2 with the first output node OUT1. The fine PMOS transistor MFP may adjust the magnitude of the charge current for regulating the voltage level of the first output node OUT1. For example, the fine PMOS transistor MFP may include 128 PMOS transistors. The fine PMOS transistor MFP may control the magnitude of the shunt current ISHUNT input to the first output node OUT1 based on the turn-on or turn-off of the 128 PMOS transistors. For example, as the number of turned-on transistors among the 128 PMOS transistors increases, the charge current input to the first output node OUT1 increases, thereby increasing the magnitude of the shunt current ISHUNT. Since the fine PMOS transistor MFP includes more transistors than the coarse PMOS transistor MCP, the charge current may be adjusted more finely or with more precision.
In the embodiment described above, each of the coarse PMOS transistor MCP and the coarse NMOS transistor MCN includes 32 power MOSFETs, and the fine PMOS transistor MFP includes 128 power MOSFETs, but embodiments are not limited thereto. According to various embodiments, the number of power MOSFETs included in the coarse PMOS transistor MCP, the coarse NMOS transistor MCN, and the fine PMOS transistor MFP may be variably set. In some embodiments, however, the number of power MOSFETs in the fine PMOS transistor MFP may be greater than the number of power MOSFETs in the coarse PMOS transistor MCP.
Referring to
According to an embodiment, the push-pull controller 510 may control turn-on or turn-off of the shunt regulator 420. The push-pull controller 510 may be referred to in various terms, such as a shunt controller, a transient controller, and the like. The push-pull controller 510 may receive the first output voltage VOUT1 that is a voltage of the first output node OUT1. The push-pull controller 510 may receive the voltage value of the first output voltage VOUT1 from the power meter 250 of the PMIC 200 (of
According to an embodiment, the push-pull controller 510 may not generate the control signal PG_32 or NG_32 of the coarse regulator 421. For example, the hybrid buck converter 500 may be in a steady state. The steady state may refer to a state in which the first output node OUT1 and the load current ILOAD are not significantly changed and are stable as the first output voltage VOUT1 becomes close to the first reference voltage VREF1. When the hybrid buck converter 500 is in a steady state, it is not necessary to rapidly reduce or increase the shunt current ISHUNT by driving the coarse regulator 421, and thus, the push-pull controller 510 may not generate a control signal PG_32 or NG_32 for driving the coarse regulator 421. However, even in the steady state, the hybrid buck converter 500 may generate the control signal PG_128 of the fine regulator 423 for the first output voltage VOUT1 to successfully track the first reference voltage VREF1.
According to an embodiment, the push-pull controller 510 may generate both the control signal PG_32 or NG_32 of the coarse regulator 421 and the control signal PG_128 of the fine regulator 423. For example, the hybrid buck converter 500 may be in a transient state. The transient state may refer to a state in which the first output voltage VOUT1 is spaced apart from the first reference voltage VREF1. That is, the transient state may correspond to a case where the difference between the first output voltage VOUT1 and the first reference voltage VREF1 is large or increased. For example, the control circuit 220 may change the first reference voltage VREF1 by determining dynamic voltage scaling. In this case, it may be necessary to change the shunt current ISHUNT so that the first output voltage VOUT1 and the load current ILOAD may quickly enter a steady state. The push-pull controller 510 may compare the first reference voltage VREF1 with the first output voltage VOUT1, and generate a control signal PG_32 or NG_32 for driving the coarse regulator 421 based on the comparison result. However, even in this case, the control signal PG_128 for the fine regulator 423 may be generated. For example, the control signal PG_128 may be generated together with the control signal PG_32 or NG_32 for the coarse regulator 421. For example, the first reference voltage VREF1 may be increased by the control circuit 220. The push-pull controller 510 may increase the magnitude of the shunt current ISHUNT to boost the first output voltage VOUT1 according to the first reference voltage VREF1. To this end, the push-pull controller 510 may increase the number of PMOS transistors turned on among 32 PMOS transistors included in the coarse PMOS transistor MCP. For another example, the first reference voltage VREF1 may be lowered by the control circuit 220. The push-pull controller 510 may reduce the magnitude of the shunt current ISHUNT to reduce the first output voltage VOUT1 according to the first reference voltage VREF1. To this end, the push-pull controller 510 may increase the number of NMOS transistors turned on among 32 NMOS transistors included in the coarse NMOS transistor MCN.
Referring to
In operation S520, the hybrid buck converter 500 may determine whether the first output voltage VOUT1 is in a steady state. For example, when the difference between the first output voltage VOUT1 and the first reference voltage VREF1 is less than or equal to a threshold value, the push-pull controller 510 of the hybrid buck converter 500 may be determined to be in a steady state. For another example, in response to receiving a control signal for changing the first reference voltage VREF1 based on dynamic voltage scaling from the control circuit 220, the push-pull controller 510 of the hybrid buck converter 500 may determine a transient state rather than a steady state.
In operation S530, the hybrid buck converter 500 may control the shunt current ISHUNT by adjusting the fine regulator 423 and the coarse regulator 421 together. In operation S520, the push-pull controller 510 may determine that the hybrid buck converter 500 is currently in a transient state. The push-pull controller 510 may increase or decrease the shunt current ISHUNT so that the first output voltage VOUT1 converges to the first reference voltage VREF1 as quickly as possible. For example, when the first output voltage VOUT1 is greater than the first reference voltage VREF1, the control signal NG_32 for driving the coarse NMOS transistor MCN may be generated to lower the first output voltage VOUT1. For another example, when the first output voltage VOUT1 is lower than the first reference voltage VREF1, the control signal PG_32 for driving the coarse PMOS transistor MPN and the control signal PG_128 for driving the fine PMOS transistor MFP may be generated to increase the first output voltage VOUT1.
In operation S540, the hybrid buck converter 500 may control the shunt current ISHUNT by adjusting only the fine regulator 423. In operation S520, the push-pull controller 510 may determine that the hybrid buck converter 500 is currently in a steady state. Since the first output voltage VOUT1 is already in a steady state, the push-pull controller 510 does not need to rapidly increase or decrease the shunt current ISHUNT. Therefore, the push-pull controller 510 generates only the control signal PG_128 for driving the fine PMOS transistor MFP to control the shunt current ISHUNT, so that the first output voltage VOUT1 may successfully track the first reference voltage VREF1.
Referring to
According to an embodiment, the GM cell 601 may correspond to an operational amplifier. The GM cell 601 may receive differential input voltages and output a first regulation voltage VC1. The first PWM controller 610 may control the duty cycle based on the first regulation voltage VC1. One of the differential input voltages may correspond to the shunt voltage VSHUNT. The shunt voltage VSHUNT may be a value obtained by sensing the shunt current ISHUNT and converting the shunt current into a voltage. The other of the differential input voltages may correspond to the inductor voltage VIND. The inductor voltage VIND may be a value obtained by sensing the inductor current IIND and converting the inductor current IIND into a voltage. According to an embodiment, a ratio for converting the inductor current IIND into a voltage and a ratio for converting the shunt current ISHUNT into a voltage may be different. According to an embodiment, the inductor current IIND may be converted into the inductor voltage VIND based on a ratio of 1:1. The shunt current ISHUNT may be converted into a shunt voltage VSHUNT based on a ratio of 1:#. That is, the inductor current IIND and the shunt current ISHUNT may be regulated to satisfy the following Equation 1.
The hybrid buck converter 600 may regulate the magnitude of the inductor current IIND to be β times the magnitude of the shunt current ISHUNT, thereby reducing the magnitude of power loss generated by the shunt regulator 420. Power loss PL generated by the shunt regulator 420 is as the following Equation 2.
That is, the hybrid buck converter 600 processes most of the load current ILOAD (for example,
at the inductor current IIND, and processes only a small part of the load current ILOAD (for example,
to the shunt current ISHUNT to reduce the magnitude of the shunt current ISHUNT, thereby reducing power loss. For example, the value of may be 100, but is not limited thereto. Depending on the operation environment, the value of may be less than 100 or may be set to be greater than 100. The value of f may vary according to the user's setting of the electronic device 100 of
According to an embodiment, the compensation network 603 may determine a response speed of the alternating-current (AC) component of the first regulation output VC1. The compensation network 603 may include a first compensation capacitor CP1, a second compensation capacitor CP2, and a first compensation resistor RP1.
The comparator 605 may compare input signals with each other to generate an output signal indicating a comparison result. The comparator 605 may receive differential inputs. One of the differential inputs may be an AC waveform. For example, the AC waveform may be a sawtooth waveform, but is not limited thereto. According to various embodiments, the AC waveform may further include triangular waveform, square waveform, or the like. According to an embodiment, the comparator 605 may compare the first regulation voltage VC1 with the magnitude of the voltage VSAW1 of the AC waveform and provide a comparison result to the first PWM controller 610.
According to an embodiment, the first PWM controller 610 may control a duty cycle between the first PMOS transistor MP1 and the first NMOS transistor MN1. For example, the first PWM controller 610 may increase the turn-on time of the first PMOS transistor MP1 when the inductor current IIND is less than β times the shunt current ISHUNT. That is, the first PWM controller 610 may increase the time for the first PMOS transistor MP1 to be turned on within one cycle in which the first NMOS transistor MN1 and the first PMOS transistor MP1 are alternately turned on to increase the magnitude of the inductor current IIND. For another example, the first PWM controller 610 may reduce the turn-on time of the first PMOS transistor MP1 when the inductor current IIND is greater than β times the shunt current ISHUNT. That is, the first PWM controller 610 may reduce the time for the first PMOS transistor MP1 to be turned on within one cycle in which the first NMOS transistor MN1 and the first PMOS transistor MP1 are alternately turned on to reduce the magnitude of the inductor current IIND.
Referring to
In operation S620, the GM cell 601 of the hybrid buck converter 600 may generate the first regulation voltage VC1 based on the shunt voltage VSHUNT and the inductor voltage VIND. For example, the GM cell 601 of the hybrid buck converter 600 may receive, as inputs, the shunt voltage VSHUNT and the inductor voltage VIND obtained in operation S610 and output the first regulation voltage VC1.
In operation S630, the hybrid buck converter 600 may control a pulse width ratio of the first PMOS transistor MP1 and the first NMOS transistor MN1 based on a comparison between the first regulation voltage VC1 and the AC waveform voltage VSAW1. For example, when the first regulation voltage VC1 exceeds the intermediate value of the AC waveform voltage VSAW1 (e.g., when the inductor current IIND is greater than β times the shunt current ISHUNT), the first PWM controller 610 may control the pulse width ratio so that the turn-on time of the first PMOS transistor MP1 is reduced. For another example, when the first regulation voltage VC1 is less than the intermediate value of the AC waveform voltage VSAW1 (e.g., when the inductor current IIND is less than β times the shunt current ISHUNT), the first PWM controller 610 may control the pulse width ratio so that the turn-on time of the first PMOS transistor MP1 is increased.
Referring to
According to an embodiment, the GM cell 701 may correspond to an operational amplifier. The GM cell 701 may receive differential input voltages and output a second regulation voltage VC2. The second PWM controller 710 may control duty cycles of the third PMOS transistor MP3 and the third NMOS transistor MN3 based on the second regulation voltage VC2. One of the differential inputs may correspond to the second output voltage VOUT2. The second output voltage VOUT2 may be a value obtained by sensing a voltage of the second output node OUT2. The other one of the differential inputs may be the second reference voltage VREF2. The second reference voltage VREF2 may be a voltage that is a reference for controlling the voltage level of the second output voltage VOUT2. The second reference voltage VREF2 may be varied by the control circuit 220 of
According to an embodiment, the compensation network 703 may determine a response speed of the AC component of the second regulation output VC2. The compensation network 703 may include a third compensation capacitor CP3.
The comparator 705 may compare input signals with each other to generate an output signal indicating a comparison result. The comparator 705 may receive differential inputs. One of the differential inputs may be an AC waveform. For example, the AC waveform may be a sawtooth waveform, but is not limited thereto. According to various embodiments, the AC waveform may further include triangular waveform, square waveform, or the like. According to an embodiment, the comparator 705 may compare the second regulation voltage VC2 with the magnitude of the voltage VSAW2 of the AC waveform and provide a comparison result to the second PWM controller 710.
According to an embodiment, the second PWM controller 710 may control a duty cycle between the third PMOS transistor MP3 and the third NMOS transistor MN3. For example, the second PWM controller 710 may increase the turn-on time of the third PMOS transistor MP3 when the second regulation voltage VC2 is less than the voltage VSAW2 of the AC waveform. That is, the second PWM controller 710 may increase the turn-on time of the third PMOS transistor MP3 within one cycle in which the third NMOS transistor MN3 and the third PMOS transistor MP3 are alternately turned on to increase the voltage level of the second output voltage VOUT2. For another example, the second PWM controller 710 may reduce the turn-on time of the third PMOS transistor MP3 when the second regulation voltage VC2 is greater than the voltage VSAW2 of the AC waveform. That is, the second PWM controller 710 may reduce the turn-on time of the third PMOS transistor MP3 within one cycle in which the third NMOS transistor MN3 and the third PMOS transistor MP3 are alternately turned on to reduce the voltage level of the second output voltage VOUT2.
Referring to
In operation S720, the GM cell 701 of the hybrid buck converter 700 may generate the second regulation voltage VC2 based on the second output voltage VOUT2 and the second reference voltage VREF2. For example, the GM cell 701 of the hybrid buck converter 700 may output the second regulation voltage VC2 based on the second output voltage VOUT2 and the second reference voltage VREF2 received in operation S710. The second reference voltage VREF2 may be a reference voltage for controlling whether to set the voltage level of the second output voltage VOUT2 to be close to the power voltage VDD or to be close to the first output node VOUT1.
In operation S730, the hybrid buck converter 700 may control a pulse width ratio of the third PMOS transistor MP3 and the third NMOS transistor MN3 based on a comparison between the second regulation voltage VC2 and the AC waveform voltage VSAW2. For example, when the second regulation voltage VC2 is greater than the voltage VSAW2 of the AC waveform, the second PWM controller 710 may control the pulse width ratio to reduce the turn-on time of the third PMOS transistor MP3. Accordingly, the second regulation voltage VC2 may gradually decrease to converge to the intermediate value of the voltage VSAW2 of the AC waveform. For another example, when the second regulation voltage VC2 is less than the voltage VSAW2 of the AC waveform, the second PWM controller 710 may control the pulse width ratio to increase the turn-on time of the third PMOS transistor MP3. Accordingly, the second regulation voltage VC2 may gradually increase to converge to the intermediate value of the voltage VSAW2 of the AC waveform.
Referring to
Referring to
Here, it may be seen that since the second output voltage VOUT2 is less than the power voltage VDD, the magnitude of the voltage drop is reduced, and accordingly, the magnitude of power loss is also reduced. That is, the hybrid buck converter 700 may reduce power loss by changing the voltage for driving the shunt regulator 420 from the power voltage VDD to the second output voltage VOUT2.
Referring to
According to an embodiment, the control circuit 220 of the PMIC 200 of
According to embodiments, the control circuit 220 of the PMIC 200 may generate a third control signal at a third time T3. The third control signal may be a signal instructing to set the magnitude of the second reference voltage VREF2 to the third voltage V3. The magnitude of the third voltage V3 may be less than that of the first voltage V1 and the second voltage V2. That is, the third control signal may be a signal for setting the voltage level of the second output voltage VOUT2 of the second output node OUT2 to be low (e.g., very close to the first output voltage VOUT1). The control circuit 220 may identify whether dynamic voltage scaling hardly occurs after the second time T2. For example, when the number of occurrences of dynamic voltage scaling during a predetermined period is less than the first value, the control circuit 220 may generate the third control signal to change the voltage level of the second output voltage VOUT2 to approximate the first output voltage VOUT1. When dynamic voltage scaling hardly occurs, the number of times that the shunt regulation 420 is driven may also decrease. When the second output voltage VOUT2 is set to be high (e.g., a value similar to the power supply voltage VDD), the magnitude of power loss generated by the shunt regulator 420 may increase. Therefore, to increase power efficiency by reducing power loss generated by the shunt regulator 420, the control circuit 220 may set the second output voltage VOUT2 to be low in an environment where dynamic voltage scaling rarely occurs.
Referring to
According to an embodiment, the hysteresis controller 810 may control turn-on or turn-off of the fourth NMOS transistor MN4. For example, the hysteresis controller 810 may receive a third reference voltage VREF3 and a third output voltage VOUT3. The hysteresis controller 810 may turn on or off the fourth NMOS transistor MN4 in response to the third output voltage VOUT3 being out of a predetermined range from the third reference voltage VREF3.
Referring to
Referring to
According to various embodiments, the hysteresis controller 810 may variably set the optimal window voltage VWINDOW for reusing the charge stored in the third output capacitor COUT3 based on the turn-on or turn-off control history of the fourth NMOS transistor MN4.
Referring to
In operation S820, the hybrid buck converter 600 may control the first NMOS transistor MN1 and the fourth NMOS transistor MN4 based on the third output voltage VOUT3, the third reference voltage VREF3 and the window voltage VWINDOW. For example, the hysteresis controller 810 may turn on the fourth NMOS transistor MN4 and turn off the first NMOS transistor MN1 when the third output voltage VOUT3 exceeds a value obtained by adding the window voltage VWINDOW to the third reference voltage VREF3. For another example, the hysteresis controller 810 may turn off the fourth NMOS transistor MN4 and turn on the first NMOS transistor MN1 when the third output voltage VOUT3 is less than a value obtained by subtracting the window voltage VWINDOW from the third reference voltage VREF3.
According to the embodiments described above, the push-pull controller 510 for controlling the shunt regulator 420 is shown in
Referring to
A second graph on the right side shows how much the efficiency loss is improved according to the frequency of dynamic voltage scaling. For example, when the frequency of dynamic voltage scaling is 10 KHz, it may be confirmed that the efficiency loss is about 3% in the case of the hybrid buck converter according to the comparative example. However, in the case of the hybrid buck converter according to an embodiment, it may be confirmed that the efficiency loss is reduced to about 0.7%. This decrease in the efficiency loss may be based on driving the shunt regulator to the second output voltage VOUT2 regulated from the first output voltage VOUT1 without driving the shunt regulator based on the power voltage VDD, thereby reducing the magnitude of the voltage drop that causes power loss, reducing the magnitude of the current based on the shunt regulator by always maintaining the inductor current IIND to be β times the shunt current ISHUNT, storing the discharge current discharged from the shunt regulator in the third capacitor COUT3 and reusing the stored charge to generate the inductor current IIND.
While embodiments of the inventive concept have been particularly shown and described with reference to embodiments thereof, it will be understood that various changes in form and details may be made therein without departing from the spirit and scope of the following claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 10-2023-0135395 | Oct 2023 | KR | national |
| 10-2023-0186295 | Dec 2023 | KR | national |