Patent Application
20080011510
a and 4b are a perspective view and a close-up view of a metal tab used in one embodiment of a hybrid plastic-metal faceplate according to the present invention.
The present invention is more particularly described in the following description and examples that are intended to be illustrative only since numerous modifications and variations therein will be apparent to those skilled in the art. As used in the specification and in the claims, the singular form “a,” “an,” and “the” may include plural referents unless the context clearly dictates otherwise. Also, as used in the specification and in the claims, the term “comprising” may include the embodiments “consisting of” and “consisting essentially of.” Furthermore, all ranges disclosed herein are inclusive of the endpoints and are independently combinable.
As used herein, approximating language may be applied to modify any quantitative representation that may vary without resulting in a change in the basic function to which it is related. Accordingly, a value modified by a term or terms, such as “about” and “substantially,” may not be limited to the precise value specified, in some cases. In at least some instances, the approximating language may correspond to the precision of an instrument for measuring the value.
The present invention provides a new and useful faceplate. The faceplate may be used in a variety of different applications, such as electric circuit card rack systems, to reduce EMI (electromagnetic interference) emissions from the electric circuit card system. The faceplate provides EMI shielding effectiveness using a hybrid plastic-metal construction. Since prior art systems generally include a metal (e.g. aluminum) front plate, a second metal (e.g. beryllium-copper) as a shielding strip, two die-casting end fixtures, two latch units, two hinge pins and screws, the prior art systems have a significant number of pieces and are constructed from materials that are expensive to form into a faceplate. However, since the present invention uses a hybrid plastic-metal construction, the present invention eliminates several of the separate pieces making the faceplates of the present invention simpler in their design and manufacture. In addition, the replacement of plastic reduces the costs associated with making the faceplates. Nevertheless, the faceplates of the present invention still provide an EMI shielding effectiveness of 20 dB or greater across the range of frequencies of 0 Hz to 1.0 GHz.
In one embodiment, the faceplates of the present invention include a front plate constructed from an electrically conductive thermoplastic composition, a first metal element in electrical contact with the front plate for enhancing EMI shielding, and a second metal element in electrical contact with the electrically conductive thermoplastic composition and the first metal element for further enhancing EMI shielding to shield any gap between two conjunctive faceplates. By using an electrically conductive thermoplastic composition for the front plate rather than a metal front plate, the front plate can be formed with die-casting end fixtures integrated into the front plate, thereby reducing the expense and number of process steps needed to form the front plate and, therefore, the faceplate.
Accordingly, in one aspect, the present invention utilizes a front plate constructed using an electrically conductive thermoplastic composition. By using a thermoplastic material, the front plate may be formed such that additional components of the front plate (e.g. the die-casting end fixtures) are integrated into the front plate in a single step when the front plate is formed.
In addition, since the electrically conductive thermoplastic composition includes electrically conducting materials, these electrically conducting materials cause the electrically conductive thermoplastic composition to provide some degree of EMI shielding as compared to thermoplastic compositions that do not have electrically conducting materials since thermoplastics generally have little or no EMI shielding effectiveness. But, adding electrically conducting materials to the thermoplastic composition results in an electrically conductive thermoplastic composition that will have some EMI shielding effectiveness.
Lastly, by using an electrically conductive thermoplastic composition, one or more metal elements may be integrated with the electrically conductive thermoplastic composition and they may be in electrically conducting contact with each other and/or the front plate due to the electrically conducting materials contained within the electrically conductive thermoplastic composition.
Accordingly, by using an electrically conductive thermoplastic composition as the front plate, a first metal element can be integrated with the front plate in a manner that causes the first metal element to be in electrically conducting contact with the front plate thereby permitting the first metal element to enhance the EMI shielding of the faceplate. The first metal element, due to the structure of the front plate and/or the manner in which it is integrated with the front plate, is in electrically conducting contact with the front plate through contact of the first metal element with one or more electrically conducting materials (e.g. metal fibers) in the electrically conductive thermoplastic composition.
In addition, a second metal element can be integrated with the front plate in a manner that causes the second metal element to be in electrically conducting contact with the front plate and with the first metal element. In one embodiment, the first metal element and the second metal element are in direct contact with each other and with the front plate. In another embodiment, the first metal element and the second metal element are in direct contact with the front plate, but are not in direct contact with each other.
The electrically conductive thermoplastic compositions used in the present invention include a thermoplastic resin and an electrically conducting material. The thermoplastic resin in the electrically conductive thermoplastic composition may be selected from a wide variety of thermoplastic resins or blends of thermoplastic resins. Examples of thermoplastic resins that may be used in the present invention include, but are not limited to, polyacetals, polyacrylics, polycarbonates, polystyrenes, polyesters, polyamides, polyamideimides, polyarylates, polyarylsulfones, polyethersulfones, polyphenylene sulfides, polyvinyl chlorides, polysulfones, polyimides, polyetherimides, polytetrafluoroethylenes, polyetherketones, polyether etherketones, polyether ketone ketones, polybenzoxazoles, polyoxadiazoles, polybenzothiazinophenothiazines, polybenzothiazoles, polypyrazinoquinoxalines, polypyromellitimides, polyquinoxalines, polybenzimidazoles, polyoxindoles, polyoxoisoindolines, polydioxoisoindolines, polytriazines, polypyridazines, polypiperazines, polypyridines, polypiperidines, polytriazoles, polypyrazoles, polypyrrolidines, polycarboranes, polyoxabicyclononanes, polydibenzofurans, polyphthalides, polyacetals, polyanhydrides, polyvinyl ethers, polyvinyl thioethers, polyvinyl alcohols, polyvinyl ketones, polyvinyl halides, polyvinyl nitriles, polyvinyl esters, polysulfonates, polysulfides, polythioesters, polysulfones, polysulfonamides, polyureas, polyphosphazenes, polysilazanes, or the like, or a combination comprising at least one of the foregoing organic polymers.
Specific non-limiting examples of blends of thermoplastic resins include acrylonitrile-butadiene-styrene/nylon, polycarbonate/acrylonitrile-butadiene-styrene, polyphenylene ether/polystyrene, polyphenylene ether/polyamide, polycarbonate/polyester, polyphenylene ether/polyolefin, and combinations including at least one of the foregoing blends of thermoplastic resins.
In addition to the thermoplastic resin, the electrically conductive thermoplastic composition also includes an electrically conducting material. In one embodiment, the electrically conducting material includes a plurality of electrically conducting fibers used to impart electrically conductive characteristics to the electrically conductive thermoplastic composition. In one embodiment, the electrically conducting fibers are selected from metal fibers. Examples of metal fibers that may be used in the present invention include, but are not limited to, stainless steel fibers, aluminum fibers, copper fibers, and the like. In another embodiment, the electrically conducting fibers are selected from electrically conductive carbon fibers.
Examples of electrically conductive thermoplastic compositions that may be used in the present invention include, but are not limited to, FARADEX® electrically conductive resins available from General Electric Company (Pittsfield, Mass.). FARADEX® electrically conductive resins are composed from a base resin, such as polycarbonate, acrylonitrile-butadiene-styrene, polypropylene, or a blend thereof and a plurality of electrically conductive fibers, such as stainless steel fibers.
The first and second metal elements used in the faceplates of the present invention may be constructed from any metal capable of enhancing the EMI shielding effectiveness of the faceplates of the present invention. In one embodiment, the first metal element is designed to enhance the EMI shielding effectiveness of the faceplate itself while the second metal element is designed to enhance the EMI shielding effectiveness of the faceplate by providing EMI shielding in the gaps between conjunctive faceplates (and, therefore, between conjunctive electric circuit cards).
Accordingly, in one embodiment of the present invention, the faceplate includes a first metal element. The first metal element may be integrated with the front plate by attaching the first metal element to a surface of the front plate or by embedding, either partially or completely, the first metal element in the front plate. Whether the first metal element is attached to a surface of the front plate or embedded therein, the first metal element is integrated with the front plate such that the first metal element is in electrically conducting contact with the electrically conducting materials in the front plate.
The first metal element may be constructed from any metal capable of enhancing the EMI shielding effectiveness of the faceplate. Examples of metals that may be used to form the first metal element include, but are not limited to, stainless steel, aluminum, copper, or a combination thereof. The shape of the first metal element may be any shape that permits the first metal element to enhance the EMI shielding effectiveness of the faceplate. Accordingly, the first metal element may be in the form of a plate, rod, mesh or the like. In one embodiment, the first metal element is in the form of a metal mesh. The use of the metal mesh provides a metal element with some degree of flexibility to help reduce any possible shrinkage between the front plate and the first metal element and/or to help reduce any warpage of the faceplate.
The faceplates of the present invention also include a second metal element designed to enhance the EMI shielding effectiveness of the faceplate by providing EMI shielding between adjacent faceplates/circuit cards. As with the first metal element, the second metal element may be constructed from any metal capable of enhancing the EMI shielding effectiveness of the faceplate and may take any shape that permits the second metal element to enhance the EMI shielding effectiveness of the faceplate. As such, metals that may be used to form the second metal element include, but are not limited to, stainless steel, aluminum, copper, or a combination thereof. The shape of the second metal element may include a sheet of metal having a plurality of fingers that extend slightly away from the front plate in a curved or arched manner such that the metal fingers extend at least partially across the gap between adjacent faceplates/circuit cards, thereby permitting the second metal element to enhance the overall EMI shielding effectiveness of the faceplate.
As with the first metal element, the second metal element may be integrated with the front plate by attaching the second metal element to a surface of the front plate or by embedding, either partially or completely, the second metal element in the front plate. In one embodiment, the second metal element is attached such that it is in direct contact with the first metal element. Whether the second metal element is attached to a surface of the front plate or embedded therein, and/or whether the second metal element is in direct contact with the first metal element or not, the second metal element is integrated with the front plate such that the second metal element is in electrically conducting contact with the electrically conducting materials in the front plate. In alternative embodiments, the second metal element includes metal tabs at one or both ends of the second metal element to achieve even better grounding of the faceplate.
The faceplates of the present invention, since they are constructed from a hybrid plastic-metal construction, may be manufactured using any method capable of forming a hybrid plastic-metal article. In one embodiment, the faceplate is formed using an injection-molded process wherein the front plate is formed. The first and second metal elements are then attached to the front plate in an electrically conductive manner, such as, in one embodiment, through the use of one or more hot melt bosses that enable contact of the electrically conducting materials in the front plate with the first and second metal elements. In another embodiment, a compression-molding step may be used to compress a metal element into the front plate. Nevertheless, by using an injection-molding process to form the front plate, as previously discussed, the two die-casting end fixtures can be formed with front plate, thereby reducing the number of steps needed to form the front plate and, therefore, the faceplate.
In another embodiment, the faceplate is constructed by insert-molding the first metal element, the second metal element, or both in the front plate using an insert-molding process. In addition, as with an injection-molding process, using an insert-molding process enables the two die-casting end fixtures to be formed with front plate, thereby reducing the number of steps needed to form the front plate and, therefore, the faceplate.
The foregoing and other features of the present invention will be more readily apparent from the following detailed description and drawings of the illustrative embodiments of the invention wherein like reference numbers refer to similar elements.
Referring to the drawings,
In this embodiment, the front plate 102 is constructed from an electrically conductive thermoplastic composition, the first metal element 104 is in the form of a metal mesh, and the second metal element 106 is in the form of a metal plate having a plurality of metal fingers 116. As may be seen in
As can be seen in
In an alternative embodiment, as shown in
Accordingly, as may be seen, the faceplates of the present invention provide an improved hybrid-metal faceplate that may be used in any system utilizing electric circuit cards. The hybrid-metal faceplates are simpler in construction yet provide an EMI shielding effectiveness of 20 dB or greater across the range of frequencies of 0 Hz to 1.0 GHz.
This written description uses examples to disclose the invention, including the best mode, and also to enable any person skilled in the art to make and use the invention. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements with insubstantial differences from the literal languages of the claims.
This application claims priority to U.S. Provisional Application No. 60/807,101, which was filed Jul. 12, 2006.
| Number | Date | Country | |
|---|---|---|---|
| 60807101 | Jul 2006 | US |
