Hybrid grounding connector

Information

  • Patent Grant
  • 9190741
  • Patent Number
    9,190,741
  • Date Filed
    Friday, January 31, 2014
    11 years ago
  • Date Issued
    Tuesday, November 17, 2015
    9 years ago
Abstract
A hybrid grounding connector is provided which combines the positive attributes of currently used connections. A recess is pre-milled, formed or extruded into the body of a compression connector and the recess is pre-filled with solder. After conductors are installed in the connector, an external heat source is applied to heat the solder until it flows into strands of the conductors and forms a solidified joint of the compression connector.
Description
FIELD OF THE INVENTION

In general, the present invention relates to a hybrid connector for electrically grounding a plurality of conductors together. The connector comprises a recess which has been milled or formed into the body of the connector and pre-filled with solder to be heated and melted once the conductors have been installed in the connector.


BACKGROUND

There are three common methods of providing a grounding connection for a plurality of conductors. These methods include exothermic connectors, mechanical connectors and compression connectors. Each method has its own advantages and disadvantages. Exothermic connectors are believed to be the superior connection among the three mentioned methods, as it yields a solid conductor mass if the method is carried out properly. The solid joint that is produced is not susceptible to mechanical or electrical degradation. However, some disadvantages of this method include the types of tools required and the susceptibility of this method to environmental conditions such as rain or humidity. Mechanical connectors are easy to install and require no special tools for installation of conductors. However, mechanical connectors are often not preferred as a grounding method, as a tightened mechanical connector can become loose through vibrations over time which does not provide a permanent connection. Compression connectors are considered to form a permanent connection, but are believed in some instances to be inferior to exothermic connections due to small voids which can exist in the compressed joint which may allow moisture to penetrate the joint, leading to oxidation or degradation of the connection over time. Compression connectors are considered to be inferior to exothermic for resistance to fault currents. An improved connector which combines the positive attributes of the previously described methods is desired.


SUMMARY OF THE INVENTION

The present invention provides a hybrid connector for electrically grounding a plurality of conductors together. The connector comprises a recess which has been milled, extruded or formed into an interior wall of the body of the connector and pre-filled with solder. The interior walls of the connector can also be coated with flux material to promote solder flow. Conductors are installed within the connector, compressed, and an external heat source is applied which is sufficiently hot to melt the solder which is contained in the recess. The heat source remains applied until the melted solder flows into the strands of the conductors, thereby solidifying the joint of the connector.





BRIEF DESCRIPTION OF THE DRAWINGS


FIG. 1 is a front perspective view of a hybrid connector of the present invention.



FIG. 2 is a side elevation view of a hybrid connector of the present invention.



FIG. 3 is a front elevation view of a hybrid connector of the present invention being installed on a plurality of conductors.



FIG. 4 is a side elevation view of a hybrid connector of the present invention being installed on a plurality of conductors.



FIG. 5 is a front elevation view of a hybrid connector of the present invention which has been crimped around a plurality of conductors.



FIG. 6 is a side elevation view of a hybrid connector of the present invention which has been crimped around a plurality of conductors with an external heat source applied.





DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S)

The above and other features, aspects and advantages of the present invention will now be discussed in the following detailed description of preferred embodiments and appended claims, which are to be considered in conjunction with the accompanying drawings in which identical reference characters designate like elements throughout the views.


Shown in FIG. 1 is a front perspective view of a hybrid connector 101 for electrically grounding a plurality of conductors together. The connector 101 shown in FIG. 1 and also in FIGS. 2-6 is a compression type connector that also has attributes of an exothermic connector. FIG. 1 shows a substantially C-shaped compression type connector 101. The connector comprises a straight portion 102 and two inwardly curved portions 104, which are more clearly shown in FIG. 2, to form the C-shape. Milled or formed into an inner wall 109 of the connector 101 is a recess 107. This recess 107 is pre-filled with solder during the manufacturing process of the connector 101. It is preferred that the solder which is used to fill the recess be silver solder, but it is understood that the solder may be of any other type of solder material. FIG. 2 is a side elevation view of the hybrid connector which is shown in FIG. 1, and the recess 107 which is discussed above can be clearly seen in FIG. 2.


Shown in FIG. 3 is a front elevation view of the C-shaped hybrid compression connector 101. In FIG. 3, it can be seen that the connector 101 has been installed on a plurality of conductors 115, the conductors 115 being comprised themselves of a plurality of cable strands 117. The conductors 115 fit into the curved portions 104 of the C-shaped connector 101, as shown in FIG. 4, and contact the inner wall 109 of the connector 101 which contains the recess 107 that has been filled with solder material 105.


Shown in FIGS. 5 and 6 are front elevation views and side elevation views, respectively, of the C-shaped hybrid compression connector 101. In FIGS. 5 and 6, the connector 101 is shown crimped around the plurality of conductors 115. Once the connector 101 is crimped around the conductors 115, the resulting compressed joint could possibly contain small voids which could potentially allow moisture to penetrate the connection and lead to oxidation or degradation of the connection over time. However, the recess 107 which has been pre-filled with the solder material 105 prevents this from happening. In FIG. 6, it is shown that a heat source 111 is applied to the connector 101 in order to heat the solder material 105. Once the solder material 105 is heated to its melting point, which is lower than the melting point of the material which the connector is comprised of, then the solder begins to flow into the strands 117 of the conductors 115. The heat source 111 remains applied until the solder 105 is fully melted and integrated into the strands 117 of the conductors 115, resulting in a solid conductor mass.


Although the invention has been described in detail above, it is expressly understood that it will be apparent to persons skilled in the relevant art that the invention may be modified without departing from the spirit of the invention. Various changes of form, design, or arrangement may be made to the invention without departing from the spirit and scope of the invention. Therefore, the above mentioned description is to be considered exemplary, rather than limiting, and the true scope of the invention is that defined in the following claims.

Claims
  • 1. A hybrid compression connector for providing a grounding connection, the connector comprising: a compression connector for receiving a plurality of conductors which are comprised of multiple strands;wherein an interior wall of the compression connector comprises a recess filled, at least partially, with solder; andwherein after the compression connector has been crimped around the conductors, a heat source is applied to melt the solder until it flows into the strands of the conductors to solidify the connection and prevent moisture intrusion.
  • 2. The hybrid compression connector of claim 1, wherein the interior walls of the compression connector have a coating of flux which has been pre-applied to them.
  • 3. The hybrid compression connector of claim 1, wherein the solder which at least partially fills the recess is silver solder.
  • 4. The hybrid compression connector of claim 1, wherein, prior to the heat source being applied, the solder remains in the recess by friction fit or by being soldered into position.
  • 5. The hybrid compression connector of claim 1, wherein the material which is used to form the connector has a higher melting point than that of the solder which at least partially fills the recess.
  • 6. The hybrid compression connector of claim 1, wherein the connector is substantially C-shaped and comprises a wall which forms a straight portion and walls which form two opposite and inwardly curved portions to form the C-shape and wherein an interior wall of the straight portion of the connector comprises the recess filled, at least partially, with solder.
  • 7. A method for providing a grounding connection using a hybrid grounding connector, comprising the steps of: milling, forming or extruding a recess into an inner wall of the connector;filling the recess, at least partially, with solder;placing a plurality of conductors which are comprised of multiples strands in the connector;crimping or tightening the connector around the plurality of conductors until the conductors are secure; andapplying an external heat source to the connector in order to melt the solder to allow it to flow into the strands of the conductors, thereby solidifying the connection and preventing moisture intrusion.
  • 8. The method of claim 7, wherein the connector is a compression connector.
  • 9. The method of claim 7, wherein the connector is a substantially C-shaped compression connector and comprises a wall which forms a straight portion and walls which form two opposite and inwardly curved portions to form the C-shape and wherein an interior wall of the straight portion of the connector comprises the recess filled, at least partially, with solder.
  • 10. The method of claim 7, wherein all interior walls of the connector which contact the conductors have a coating of flux which has been pre-applied to them.
  • 11. The method of claim 7, wherein the material which is used to form the connector has a higher melting point than that of the solder which at least partially fills the recess.
  • 12. The method of claim 7, wherein the solder which at least partially fills the recess is silver solder.
  • 13. The method of claim 7, wherein, prior to the heat source being applied, the solder remains in the recess by friction fit or by being soldered into position.
US Referenced Citations (59)
Number Name Date Kind
918078 McCaffrey Apr 1909 A
2025848 Collis Dec 1935 A
2614304 Oetiker Oct 1952 A
2664844 Siegrist et al. Jan 1954 A
2894056 Bogese Jul 1959 A
2945085 Billups Jul 1960 A
3023036 Taylor, Jr. Feb 1962 A
3095337 Chase Jun 1963 A
3251615 Short, III May 1966 A
3476410 Pastva, Jr. Nov 1969 A
3519982 White, Jr. Jul 1970 A
3601783 Loose Aug 1971 A
3678174 Ganzhorn Jul 1972 A
3757031 Izraeli Sep 1973 A
3807885 Coski Apr 1974 A
3852517 Fava Dec 1974 A
4109350 Acre Aug 1978 A
4373235 Korgaonkar Feb 1983 A
4454644 Okazaki et al. Jun 1984 A
4482782 Sheppard Nov 1984 A
4505421 Gen et al. Mar 1985 A
4667869 Gen et al. May 1987 A
4688713 Gen et al. Aug 1987 A
4710080 Sheppard Dec 1987 A
4722471 Gray et al. Feb 1988 A
4809901 Gen et al. Mar 1989 A
4832248 Soni et al. May 1989 A
4865244 Morinaga Sep 1989 A
4889506 Connolly et al. Dec 1989 A
4914267 Derbyshire Apr 1990 A
4920642 Yanai et al. May 1990 A
4940179 Soni Jul 1990 A
4998326 Oetiker Mar 1991 A
5007666 Kyfes Apr 1991 A
5025554 Dohi Jun 1991 A
5393932 Young et al. Feb 1995 A
5504275 Scramoncin Apr 1996 A
5579575 Lamome et al. Dec 1996 A
5594211 Di Troia et al. Jan 1997 A
5635676 Piriz Jun 1997 A
6247500 McMahon Jun 2001 B1
6309260 Shannon Oct 2001 B1
6452103 Piriz Sep 2002 B1
6481061 Andre et al. Nov 2002 B1
6640873 Triantopoulos et al. Nov 2003 B2
6677529 Endacott Jan 2004 B1
6793003 Triantopoulos et al. Sep 2004 B2
6818830 O'Grady et al. Nov 2004 B2
6846989 Sokol et al. Jan 2005 B2
7026552 Sokol et al. Apr 2006 B2
7053307 Kossak et al. May 2006 B2
7121001 O'Grady et al. Oct 2006 B2
7183489 Kossak et al. Feb 2007 B2
7511224 Kossak Mar 2009 B1
7655863 Kossak Feb 2010 B2
7708608 Soh May 2010 B2
8047476 Van Walraven Nov 2011 B2
20100068946 Lai Mar 2010 A1
20140273560 Cawood Sep 2014 A1
Foreign Referenced Citations (29)
Number Date Country
13995 Jan 1882 CA
141101 Jun 1912 CA
1260098 Sep 1989 CA
1286008 Jul 1991 CA
2074936 Jul 1991 CA
2084504 Dec 1991 CA
2057279 Jun 1992 CA
2113816 Feb 1993 CA
2127286 Aug 1993 CA
2142703 May 1994 CA
2173351 May 1995 CA
1337030 Sep 1995 CA
2196092 Feb 1996 CA
2287637 May 2000 CA
2306988 Aug 2001 CA
2630244 Nov 2007 CA
2683284 Nov 2008 CA
2684202 Nov 2008 CA
2685765 Nov 2008 CA
2703937 May 2009 CA
128677 Aug 2009 CA
2676943 Mar 2010 CA
2765944 Jan 2011 CA
2714533 Mar 2011 CA
1403965 Mar 2004 EP
1503453 Feb 2005 EP
2011096527 Aug 2011 WO
2011128225 Oct 2011 WO
2011131303 Oct 2011 WO
Related Publications (1)
Number Date Country
20140273560 A1 Sep 2014 US
Provisional Applications (1)
Number Date Country
61777846 Mar 2013 US