Claims
- 1. A device for emitting light waves, comprising:
- at least one electrooptic semiconductor component having a plurality of sides; and
- a molded material molded to the at least one electrooptic semiconductor component, the molded material including at least one recess disposed alongside at least one of the plurality of sides of the at least one electrooptic semiconductor component to align the at least one electrooptic semiconductor component with a waveguide trench.
- 2. The device set forth in claim 1, wherein the at least one electrooptic semiconductor includes a light-emitting zone, and wherein the molded material includes the waveguide trench, the waveguide trench having a first end and a second end, the first end adjoining the light-emitting zone of the at least one electrooptic semiconductor component and the second end adjoining a first holding device for holding an optical waveguide.
- 3. The device set forth in claim 2, further comprising a cover connected to the at least one electrooptic semiconductor component, the cover having at least one second holding device for holding the optical waveguide, and wherein the waveguide trench is filled with an optically transparent material, thereby forming a waveguide, the waveguide being optically coupled to the optical waveguide.
- 4. A device for emitting light waves, comprising:
- at least one electrooptic semiconductor component having a plurality of sides and a light-emitting zone; and
- a molded material molded to the at least one electrooptic semiconductor component, the molded material including a recess disposed adjacent to the light-emitting zone, the recess being adapted to form a waveguide trench aligned with the light-emitting zone.
- 5. The device set forth in claim 4, wherein the waveguide trench has a first end and a second end, the first end adjoining the light-emitting zone of the at least one electrooptic semiconductor component and the second end adjoining a first holding device for holding an optical waveguide.
- 6. The device set forth in claim 5, further comprising a cover connected to the at least one electrooptic semiconductor component, the cover having a second holding device disposed opposite the first holding device for holding the optical waveguide, and wherein the waveguide trench is filled with an optically transparent material to form a waveguide, the waveguide being optically coupled to the optical waveguide.
Priority Claims (1)
Number |
Date |
Country |
Kind |
43 00 652.3 |
Jan 1993 |
DEX |
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Parent Case Info
This application is a division of application Ser. No. 08/295,915, filed on Sep. 13, 1994, now U.S. Pat. No. 5,475,775.
US Referenced Citations (16)
Non-Patent Literature Citations (2)
Entry |
M. Hamacher, A Novel Fibre/Chip Coupling Technique With An Integrated Strain Relief On InP, ECOC 92, Berlin, pp. 537-540. |
Jackson, Flip/Chip, Self-Aligned, Optoelectronic Transceiver Module, ECOC 92, Berlin, pp. 329-332. |
Divisions (1)
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Number |
Date |
Country |
Parent |
295915 |
Sep 1994 |
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