Claims
- 1. A process for the preparation of a supported rhodium bisphosphite hydroformylation catalyst comprising reacting CO and H2 with a rhodium compound in the presence of a supported bis(phosphorus) ligand of formula 1 in which Q is any organic fragment which binds the two phosphorus moieties to the support and X is alkoxy, aryloxy, alkyl, or aryl, or alternatively wherein the PX2 moiety forms a ring and X2 is a di(alkoxy), di(aryloxy), di(alkyl), or di(aryl).
- 2. A process according to claim 1 where the supported ligand of Formula (1) is further characterized according to Formula (4) wherein:the linker Q is a 2,2′-dihydroxyl-1,1′-binaphthalene bridging group; the substituents R7 and R8 in the 3,3′ positions of the binaphthalene bridging group are selected from alkyl group containing 2 to 10 carbon atoms, an aryl group, an alkoxy group, an aryloxy group, a carboalkoxy group, a carboaryloxy group, a nitrile group, a triarylsilyl group, or trialkylsilyl group; at least one of the groups R7 and R8 are covalently attached to a support (Sup); X is an alkoxy, aryloxy, alkyl, or aryl, or alternatively the PX2 moiety forms a ring and X2 is a di(alkoxy), di(aryloxy), di(alkyl), or di(aryl).
- 3. A process according to claim 1 wherein the temperature is in the range 25-120° C. and CO and H2 partial pressures in the range 0.1-3.4 MPa.
- 4. A process according to claim 3 wherein the rhodium compound is dissolves in a solvent which is a good swelling solvent for the support.
- 5. A process according to claim 1 wherein the support is an organic polymer resin.
- 6. A process according to claim 1 wherein the organic polymer resin is a crosslinked polystyrene resin.
- 7. A hydroformylation catalyst composition according to claim 2, characterized in that R7 and R8 are carboalkoxyl groups, CO—O—R, in which R is a C1-C20 alkyl or a C6-C20 aryl.
Parent Case Info
This application is a divisional application of co-pending Ser. No. 09/291,878, filed on Apr. 14, 1999, which claims priority from provisional application No. 60/087,151, filed on May 29, 1998.
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Provisional Applications (1)
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