Claims
- 1. A hydrogen absorbing alloy electrode comprising an electrically conductive substrate having applied thereto a hydrogen absorbing alloy powder, the electrode being characterized in that the hydrogen absorbing alloy powder contains nickel and cobalt, the alloy particles (1) being formed each in a surface layer portion thereof with a metal-rich layer (3) enriched in metals by a reduction treatment with hydrogen, the metal-rich layer (3) being surface-treated with an acid or alkaline treating liquid.
- 2. A hydrogen absorbing alloy electrode according to claim 1 wherein the acid treating liquid is a hydrochloric acid solution.
- 3. A hydrogen absorbing alloy electrode according to claim 1 wherein the alkaline treating liquid is at least one aqueous solution selected from among an aqueous solution of KOH, aqueous solution of NaOH and aqueous solution of LiOH.
- 4. A metallic oxide-hydrogen battery wherein a hydrogen absorbing alloy electrode is used which comprises an electrically conductive substrate having applied thereto a hydrogen absorbing alloy powder, the metallic oxide-hydrogen battery being characterized in that the hydrogen absorbing alloy powder contains nickel and cobalt, the alloy particles (1) being formed each in a surface layer portion thereof with a metal-rich layer (3) enriched in metals by a reduction treatment with hydrogen, the metal-rich layer (3) being surface-treated with an acid or alkaline treating liquid.
- 5. A metallic oxide-hydrogen battery according to claim 4 wherein the acid treating liquid is a hydrochloric acid solution.
- 6. A metallic oxide-hydrogen battery according to claim 4 wherein the alkaline treating liquid is at least one aqueous solution selected from among an aqueous solution of KOH, aqueous solution of NaOH and aqueous solution of LiOH.
Priority Claims (1)
Number |
Date |
Country |
Kind |
9-17995 |
Jan 1997 |
JP |
|
Parent Case Info
This is a Division of application Ser. No. 09/147,482 filed Jan. 7, 1999 now U.S. Pat. No. 6,238,822, which is a 371 of PCT/JP98/00324, filed Jan. 26, 1998. The disclosure of the prior application(s) is hereby incorporated by reference in its entirety.
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