Claims
- 1. A resin composition comprising the following components (1) and (2):(1) 5 to 99 parts by weight of a polypropylene resin, and (2) 1 to 95 parts by weight of a hydrogenated block copolymer which comprises at least two polymer blocks A each mainly comprising an aromatic vinyl hydrocarbon compound monomer unit and at least two hydrogenated polymer blocks B each mainly comprising a butadiene monomer unit, at least 90% of the olefinically unsaturated double bonds in said polymer block mainly comprising a butadiene monomer unit before hydrogenation having been hydrogenated, wherein at least one of the block at the terminal of the hydrogenated block copolymer is the polymer block B, wherein the proportion of the terminal polymer blocks B in the hydrogenated block copolymer is at least 0.1 wt % but less than 9.1 wt %, wherein the proportion of the aromatic vinyl hydrocarbon compound in the hydrogenated block copolymer exceeds 10 wt % but less than 25 wt %, wherein the 1,2-bond content of the polymer blocks mainly comprising a butadiene monomer unit before hydrogenation is, on average, at least 62 mol % but less than 99 mol %, and wherein the difference ΔTc (Tc1−Tc2) between the crystallization initiating temperature (Tc1) of an isotactic homopolypropylene and the crystallization initiating temperature (Tc2) of a mixture thereof with the hydrogenated block copolymer is at least 1.50° C. wherein the amounts of components (1) and (2) are based on 100 parts by weight of both components (1) and (2).
- 2. The resin composition according to claim 1, wherein, in the component (2), the proportion of the aromatic vinyl hydrocarbon compound in the hydrogenated block copolymer is at least 12 wt % but less than 25 wt %.
- 3. The resin composition according to claim 1, wherein in the component (2), ΔTc (Tc1−Tc2) is at least 2.0° C.
- 4. The resin composition according to claim 1, wherein, in the component (2), the proportion of the terminal polymer block B in the hydrogenated block copolymer exceeds 0.5 wt % but less than 5.0 wt %.
- 5. A sheet and film comprising the resin composition as claimed in claim 1.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-259667 |
Sep 1998 |
JP |
|
Parent Case Info
This application is the national phase under 35 U.S.C. § 371 of PCT International Application No. PCT/JP99/04988 which has an International filing date of Sep. 13, 1999, which designated the United States of America.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/JP99/04988 |
|
WO |
00 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO00/15681 |
3/23/2000 |
WO |
A |
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May 2001 |
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Number |
Date |
Country |
19815895 |
Oct 1998 |
DE |
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Mar 1986 |
EP |
0263678 |
Apr 1988 |
EP |
61-155446 |
Jul 1986 |
JP |
A912804 |
Jan 1997 |
JP |
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Sep 1997 |
WO |
Non-Patent Literature Citations (1)
Entry |
Patent Abstract of Japan 61 155446A, Jul. 15, 1986. |