Claims
- 1. A hydrogenated block copolymer which comprises at least two polymer blocks A each mainly comprising an aromatic vinyl hydrocarbon compound monomer unit and at least two hydrogenated polymer blocks B each mainly comprising a hydrogenated butadiene monomer unit, at least 90% of olefinically unsaturated double bonds in the polymer blocks mainly comprising a butadiene monomer unit before hydrogenation having been hydrogenated,wherein at least one of the blocks at the terminal of the hydrogenated block copolymer is the polymer block B, wherein the proportion of the terminal polymer blocks B in the hydrogenated block copolymer is at least 0.1 wt % but less than 9.1 wt %, wherein the proportion of the aromatic vinyl hydrocarbon compound in the hydrogenated block copolymer is at least 25 wt % but less than 80 wt %, wherein the 1,2-bond content of the polymer blocks mainly comprising a butadiene monomer unit before hydrogenation is, on average, at least 60 mol % but less than 99 mol %, and wherein said hydrogenated block copolymer has a domain degradation temperature (Tdd) of 150° C. or higher.
- 2. The hydrogenated block copolymer according to claim 1, wherein the proportion of the aromatic vinyl hydrocarbon compound in the hydrogenated block copolymer is at least 25 wt % but less than 70 wt %.
- 3. The hydrogenated block copolymer according to claim 1, wherein the proportion of the terminal polymer blocks B in the hydrogenated block copolymer exceeds 0.5 wt % but less than 5.0 wt %.
- 4. A resin composition comprising the following components (1), (2a) and (3):(1) 20 to 80 parts by weight of a polypropylene resin, (2a) 20 to 80 parts by weight of a polyphenylene ether resin, and (3) 1 to 40 parts by weight of the hydrogenated block copolymer as claimed in claim 1, wherein said component (3) has a domain degradation temperature (Tdd) of 150° C. or higher.
- 5. The resin composition according to claim 4, wherein, in the component (3), the proportion of the aromatic vinyl hydrocarbon compound in the hydrogenated block copolymer is at least 25 wt % but less than 70 wt %.
- 6. The resin composition according to claim 4, wherein, in the component (3), the proportion of the terminal polymer block B in the hydrogenated block copolymer exceeds 0.5 wt % but less than 5.0 wt %.
- 7. The resin composition according to claim 4, wherein said polyphenylene ether resin is selected from the group consisting of poly(2,6-dimethyl-1,4-phenylene) ether, poly(2,6-diethyl-1,4-phenylene) ether, poly(2-methyl-6-ethyl-1,4-phenylene) ether, poly(2-methyl-6-propyl-1,4-phenylene) ether, poly(2,6-dipropyl-1,4-phenylene) ether, poly(2-ethyl-6-propyl-1,4-phenylene) ether, poly(2,6-dibutyl-1,4-phenylene) ether, poly(2,6-dipropenyl-4,4-phenylene) ether, poly(2,6-dilauryl-1,4-phenylene) ether, poly(2,6-diphenyl-1,4-phenylene) ether, poly(2,6-dimethoxy-1,4-phenylene) ether, poly(2,6-diethoxy-1,4-phenylene) ether, poly(2-methoxy-6-ethoxy-1,4-phenylene) ether, poly(2-ethyl-6-stearyloxy-1,4-phenylene) ether, poly(2,6-dichloro-1,4-phenylene) ether, poly(2-methyl-6-phenyl-1,4-phenylene) ether, poly(2,6-dibenzyl-1,4-phenylene) ether, poly(2-ethoxy-1,4-phenylene) ether, poly(2-chloro-1,4-phenylene) ether and poly(2,5-dibromo-1,4-phenylene) ether.
- 8. The resin composition according to claim 4, wherein said component (3) has a domain degradation temperature (Tdd) of 160° C. or higher.
- 9. A resin composition comprising the following components (1), (2b) and (3):(1) 20 to 80 parts by weight of a polypropylene resin, (2b) 20 to 80 parts by weight of a polystyrene resin, and (3) 1 to 40 parts by weight of the hydrogenated block copolymer as claimed in claim 1, wherein said component (3) has a domain degradation temperature (Tdd) of 150° C. or higher.
- 10. The resin composition according to claim 9, wherein, in the component (3), the proportion of the aromatic vinyl hydrocarbon compound in the hydrogenated block copolymer is at least 25 wt % but less than 70 wt %.
- 11. The resin composition according to claim 9, wherein, in the component (3), the proportion of the terminal polymer block B in the hydrogenated block copolymer exceeds 0.5 wt % but less than 5.0 wt %.
- 12. The resin composition according to claim 9, wherein said component (3) has a domain degradation temperature (Tdd) of 160° C. or higher.
- 13. The hydrogenated block copolymer according to claim 1, wherein said aromatic vinyl hydrocarbon compound monomer unit is selected from the group consisting of styrene, alkyl styrene, paramethoxy styrene and vinyl naphthalene.
- 14. The hydrogenated block copolymer according to claim 1, wherein said wherein the 1,2-bond content of the polymer blocks mainly comprising a butadiene monomer unit before hydrogenation is, on average, at least 70 mol % but less than 99 mol %.
- 15. The hydrogenated block copolymer according to claim 1, wherein the structures of said blocks A and B is: A-B-A-B, B-A-B-A-B or (B-A-B)n-X, wherein n is an integer of 2 or greater and X is the residue of a coupling agent.
- 16. The hydrogenated block copolymer according to claim 1, wherein said hydrogenated block copolymer has a domain degradation temperature (Tdd) of 160° C. or higher.
Priority Claims (1)
Number |
Date |
Country |
Kind |
10-259666 |
Sep 1998 |
JP |
|
Parent Case Info
This application is the national phase under 35 U.S.C. §371 of PCT International Application No. PCT/JP99/04987 which has an International filing date of Sep. 13, 1999, which designated the United States of America.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
PCT/JP99/04987 |
|
WO |
00 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO00/15680 |
3/23/2000 |
WO |
A |
US Referenced Citations (5)
Number |
Name |
Date |
Kind |
4386125 |
Shiraki et al. |
May 1983 |
A |
5189110 |
Ikematu et al. |
Feb 1993 |
A |
5278232 |
Seelert et al. |
Jan 1994 |
A |
5358986 |
Onofusa et al. |
Oct 1994 |
A |
6239218 |
Yonezawa et al. |
May 2001 |
B1 |
Foreign Referenced Citations (11)
Number |
Date |
Country |
198 15 895 |
Oct 1998 |
DE |
A173380 |
Mar 1986 |
EP |
0 263 678 |
Apr 1988 |
EP |
733 675 |
Sep 1996 |
EP |
0 884 359 |
Dec 1998 |
EP |
61-155446 |
Jul 1986 |
JP |
61 155446 |
Jul 1986 |
JP |
A912804 |
Jan 1997 |
JP |
09 012804 |
Jan 1997 |
JP |
09 145238 |
Jun 1997 |
JP |
9607681 |
Mar 1996 |
WO |
Non-Patent Literature Citations (1)
Entry |
Hayano et al., CAPLUS abstract of JP61-155446 (Jul. 7,1986). |