IC socket with terminal

Abstract

A terminal (1) for an IC socket includes a mounting end (11) adapted to be mounted onto a substrate. The mounting end includes a bottom surface (110) and a side surface (113). A recess (111), on a first region of the bottom surface, is adapted for a body of reflowable, electrically conductive material to be fused thereon. A channel (112), on a second region of said bottom surface, extends from the side surface to the recess. The providence of the channel allows the vapored flux material to be laterally dissipated through the channel, thereby having no formation of one or more voids within the mass of reflowable, electrically conductive material, during the reflowable process.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a terminal for an IC socket according to a preferred embodiment of the present invention;

FIG. 2 is another perspective view of the terminal of the IC socket of FIG. 1;

FIG. 3 is a perspective view of the terminal of FIG. 2, but showing a mass of heat fusible material attached thereto;

FIG. 4 is a front view of the terminal of FIG. 1; and

FIG. 5 is a perspective view of a conventional terminal.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENT

Referring to FIGS. 1 to 4, a terminal 1 for an IC socket is shown in accordance with the preferred embodiment of the present invention to include a mounting end 11 adapted to be mounted onto a substrate (not shown).

The mounting end 11 of the terminal 1 includes a bottom surface 110, and a side surface 113 transverse to the bottom surface 110, wherein both of the side surface 113 and the bottom surface 110 are exposed to the exterior. A mounting recessed region 111 is defined on a middle portion of the bottom surface 110. The mounting recessed region 111 is adapted for a body or mass of reflowable, electrically conductive material (12) to be fused thereon. A channel or slot 112 is defined on another region of the bottom surface 110 except for the mounting recessed region 111, and is arranged extending from the side surface 113 to the recessed region 111. The providence of the channel 112 allows the vapored flux material (not visually seen) to be laterally dissipated through the channel, thereby having no formation of one or more voids within the mass of reflowable, electrically conductive material, during the reflowable process. It should be noted that, the channel 112 may be terminated at any surface region, which is exposed to the exterior, other than the side surface 113 of this preferred embodiment.

While the present invention has been described with reference to preferred embodiments, the description of the invention is illustrative and is not to be construed as limiting the invention. Various of modifications to the present invention can be made to preferred embodiments by those skilled in the art without departing from the true spirit and scope of the invention as defined by the appended claims.

Claims

1. An IC socket comprising: a terminal having a mounting portion, the mounting portion adapted to be mounted onto a substrate;the mounting end having a bottom surface, and a surface region exposed to the exterior;a recess on a portion of said bottom surface, said recess adapted for a mass of heat fusible material to be fused thereon; anda slot extending from said surface region to said recess.

2. The IC socket as claimed in claim 1, wherein said recess is located in a center area of the bottom surface while the slot is located in an area of said bottom surface beside said center area.

3. An IC socket comprising: a terminal including a mounting section, the mounting section disposed adjacent a substrate;the mounting section having a mounting region adapted for a mass of heat fusible material to be fused thereon, and a surface region exposed to the exterior; anda channel extending from said surface region and into said mounting region.

4. A terminal for an IC socket, the terminal comprising: a mounting end adapted to be mounted onto a substrate;

5. The terminal as claimed in claim 4, wherein said second structure extends radially with regard to the first structure.