BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a perspective view showing a configuration of an IC tag sheet according to Embodiment 1 of the present invention.
FIG. 2A is a perspective view showing a configuration of a stick of the IC tag sheet.
FIG. 2B is a perspective view showing another configuration of a stick of the IC tag sheet.
FIG. 3 is a cross-sectional view showing a configuration of a joint of the IC tag sheet.
FIG. 4 is a cross-sectional view showing another configuration of a joint of the IC tag sheet.
FIG. 5 is a cross-sectional view showing another configuration of a joint of the IC tag sheet.
FIG. 6 is a perspective view showing an IC tag sheet wound around wires, according to Embodiment 1 of the present invention.
FIG. 7 is an exploded perspective view showing another configuration of the IC tag sheet according to Embodiment 1 of the present invention.
FIG. 8 is an exploded perspective view showing another configuration of the IC tag sheet.
FIG. 9 is a perspective view showing a configuration of an IC tag sheet according to Embodiment 2 of the present invention.
FIG. 10 is a perspective view showing a configuration of a suction sheet of the IC tag sheet.
FIG. 11 is an exploded perspective view showing a configuration of the IC tag sheet.
FIG. 12A is a perspective view showing the IC tag sheet wound around a bundle of wires.
FIG. 12B is a cross-sectional view of the IC tag sheet and the wires shown in FIG. 12A.
FIG. 13 is an exploded perspective view showing an IC tag plate to be attached to a joint of the IC tag sheet.
FIG. 14 is a perspective view showing another configuration of the IC tag sheet.
FIG. 15 is a perspective view showing a configuration of an IC tag sheet according to Embodiment 3 of the present invention.
FIG. 16 is a perspective view showing another configuration of a joint of an IC tag sheet according to Embodiment 3 of the present invention.
FIG. 17 is a plan view showing a configuration of a typical IC tag sheet.