BACKGROUND
The invention relates generally to motor vehicles, and more particularly, to an illuminated vehicle interior component.
Vehicles typically include a variety of lighting systems to illuminate various regions of a vehicle interior. For example, certain vehicles include one or more lights configured to illuminate devices in an instrument panel of the vehicle. Furthermore, certain vehicles include one or more lights configured to illuminate devices at other locations throughout the vehicle interior. Such lights may illuminate gauges, touch panels, touch devices, switches, indicators, controls, and so forth. As may be appreciated, lighting systems may provide illumination for enabling a driver to operate the vehicle in low-light conditions. Moreover, lighting systems may provide decorative illumination, which is visible during daytime and/or nighttime operation. These lighting systems may use a light-emitting device positioned to illuminate a component, such as by positioning the light-emitting device behind the component (e.g., for backlighting the component). Accordingly, the light-emitting device may emit light through layers of the component to illuminate the component. Unfortunately, such illuminated vehicle interior components may occupy a substantial amount of space within the instrument panel, for example, and may be expensive to manufacture.
BRIEF DESCRIPTION OF THE INVENTION
The present invention relates to an illuminated vehicle interior component. The illuminated vehicle interior component includes a light-transmissive substrate layer configured to be disposed over a printed circuit layer. The illuminated vehicle interior component also includes a decorative layer formed directly onto the light-transmissive substrate layer. The light-transmissive substrate layer is configured to receive light from a light-emitting device coupled to the printed circuit layer. The light-transmissive substrate layer is also configured to illuminate at least a portion of the illuminated vehicle interior component.
The present invention also relates to an illuminated vehicle interior component. The illuminated vehicle interior component includes a printed circuit layer. The illuminated vehicle interior component also includes a light-emitting device coupled to the printed circuit layer. The illuminated vehicle interior component includes a light-transmissive substrate layer disposed over the printed circuit layer and a decorative layer formed directly onto the light-transmissive substrate layer. The light-transmissive substrate layer is configured to receive light from the light-emitting device. The light-transmissive substrate layer is also configured to illuminate at least the portion of the illuminated vehicle interior component.
The present invention further relates to a method for manufacturing an illuminated vehicle interior component. The method includes forming a light-transmissive substrate layer. The light-transmissive substrate layer is configured to be disposed over a printed circuit layer. The method also includes forming a decorative layer directly onto the light-transmissive substrate layer. The light-transmissive substrate layer is configured to receive light from a light-emitting device coupled to the printed circuit layer. The light-transmissive substrate layer is also configured to illuminate at least a portion of the illuminated vehicle interior component.
DRAWINGS
FIG. 1 is a perspective view of an exemplary vehicle that may include an illuminated vehicle interior component.
FIG. 2 is a front view of an embodiment of a gauge illuminated by a side-lighting light source.
FIG. 3 is a cross-sectional view of the gauge of FIG. 2.
FIG. 4 is a front view of an embodiment of a gauge illuminated by a back-lighting light source.
FIG. 5 is a cross-sectional view of the gauge of FIG. 4.
FIG. 6 is another detailed cross-sectional view of the gauge of FIG. 4.
FIG. 7 is a front view of an embodiment of another gauge illuminated by a back-lighting light source.
FIG. 8 is a cross-sectional view of the gauge of FIG. 7.
FIG. 9 is a flow chart of an embodiment of a method for manufacturing an illuminated vehicle interior component.
DETAILED DESCRIPTION
FIG. 1 is a perspective view of an exemplary vehicle 10 that may include an illuminated vehicle interior component, such as an illuminated gauge, gauge cluster, graphics plate, touch panel, touch device, switch, capacitive switch, indicator, control, and so forth. The vehicle 10, in this case a car, includes an interior 12 and an exterior 14. The illuminated vehicle interior component may be located in the interior 12 or on the exterior 14 of the vehicle 10. Furthermore, the illuminated vehicle interior component may be manufactured using a manufacturing technique suitable for production of decorative lighting. For example, the illuminated vehicle interior component may be manufactured using in-mold-decorating (IMD) technology, mold behind technology, or any other suitable manufacturing technology. As such, the illuminated vehicle interior component may be manufactured to have a thickness that is substantially less than traditional illuminated vehicle interior components. Accordingly, the illuminated vehicle interior component may occupy less space than traditional illuminated vehicle interior components. Moreover, the illuminated vehicle interior component may be manufactured with fewer raw materials and thereby be manufactured with less cost than traditional illuminated vehicle interior components.
FIG. 2 is a front view of an embodiment of a gauge 16 illuminated by a side-lighting light source. The gauge 16 includes a substrate layer 18 with a decorative layer 19 formed directly thereon. The substrate layer 18 may be manufactured using any suitable material. For example, the substrate layer 18 may be manufactured from an acrylic based material, or another polymeric material. Moreover, in certain embodiments, the substrate layer 18 may be manufactured from any light-transmissive material that facilitates light transmission therethrough (e.g., clear or translucent material). In some embodiments, the transparency of the substrate layer 18 may facilitate only certain light emissions being transmitted therethrough. For example, the substrate layer 18 may enable light emissions to be transmitted through the substrate layer 18 when an angle of incidence of a light ray is less than or equal to a predetermined angle (e.g., 5, 10, 15 degrees, and so forth). Moreover, the substrate layer 18 may block light emissions from being transmitted through the substrate layer 18 when the angle of incidence of the light ray is greater than the predetermined angle.
The decorative layer 19 is formed directly onto the substrate layer 18 using any suitable manufacturing technique. For example, the decorative layer 19 may be formed directly onto the substrate layer 18 using IMD technology, mold behind technology, painting technology, laser etching technology, hot-foil transfer technology, direct printing technology, and so forth. As such, the substrate layer 18 and the decorative layer 19 may be formed together during the molding process, thereby reducing manufacturing time and cost.
The decorative layer 19 includes decorative elements 20 and 21. The decorative elements 20 may be numbers, letters, symbols, shapes, or other features, such as the numbers 1, 4, and 7, as illustrated. In certain embodiments, the decorative elements 20 may be raised above or recessed below the surface of the gauge 16. Moreover, the decorative elements 20 and 21 may be colored (e.g., not light-transmissive, black, white, blue, green, red, etc.) to block light from being transmitted through the decorative layer 19. For example, the decorative elements 20 and 21 may be formed on the substrate layer 19 using a painting material. In some embodiments, at least a portion of the decorative elements 20 and 21 may be formed using a light-transmissive material. For example, the decorative elements 20 and 21 may be formed by applying a colored material that is light-transmissive to certain areas on the surface of the gauge 16, or by not applying a colored material to certain areas on the surface of the gauge 16.
The substrate layer 18 includes an opening 22 that extends through the substrate layer 18 to facilitate light transmission from a light-emitting device (e.g., from a light-emitting device located behind the substrate layer 18) to a surface that illuminates at least a portion of the gauge 16. The gauge 16 also includes light-emitting devices 23, 24, and 25. The light-emitting devices 23, 24, and 25 are side lighting devices configured to emit light rays in directions 26 and 27 that are substantially parallel to the surface of the gauge 16 (e.g., in a radially inward direction). Certain light-emitting devices for lighting the gauge 16 may be configured to emit light rays in a direction 28 that is substantially perpendicular to the surface of the gauge 16. The light-emitting devices 23, 24, and 25 may be any suitable type of light-emitting devices, such as light-emitting diodes (LEDs). In certain embodiments, the light-emitting devices 23, 24, and 25 may be configured to emit a white light, while in other embodiments, the light-emitting devices 23, 24, and 25 may be configured to emit any suitable color of light (e.g., white, blue, red, yellow, green, etc.). As may be appreciated, the light-emitting devices 23, 24, and 25 may be individually controlled based on various conditions, such as a speed of the vehicle 10, a number of rotations per minute of an engine of the vehicle 10, an amount of daylight, a time of day, a temperature, a pressure, a warning indication, an error indication, and so forth.
Using the techniques discussed above, the gauge 16 may be manufactured to have a thickness that is substantially smaller than traditional gauges, thereby occupying less space within an instrument panel. Moreover, by forming the decorative layer 19 and the substrate layer 18 during a single molding process, manufacturing time and cost may be reduced.
FIG. 3 is a cross-sectional view of the gauge 16 of FIG. 2. As illustrated, the substrate layer 18 is disposed over (e.g., directly on) a printed circuit board (PCB) layer 30. The PCB layer 30 is used to provide power to and/or to otherwise control various components mounted to the PCB, such as the light-emitting device 24 and movable parts of the gauge 16 that are electrically coupled to the PCB layer 30. A light-emitting device 32 is also electrically coupled to the PCB layer 30. The light-emitting device 32 is a side lighting device configured to emit light rays in the direction 26 parallel to the surface of the PCB layer 30. The substrate layer 18 includes a protruding edge 34 that covers the light-emitting device 32 such that the light-emitting device 32 is generally not visible when viewing the surface of the gauge 16. Moreover, the substrate layer 18 includes a chamfered edge 36 (e.g., angled edge) that directs light through the opening 22. Specifically, the chamfered edge 36 of the substrate layer 18 is overlaid with the decorative layer 19 to at least partially reflect light rays that are directed toward the chamfered edge 36. For example, the decorative layer 19 on the chamfered edge 36 may be a white coating applied to the surface of the substrate layer 18. Thus, when viewed from the vehicle interior, the opening 22 may appear to be illuminated. In certain embodiments, the light-emitting device 32 may be configured to emit a blue light, while in other embodiments, the light-emitting device 32 may be configured to emit any suitable color of light (e.g., white, blue, red, yellow, green, etc.). The light-emitting device 32 may be any suitable type of light-emitting device, such as an LED. By using side lighting devices and by disposing the substrate layer 18 directly on the PCB layer 30, the gauge 16 may be thinner than gauges that use backlighting or gauges manufactured using other manufacturing techniques.
FIG. 4 is a front view of an embodiment of a gauge 38 illuminated by a back-lighting light source. The gauge 38 includes a substrate layer 40 with a decorative layer 41 formed directly thereon. Similar to the substrate layer 18, the substrate layer 40 may be manufactured using any suitable material. For example, the substrate layer 40 may be manufactured from an acrylic based material, or another polymeric material. Moreover, in certain embodiments, the substrate layer 40 may be manufactured from a light-transmissive material that facilitates light transmission therethrough. The substrate layer 40 includes an opening 42 that extends through the substrate layer 40 to facilitate light transmission from a light-emitting device (e.g., from a light-emitting device located behind the substrate layer 40) to the vehicle interior.
The decorative layer 41 is formed directly onto the substrate layer 40 using any suitable manufacturing technique. For example, the decorative layer 41 may be formed directly onto the substrate layer 40 using IMD technology, mold behind technology, painting technology, laser etching technology, hot-foil transfer technology, direct printing technology, and so forth. As such, the substrate layer 40 and the decorative layer 41 may be formed together during the molding process, thereby reducing manufacturing time and cost.
The decorative layer 41 includes decorative elements 43 and 44. The decorative element 43 may be colored to block light transmission through the substrate layer 40. For example, the decorative element 43 may be formed on the substrate layer 40 using a painting material. Moreover, the decorative elements 44 may be portions of the decorative layer 41 where the decorative element 43 is not applied, thereby enabling light to be emitted from the substrate layer 40. The gauge 38 may also include a dial having an arm 46 and a hub 47 each configured to be illuminated.
FIG. 5 is a cross-sectional view of the gauge 38 of FIG. 4. As illustrated, the substrate layer 40 is disposed over (e.g., directly on) a light guide layer 48. Moreover, the light guide layer 48 is disposed over a PCB layer 50. Light-emitting devices 54, 56, and 58 are electrically coupled to the PCB layer 50. The light-emitting devices 54, 56, and 58 are back lighting devices configured to emit light rays in the direction 28 perpendicular to the surface of the PCB layer 50. The light-emitting device 58 is configured to emit light through a shaft 60 to illuminate the hub 47 of the dial. The light guide layer 48 includes a passageway over the light-emitting device 54 having chamfered or angled edges 62 to direct light from the light-emitting device 54 toward the substrate layer 40. Moreover, the substrate layer 40 includes a passageway having chamfered or angled edges 64 to direct light from the light-emitting device 54 through the substrate layer 40, thereby illuminating portions of the gauge 38. The light guide layer 48 also includes a passageway over the light emitting device 56 having chamfered or angled edges 66 to direct light from the light-emitting device 56 toward the substrate layer 40. The substrate layer 40 over the light-emitting device 56 may include openings to enable light rays to pass through the substrate layer 40, and/or a portion of the decorative layer 41 may be absent over the light-emitting device 56, thus enabling light rays to pass through the substrate layer 40. By manufacturing the substrate layer 40 according to the techniques described herein, the substrate layer 40 may include light guiding features, yet have a small thickness. For example, the substrate layer 40 may include chamfered edges 64 to direct light rays through the substrate layer 40.
FIG. 6 is another cross-sectional view of the gauge 38 of FIG. 4. As illustrated, the substrate layer 40 may facilitate transmission of only certain light emissions therethrough. The transparency of the substrate layer 40 may be configured to enable certain light rays 68 from the light-emitting device 56 to pass through the substrate layer 40, and to block other light rays 68 from passing through the substrate layer 40. As may be appreciated, light rays 68 from the light-emitting device 56 each contact the substrate layer 40 at an angle of incidence. Accordingly, the substrate layer 40 may enable certain light rays 68 to be transmitted through the substrate layer 40 when an angle of incidence of the light rays is less than or equal to a predetermined angle (e.g., 5, 10, 15 degrees, and so forth). Moreover, the substrate layer 40 may block light emissions from being transmitted through the substrate layer 40 when the angle of incidence of the light rays is greater than the predetermined angle. For example, the substrate layer 40 may enable light rays 70 to be transmitted through the substrate layer 40, and the substrate layer 40 may block light rays 72 from being transmitted through the substrate layer 40. Thus, the substrate layer 40 may be configured to enable and/or block light rays 68 from the light-emitting device 56 based on an angle of incidence of light rays from the light-emitting device 56. Accordingly, the light rays 70 emitted from the substrate layer 40 may be limited to facilitate lighting desired portions of the substrate layer 40.
FIG. 7 is a front view of an embodiment of another gauge 74 illuminated by a back-lighting light source. The gauge 74 is positioned so that part of the gauge 74 covers (e.g., is directly over) the light guide layer 48 and the PCB layer 50, while part of the gauge 74 does not cover (e.g., is not directly over) the light guide layer 48 and the PCB layer 50. With the gauge 74 positioned in this manner, a light-emitting device positioned under the substrate layer 40 of the gauge 74 may be used to illuminate the gauge 74.
FIG. 8 is a cross-sectional view of the gauge 74 of FIG. 7. As illustrated, a light-emitting device 76 is positioned under the substrate layer 40 and is used to illuminate the gauge 74. Specifically, light rays 78 emitted from the light-emitting device 76 are directed toward a chamfered edge 80 of the substrate layer 40. The upper surface of the chamfered edge 80 may include the decorated layer 41. Further, a back side of the decorated layer 41 may be configured to reflect light rays. Thus, when the light rays 78 contact the chamfered edge 80, the light rays 78 are reflected in the direction 26 through the substrate layer 40, as illustrated by arrow 82. Moreover, additional features of the substrate layer 40 direct light rays out of the substrate layer 40, as illustrated by arrows 84. Accordingly, the substrate layer 40 may be manufactured to direct light rays 78 through the substrate layer 40 and away from the substrate layer 40. As such, an additional light guide layer may be obviated, thereby reducing the thickness of the gauge 74.
FIG. 9 is a flow chart of an embodiment of a method 96 for manufacturing an illuminated vehicle interior component, such as an illuminated gauge, gauge cluster, graphics plate, touch panel, touch device, switch, capacitive switch, indicator, control, and so forth. A light-transmissive substrate layer (e.g., substrate layer 18, 40) is formed (block 98). The light-transmissive substrate layer is configured to be disposed over a PCB layer (e.g., PCB layer 30, 50). Moreover, the light-transmissive substrate layer is configured to receive light from a light-emitting device coupled to the PCB layer and to illuminate at least a portion of the illuminated vehicle interior component. A decorative layer (e.g., decorative layer 19, 41) is formed directly onto the light-transmissive substrate layer (block 100). As discussed above, the decorative layer may be formed directly onto the light-transmissive substrate layer using an IMD technique, a mold behind technique, a painting technique, a laser etching technique, a hot-foil transfer technique, a direct printing technique, or any suitable manufacturing technique. Accordingly, the light-transmissive substrate layer and the decorative layer may be formed together in a single manufacturing operation. In certain embodiments, the light-transmissive substrate layer may be etched to form angles and/or openings in the light-transmissive substrate layer, thereby facilitating light from the light-emitting device to be directed through the light-transmissive substrate layer to illuminate at least a portion of the illuminated vehicle interior component (block 102). Thus, the illuminated vehicle interior component may be manufactured to have a thickness that is substantially less than traditional illuminated vehicle interior components, thereby occupying less space in an instrument panel. Moreover, by forming the decorative layer and the light-transmissive substrate layer during a single molding process, manufacturing time and cost may be reduced.
As may be appreciated, the PCB layers 30 and 50 described herein may be a printed circuit board, a flexible printed circuit, or any other suitable printed circuit layer.
While only certain features and embodiments of the invention have been illustrated and described, many modifications and changes may occur to those skilled in the art (e.g., variations in sizes, dimensions, structures, shapes and proportions of the various elements, values of parameters (e.g., temperatures, pressures, etc.), mounting arrangements, use of materials, colors, orientations, etc.) without materially departing from the novel teachings and advantages of the subject matter recited in the claims. The order or sequence of any process or method steps may be varied or re-sequenced according to alternative embodiments. It is, therefore, to be understood that the appended claims are intended to cover all such modifications and changes as fall within the true spirit of the invention. Furthermore, in an effort to provide a concise description of the exemplary embodiments, all features of an actual implementation may not have been described (i.e., those unrelated to the presently contemplated best mode of carrying out the invention, or those unrelated to enabling the claimed invention). It should be appreciated that in the development of any such actual implementation, as in any engineering or design project, numerous implementation specific decisions may be made. Such a development effort might be complex and time consuming, but would nevertheless be a routine undertaking of design, fabrication, and manufacture for those of ordinary skill having the benefit of this disclosure, without undue experimentation.
Patent Application
20150298609
