The present disclosure relates to an illumination device and a display device.
As an illumination device, a device has been known in which light sources are respectively arranged on both upper and lower sides of a light guide plate (Japanese Unexamined Patent Application Publication No. 2014-92699).
In a configuration in which light sources are respectively arranged on both upper and lower sides of the light guide plate as in Japanese Unexamined Patent Application Publication No. 2014-92699, air warmed by heat generated from the first light source arranged on the lower side goes up, and the light source arranged on the upper side is warmed by the air. Therefore, there is concern that the light source arranged on the upper side becomes high temperature as compared with the light source arranged on the lower side. When the light source becomes high temperature, there is concern of deterioration of light emission efficiency and product life of the light source and melting of the light guide plate facing the light source.
When the light sources are respectively arranged on both upper and lower sides of the light guide plate, it is desirable to suppress a situation in which the light source arranged on the upper side becomes high temperature.
According to an aspect of the disclosure, there is provided an illumination device including a first light source, a second light source which is arranged vertically above the first light source and whose power consumption is smaller than power consumption of the first light source, and a light guide plate having a first light incident surface which is composed of a surface facing the first light source and through which light emitted from the first light source enters, a second light incident surface which is composed of a surface facing the second light source and through which light emitted from the second light source enters, and a light emitting surface which is composed of one plate surface and from which light incident from the first light incident surface and the second light incident surface is emitted.
A first embodiment of the present disclosure will be described with reference to
As shown in
As shown in
The chassis 21 is composed of a metal plate such as, for example, an aluminum plate or an electrogalvanized steel plate (SECC). As shown in
As shown in
As shown in
Next, configurations of the LED units 30 and 40 will be described. The LED unit 30 and the LED unit 40 are the same components, but their mounting positions and mounting postures are different. In the present embodiment, the LED unit arranged on the vertically lower side is the LED unit 30 and the LED unit arranged on the vertically upper side is the LED unit 40. The number of LEDs 32 included in the LED unit 30 and the number of LEDs 32 included in the LED unit 40 are the same, and gaps between the plurality of LEDs 32 included in the LED unit 30 and gaps between the plurality of LEDs 32 included in the LED unit 40 are the same. The LED 32 has a configuration where an LED chip is sealed on a substrate portion fixed to the LED substrate 31 with a resin material. A main emission wavelength of the LED chip mounted on the substrate portion is one type. Specifically, the LED chip emits single color light of blue. On the other hand, a phosphor, which is excited by blue light emitted from the LED chip and emits light of a predetermined color, is dispersed and mixed in the resin material that seals the LED chip, so that the LED chip emits substantially white light as a whole. The configuration of the LED 32 is not limited to the configuration described above. The LED 32 is a so-called top-surface emitting-type LED, in which a surface opposite to a surface mounted to the LED substrate 31 is a light emitting surface.
As shown in
As shown in
The light guide plate 50 is composed of a nearly transparent (highly translucent) synthetic resin material (for example, acrylic resin such as PMMA, polycarbonate, or the like) whose refractive index is sufficiently higher than that of air. As shown in
The light incident surface 51 is a surface facing the LED unit 30 (more specifically, light emitting surfaces 35 of the LEDs 32 included in the LED unit 30) of a pair of end surfaces on the long side and is a surface through which light emitted from the LEDs 32 of the LED unit 30 enters. The light incident surface 51 (first light incident surface) is a surface facing vertically downward. The plurality of LEDs 32 (unit light sources) included in the LED unit 30 are aligned at the same intervals along the light incident surface 51.
The light incident surface 52 is a surface facing the LED unit 40 (more specifically, light emitting surfaces 36 of the LEDs 32 included in the LED unit 40) of a pair of end surfaces on the long side and is a surface through which light emitted from the LEDs 32 of the LED unit 40 enters. The light incident surface 52 (second light incident surface) is a surface facing vertically upward. The plurality of LEDs 32 (unit light sources) included in the LED unit 40 are aligned at the same intervals along the light incident surface 52. The light guide plate 50 has a function to raise the light, which enters from the pair of light incident surfaces 51 and 52, toward the optical member 22 (toward the front side) while propagating the light inside the light guide plate 50, and emit the light from the light emitting surface 53.
As shown in
Further, a light-reflecting portion 60 (see
As described above, the current supplied to the LED substrate 31 of the LED unit 40 is lower than the current supplied to the LED substrate 31 of the LED unit 30, and the power consumption of the LED unit 40 is smaller than power consumption of the LED unit 30. Thereby, an amount of heat generation of the LED unit 40 can be smaller than an amount of heat generation of the LED unit 30. As a result, it is possible to suppress a situation in which the LED unit 40 becomes high temperature when air warmed by the heat generated from the LED unit 30 moves upward. However, an amount of light emission of the LED unit 40 to which a relatively low current is supplied is smaller than an amount of light emission of the LED unit 30. When there is a difference between the amount of light emission of the LED unit 40 and the amount of light emission of the LED unit 30, there is concern that unevenness occurs in the light emitted from the light emitting surface 53 of the light guide plate 50. Therefore, the light-reflecting portion 60 of the present embodiment has a configuration in which the unevenness of the light emitted from the light emitting surface 53, which is generated due to the difference between the amount of light emission of the LED unit 40 and the amount of light emission of the LED unit 30, can be reduced.
As shown in
The larger the area of the dot 61, the more the light can be emitted from the light emitting surface 53. The farther the dot 61 is arranged away from the LED units 30 and 40, the larger the area of the dot 61. The dot 61 having the largest area (the dot is denoted by reference symbol 61A) is arranged at a position nearer to the LED unit 40 than to the LED unit 30. Therefore, the farther the light-reflecting portion 60 is away from the LED units 30 and 40, the larger the area of the light-reflecting portion 60 per unit area (the area density of the light-reflecting portion 60) within the surface of the plate surface 54, and a position where the area of the light-reflecting portion 60 is the largest is eccentrically located close to the LED unit 40.
Next, effects of the present embodiment will be described. In the present embodiment, the power consumption of the LED unit 40 is smaller than the power consumption of the LED unit 30. Thereby, the amount of heat generation of the LED unit 40 can be smaller than the amount of heat generation of the LED unit 30. As a result, it is possible to suppress a situation in which the LED unit 40 becomes high temperature when air warmed by the heat generated from the LED unit 30 moves upward (toward the LED unit 40). Thereby, it is possible to suppress deterioration of light emission efficiency and product life of the LEDs 32 included in the LED unit 40, damage of the LED substrate 31 due to high temperature, and a situation where melting of the light guide plate 50 occurs. When the LED unit 40 becomes high temperature, there is concern that a crack occurs in the solder 34 due to thermal expansion of the solder 34. However, such a situation can also be suppressed.
Further, the light-reflecting portion 60 is included which promotes light emission from the light emitting surface 53 by reflecting the light entering into the light guide plate 50 to the light emitting surface 53 and in which regarding distribution of an area where the light-reflecting portion 60 exists per unit area within the surface of the plate surface 54, the farther the area is away from the LED unit 30 and the LED unit 40, the larger the area is, and a position where the area is the largest is eccentrically located close to the LED unit 40.
When the power consumption of the LED unit 40 is smaller than the power consumption of the LED unit 30, the amount of light emission of the LED unit 40 is smaller than the amount of light emission of the LED unit 30, so that there is concern that luminance unevenness occurs in the light emitted from the light emitting surface 53 of the light guide plate 50. Therefore, in the above configuration, the light-reflecting portion 60 is included which reflects the light entering into the light guide plate 50 to the light emitting surface 53, and for the light-reflecting portion 60, regarding distribution of an area where the light-reflecting portion 60 exists per unit area within the plate surface 54 of the light guide plate 50, a position where the area is the largest is eccentrically located close to the LED unit 40. By doing so, it is possible to promote emission of light from a position close to the LED unit 40 in the light emitting surface 53. As a result, when the amount of light emission of the LED unit 40 is smaller than the amount of light emission of the LED unit 30, it is possible to suppress a situation in which luminance at a position close to the LED unit 40 on the light emitting surface 53 is lower than luminance at a position close to the LED unit 30, so that it is possible to suppress the luminance unevenness.
Further, the LED drive substrate 29 is included which supplies current to the LED unit 30 and the LED unit 40 and supplies current, which is lower than current supplied to the LED unit 30, to the LED unit 40. By supplying low current to the LED unit 40, it is possible to reduce the power consumption of the LED unit 40.
The LED unit 30 includes a plurality of LEDs 32 aligned at the same intervals along the light incident surface 51, and the LED unit 40 includes a plurality of LEDs 32 aligned at the same intervals along the light incident surface 52. The number of LEDs 32 included in the LED unit 30 and the number of LEDs 32 included in the LED unit 40 are the same, and gaps between the plurality of LEDs 32 included in the LED unit 30 and gaps between the plurality of LEDs 32 included in the LED unit 40 are the same. By doing so, the LED unit 30 and the LED unit 40 can be the same members, so that it is possible to reduce cost related to manufacturing.
Next, a second embodiment of the present embodiment will be described with reference to
The present disclosure is not limited to the embodiments explained by the above description and the drawings, and for example, the following embodiments are included in a technical scope of the present disclosure.
(1) While the liquid crystal display device using a liquid crystal panel as a display panel is illustrated in the embodiments described above, the present disclosure can be applied to a display device using other types of display panel.
(2) While an LED is used as a light source in the embodiments described above, an organic EL or the like can also be used as a light source.
(3) In the embodiments described above, a configuration in which the LED unit 30 and the LED unit 40 has the same type of LEDs 32 is illustrated. However, the configuration is not limited to this. For example, the LEDs included in the LED unit 40 and the LEDs included in the LED unit 30 may be different from each other. For example, the power consumption of the LED unit 40 may be made smaller than the power consumption of the LED unit 30 by reducing the number of LED chips (LED elements) of an LED included in the LED unit 40 to less than the number of LED chips of an LED included in the LED unit 30.
(4) The light incident surface of the light guide plate 50 may be other than an end surface of the light guide plate 50. For example, in the light guide plate 50, a circumferential end portion of a plate surface opposite to the light emitting surface may be the light incident surface.
(5) The dot pattern that forms the light-reflecting portion of the light guide plate is not limited to the dot pattern illustrated in
The present disclosure contains subject matter related to that disclosed in Japanese Priority Patent Application JP 2018-030607 filed in the Japan Patent Office on Feb. 23, 2018, the entire contents of which are hereby incorporated by reference.
It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and alterations may occur depending on design requirements and other factors insofar as they are within the scope of the appended claims or the equivalents thereof.
Number | Date | Country | Kind |
---|---|---|---|
2018-030607 | Feb 2018 | JP | national |