Patent Grant
11965629
The present application relates to the technical field of illumination. More particularly, the present application relates to an illumination device adopting an optical component which comprises a light transmission portion and sealing portions integrally prepared by co-extruding a hard material and a soft material, and a lamp comprising the illumination devices.
A lamp using light-emitting diode (LED) chips has characteristics of high luminous efficiency, power reduction and long service life, and therefore is applied more and more widely. However, when the LED chip emits light, the temperature of the LED chip itself increases continuously, and in a continuous illumination operation, if heat generated by the LED chip cannot be dissipated in time, the LED chip will be damaged. Therefore, the problem of heat dissipation in lamps using LED chips has been a concern in the industry.
In addition, due to the sensitivity of the LED chip to water vapor and moisture, if the water resistance and moisture penetration resistance of a lamp housing of an LED lamp are poor, the possibility of LED lamp failure will be increased.
In a traditional common LED lamp as shown in
In view of the heat dissipation problem of the housing of the LED lamp, a corn lamp is proposed. As shown in
Additionally, the enclosed design of the traditional common LED lamp of
In addition, in the prior art, in order to solve the heat dissipation problem and the water resistance problem of the LED lamp, Chinese patent publication no. CN 103910987 A discloses an integrated LED lamp housing comprising a heat radiation portion and a light transmission portion, so as to improve the moisture resistance and/or water resistance performance of the LED lamp housing and the thermal conductivity of the LED lamp housing. Further, Korean patent No. KR 100949106 B1 discloses a lamp housing of an LED lamp, the lamp housing comprising a light transmission portion formed at one half side of the lamp housing and a heat dissipation unit formed at the other half side of the lamp housing. However, as the LED lamp housings disclosed in the two prior art documents are still integrated as shown in
The main purpose of the present application is to obtain a water resistance function without reducing the light efficiency of an LED lamp, while still maintaining good heat dissipation performance.
In order to solve the heat dissipation problem, the water resistance problem and the problem of low light efficiency of an LED lamp, the present application proposes an illumination device in which a LED chip strip is enclosed by an integrated optical component which comprises a light transmission portion and sealing portions integrally prepared by co-extruding a hard material and a soft material, so that the illumination device and an LED lamp composed of the illumination devices can have an excellent heat dissipation performance, an excellent water resistance performance and a high light efficiency, and this also provides easier assembly (only requiring one step: i.e. inserting an optical component) and lower cost.
According to an embodiment of the present application, an illumination device is provided. The illumination device comprises a support structure and light-emitting component, the light-emitting component being provided on one side of the support structure, and an opening being provided on a side of the support structure opposite to the light-emitting component; wherein the illumination device further comprises an optical component cooperating with the opening of the support structure to form an accommodating space, the light-emitting component are accommodated in the accommodating space, and the optical component comprises: a light transmission portion provided above light-emitting side of the light-emitting component and configured to transmit light from the light-emitting component, the light transmission portion having edge portions, and the light transmission portion cooperating with the opening of the support structure by means of the edge portions so as to form the accommodating space; and sealing portions provided along the edge portions of the light transmission portion; the light transmission portion and the sealing portions are formed integrally.
In this manner, LED chip strip is enclosed by using an integrated optical component comprising a light transmission portion and sealing portions, so that the illumination device formed in this way and a lamp formed by a plurality of such illumination devices can have an excellent heat dissipation performance, an excellent water resistance performance and a high light efficiency, and this also provides easier assembly (only requiring one step: i.e. inserting an optical component) and lower cost.
Further, according to an embodiment of the present application, the light transmission portion comprises: a main body portion configured to transmit the light from the light-emitting component; and fixing portions provided along the edge portions of the main body portion and configured to fix the main body portion on the support structure, wherein the fixing portions and the sealing portions are formed on the same surface of the main body portion, and the fixing portions are formed on inner sides or outer sides of the sealing portions with respect to edges of the edge portions.
In this way, the optical component can be more easily assembled onto the support structure, thereby reducing the assembly time and the labor costs.
Further, according to an embodiment of the present application, each of the sealing portions comprises: an embedded portion, the embedded portion extending from the surface of the main body portion to the interior of the main body portion, so as to be embedded in the main body portion; and a protruding portion, the protruding portion protruding outward from the surface of the main body portion.
In this way, the sealing portions are not easily separated from the light transmission portion, so that the optical component can be less likely damaged and the yield of the optical component can be increased.
Further, according to an embodiment of the present application, the embedded portion has a thread shape so as to be tightly embedded in the main body portion, or the embedded portion has a reverse cone shape extending from the interior of the main body portion to the surface of the main body portion, such that the embedded portion is embedded in the main body portion in an inverted snap form.
In this way, the degree of engagement between the sealing portions and the light transmission portion can be further increased.
Further, according to an embodiment of the present application, the main body portion is formed as a rectangular flat plate, and the sealing portions and the fixing portions are provided along two long sides of the flat plate.
Further, according to an embodiment of the present application, the fixing portions are formed as a clamping strip shape so as to fix the main body portion to the support structure in a snap-fitting manner.
In this way, the optical component can be mounted into the support structure in an insertion manner, so as to achieve fitting between the optical component and the opening of the support structure, and thus the optical component can be more easily assembled onto the support structure, thereby being able to reduce the assembly time and the labor costs.
Further, according to an embodiment of the present application, the sealing portions are provided along at least a part of each of the edge portions of the light transmission portion.
In this manner, the water-resistance sealing function of the illumination device can be achieved while the cost of the optical component can be reduced.
Further, according to an embodiment of the present application, the light transmission portion is made of transparent polycarbonate, polymethyl methacrylate (PMMA), or polystyrene resin, and the sealing portions are made of a thermoplastic rubber or a silicone resin.
Further, according to an embodiment of the present application, the sealing portions are made of a transparent, translucent or colored material.
Further, according to an embodiment of the present application, the melting temperature range of the material forming the light transmission portion is 175° C. to 185° C., and the melting temperature range of the material forming the sealing portions is 155° C. to 165° C.
Further, according to an embodiment of the present application, the support structure comprises a heat dissipation component for dissipating heat generated by the light-emitting component, and the light transmission portion is fixed on the heat dissipation component.
Further, according to an embodiment of the present application, the heat dissipation component comprises engagement portions, wherein the engagement portions comprise slots for receiving the sealing portions, and the light transmission portion seals the slots and is fixed to the engagement portions.
In this manner, excellent water resistance performance and heat dissipation performance of the illumination device can be achieved without making large changes to the structure of the illumination device.
Further, according to an embodiment of the present application, the light-emitting component comprises a light-emitting strip having a plurality of LED chips.
Further, according to an embodiment of the present application, the light transmission portion and the sealing portions are integrally formed by co-extrusion.
According to another embodiment of the present application, a lamp is provided. The lamp comprises a plurality of the described illumination devices.
Compared to lamps as shown in
Further, according to an embodiment of the present application, a plurality of illumination devices is combined together to form a cavity, wherein the cavity comprises a first open end and a second open end, and the lamp further comprises: a package provided at the first open end; and a cover component provided at the second end, wherein through holes are provided on end walls of the cover component and the package member and communicate with each other.
In this way, air convection can be formed in the cavity, so that heat in the cavity is quickly taken out, thereby increasing the heat dissipation efficiency.
By means of the illumination device of the embodiments of the present application applying the optical component proposed in the present application, as the main body portion of the housing of the illumination device and the main body portion of the housing of the lamp composed of a plurality of illumination devices is composed of light transmission portions, the light efficiency of the illumination device and the lamp composed thereby can be increased. Further, as the main body portion of the housing of the lamp composed of a plurality of illumination devices is not integrally formed, but formed by connecting the plurality of illumination devices, the heat dissipation performance of the lamp can be improved. In addition, as the optical component comprises sealing portions formed integrally with the light transmission portion, good water resistance performance of the illumination device and the lamp, simplified assembly, and reduction of labor cost can be achieved.
The drawings of the description, constituting a part of the present application, are used for providing further understanding of the present application and the illustrative embodiments of the present application and illustrations thereof are used to explain the present application, rather than constitute inappropriate limitation on the present application. In the drawings:
It is to be noted that embodiments and the features in the embodiments of the present application can be combined with each other without conflicts. Hereinafter, the present application will be described in detail with reference to the accompanying drawings in combination with the embodiments.
It is to be noted that unless otherwise indicated, all technical and scientific terms used in the present application have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs.
In the present application, unless specified to the contrary, the directional terms such as “upper”, “lower”, “top”, and “bottom” are generally used for the directions shown in the figures, or for the components themselves in vertical, perpendicular, or gravity directions; and likewise, for ease of understanding and description, “internal, external” refer to internal and external relative to the outline of each component itself, but the described directional terms are not used to limit the present application.
As shown in
In this example, the light-emitting component 22 is an LED light strip having a plurality of LED chips. The illumination portion 2 formed by a plurality of illumination devices 20 may have a polygonal cross section, and the lamp base 1 may have a circular cross section. The axis of the lamp base 1 coincides with the axis of the illumination portion 2.
As shown in
In addition, it is to be noted that the light transmission portion 5 herein may transmit light by refracting the light from the light-emitting component 22.
Specifically, the light transmission portion 5 comprises: a main body portion 51, configured to transmit the light from the light-emitting component 22; and fixing portions 52, provided along the two edge portions 50 of the main body portion 51 and configured to fix the main body portion 51 on the support structure 21, wherein the fixing portions 52 and the sealing portions 6 may be provided along the two opposite edge portions 50 of the same surface of the main body portion 51, and optionally, the fixing portions 52 and the sealing portions 6 may be provided along at least a part of each of the two opposite edge portions 50 of the main body portion 51 of the light transmission portion 5.
As an example, as shown in
The fixing portions 52 and the sealing portions 6 are formed on the same surface of the main body portion 51, and preferably the fixing portions 52 may be formed at the inner sides of the sealing portions 6 with respect to the edges of respective edge portions 50 of the two opposite edge portions 50. As shown in
Further, as shown in the partially enlarged view of
Alternatively, as shown in
As shown in
Further, the light transmission portion 5 may be made of a light transmission resin such as transparent polycarbonate, polymethyl methacrylate (PMMA), or a polystyrene resin, and the sealing portions 6 may be made of a thermoplastic rubber or a silicone resin. The materials for producing the light transmission portion 5 and the sealing portions 6 of the present application are not limited to the described examples, and any hard material that can realize the function of the light transmission portion 5 and any soft material that can realize the sealing function of the sealing portions 6 can be used. The melting temperature range of the material forming the light transmission portion 5 may be 175° C. to 185° C., and the melting temperature range of the material forming the sealing portions 6 may be 155° C. to 165° C., so as to facilitate the co-extrusion of the light transmission portion 5 and the sealing portions 6.
Furthermore, preferably, the sealing portions 6 may be made of a transparent, translucent or colored material.
According to embodiments of the present application, the assembly of the optical component 24 and the support structure 21 can be completed by one step of inserting the optical component 24 into the support structure 21 of the illumination device 20, thereby manufacturing the illumination device 20, as described with reference to
Referring back to
In the embodiments of the present application, as shown in
By means of the illumination device of the embodiments of the present application applying the optical component proposed in the present application, as the main body portion of the housing of the illumination device and the main body portion of the housing of the lamp composed of a plurality of illumination devices is composed of light transmission portions, the light efficiency of the illumination device and the lamp composed thereby can be increased. Further, as the main body portion of the housing of the lamp composed of a plurality of illumination devices is not integrally formed, but formed by connecting the plurality of illumination devices, the heat dissipation performance of the lamp can be improved. In addition, as the optical component comprises sealing portions formed integrally with the light transmission portion, good water resistance performance of the illumination device and the lamp, simplified assembly, and reduction of labor cost can be achieved.
Apparently, the described embodiments are merely a part rather than all of the embodiments of the present application. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present application without any inventive effort shall all fall within the scope of protection of the present application.
It should be noted that the terms used herein are for the purpose of describing particular embodiments only and are not intended to limit exemplary embodiments in accordance with the present application. As used herein, the singular form is intended to comprise the plural form as well, unless the context clearly indicates otherwise, and further it should be understood that the terms “comprises” and/or “comprising” when used in the present description, specify the presence of features, steps, operations, devices, components and/or combinations thereof.
It should be noted that the terms “first”, “second” etc., in the description, claims, and accompanying drawings of the present application are used to distinguish similar objects, and are not necessarily used to describe a specific sequence or order. It should be understood that the terms so used may be interchanged where appropriate so that the embodiments of the present application described herein can be implemented in sequences other than those illustrated or described herein.
The described content merely relates to preferable embodiments of the present application and is not intended to limit the present application. For a person skilled in the art, the present application may have various modifications and variations. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall all belong to the scope of protection of the present application.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202110898075.6 | Aug 2021 | CN | national |
This application is a continuation of U.S. patent application Ser. No. 17/881,385, filed Aug. 4, 2022, now granted as U.S. Pat. No. 11,698,171, which claims the benefit of Chinese Patent Application Serial Number 202110898075.6, filed Aug. 5, 2021, both of which are herein incorporated by reference.
| Number | Name | Date | Kind |
|---|---|---|---|
| 11698171 | Huang | Jul 2023 | B2 |
| 20100284188 | Chen et al. | Nov 2010 | A1 |
| 20150029735 | Scordino et al. | Jan 2015 | A1 |
| Number | Date | Country |
|---|---|---|
| 103910987 | Jul 2014 | CN |
| 210601095 | May 2020 | CN |
| 100949106 | Mar 2010 | KR |
| Number | Date | Country | |
|---|---|---|---|
| 20240003506 A1 | Jan 2024 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 17881385 | Aug 2022 | US |
| Child | 18325642 | US |
