1. Technical Field
The disclosure relates generally to illumination, and more particularly to an illumination device with efficient heat-dissipation.
2. Description of the Related Art
In general, an LED-based illumination device employs a heat-dissipation module, such as a fan, a passive heat sink, or other, for dissipation of generated heat. When the fan is employed, the illumination device is bulky and expensive. When the passive heat sink is employed, however, efficiency of heat dissipation suffers. Thus, what is called for is an illumination device utilizing a heat-dissipation system that can overcome the limitations described.
Referring to
The cover 11 is hollow and semi-cylindrical. The cover 11 is transparent glass or a synthetic resin. Optimally, a plurality of saw-toothed micro-structures 112 is formed on an inner surface 111 of the cover 11, uniformly transmitting the light from the light emitting units 13 out.
The heat-dissipation module 12 includes a main body 121 and two mounting plates 122. The main body 121 is hollow and semi-cylindrical. A slot (not labeled) is defined between the two mounting plates 122 in the main body 121. The heat-dissipation module 12 is of heat conductive material. Preferably, the heat-dissipation module 12 is made of metal such as aluminum, steel or copper.
The light emitting units 13 are mounted on the mounting plates 122 and opposite to the cover 11. The light emitting units 13 are thermally connected to the mounting plates 122. The light emitting units 13 are LEDs 13.
Optimally, the illumination device 10 further includes a reflecting shell 14 and two connectors 15. The reflecting shell 14 is received in an interior 123 of the illumination device 10. The reflecting shell 14 is connected to the mounting plates 122. The reflecting shell 14 has a curved reflective surface 141. The curved reflective surface 141 is opposite to the cover 11. The cover 11 and the heat-dissipation module 12 are secured by the connectors 15 which further connect the illumination device 10 to the peripheral devices. The peripheral devices in this embodiment are sockets (not shown) of a standard fluorescent lamp fixture (not shown) whereby an external electric power can be supplied to the illumination device 10.
The light emitting units 13 are mounted on the mounting plates 122 of the heat-dissipation module 12. The heat-dissipation module 12 is configured for dissipating heat generated by the light emitting units. The cover 11 and the main body 121 together have a tubular configuration like a standard fluorescent bulb. Particularly referring to
Referring to
The main body 221 of the heat-dissipation module 22 is essentially conical with truncated ends. The mounting plate 222 is annular and connected to an end (i.e., top end) of the main body 221. The light emitting units 23 are mounted on the mounting plate 222. The light emitting units 23 are thermally connected to the mounting plate 222. An arced cover 21 made of transparent glass or plastic is mounted on an outer edge of the mounting plate 222. An arced reflecting shell 24 is mounted on an inner edge of the mounting plate 222, located below and enclosed by the cover 21. The light emitting units 23 surround an arced outer reflective surface (not labeled) of the reflecting shell 24 and located between the cover 21 and the reflecting shell 24.
A connector 25 is mounted on an opposite end (i.e., bottom end) of the main body 221 for electrically connecting the illumination device 20 to a peripheral device, which according to this embodiment is a lamp socket for a standard incandescent bulb. The connector 25 is formed with a plurality of threads thereon. Particularly referring to
Referring to
A slot 3231 is defined between the mounting plates 322 in the main body 321. The mounting plate 322 includes a plurality of recessed mounting portions 324. The mounting portion 324 include a mounting surface 3241 at a bottom thereof and a reflecting surface 3242 above and surrounding the mounting surface 3241. The reflecting surface 3242 is adjacent to the mounting surface 3241. The light emitting unit 33 is mounted on the mounting surface 3241 of the mounting portion 324.
In this embodiment, the lens 36 received in the interior 323 of the illumination device 30 is horizontally mounted to an inner surface of the transparent cover 31 and located above the light emitting units 33. The lens 36 includes a light incident surface 361 and a plurality of micro-structures 362. The micro-structures 362 are formed on the light incident surface 361. The micro-structures 362 are configured for diffusing the light from the light emitting units 33, which are LEDs 33. The lens 36 is configured for uniformly transmitting the light therethrough. The micros-structures 362 have a saw-toothed configuration.
The angle between the mounting plates 322 and the main body 321 is determined by the required light emitting angle of the illumination device 30. A part of light generated by the LEDs 33 is reflected by the reflecting surfaces 3242 to radiate out of the illumination device 30, whereby a more even illumination can be obtained.
Because the heat-dissipation modules 12, 22, 32 disclosed dissipate heat generated by the LEDs 13, 23, 33, the heat-dissipation efficiency of the illumination devices 10, 20, 30 is increased effectively. Moreover, the efficiency of the illumination devices 10, 20, 30 is improved by use of the reflecting shells 14, 24 and the reflective surfaces 3242 and the lens 36.
While the disclosure has been described by way of example and in terms of exemplary embodiment, it is to be understood that the disclosure is not limited thereto. To the contrary, it is intended to cover various modifications and similar arrangements (as would be apparent to those skilled in the art). Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications and similar arrangements.
Number | Date | Country | Kind |
---|---|---|---|
200910303950.0 | Jul 2009 | CN | national |