Patent Application
20110038165
This application claims the priority benefit of China application serial no. 200910162734.9, filed on Aug. 12, 2009. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
1. Field of the Invention
The invention relates to an illumination system. More particularly, the invention relates to an illumination system having a heat dissipation guiding board.
2. Description of Related Art
Recently, with continuous improvement of luminance and light emitting efficiency of a light emitting diode (LED), the LED acting as a light source is more applicable to an illumination system. Nonetheless, heat is generated during operation of the LED and the heat may result in reduction of light emitting efficiency of the LED. Therefore dissipating the heat generated by the LED to make the LED operate within an appropriate working temperature range is important.
At present, a method of dissipating the heat of an LED lamp includes natural heat convection and forced heat convection. In the natural heat convection, a heat sink occupying a significant area is required, and a casing of the LED lamp with a number of complicated openings may be needed, such that the heat may be transferred to external surroundings through the heat sink. By contrast, in the forced heat convection, transfer of heat to the external surroundings results from a fan blowing hot air to the heat sink. References related to heat dissipation of the lamp by applying the forced heat convection include Taiwan patents Nos. 416531, M298074, M321141, M353313, M341798, and Taiwan patent application publication No. 200819866.
The invention is directed to an illumination system having favorable heat dissipation efficiency.
Additional aspects and advantages of the invention may be comprehended to a great extent by referring to descriptions of technical features disclosed in the invention.
In an embodiment of the invention, an illumination system including a casing, a light source, a fan, a heat dissipation guiding board, and a power supply is provided. The casing has an air inlet and an air outlet. The light source is disposed in the casing and capable of generating an illumination beam emitting out of the casing. The fan is disposed in the casing and capable of guiding cooling air flow to the air inlet and the air outlet in sequence. The heat dissipation guiding board is disposed in the casing and located at the air inlet for guiding the cooling air flow from the air inlet to the casing in a direction away from the air outlet. The power supply is disposed on the heat dissipation guiding board.
Based on the above, after the cooling air flow flows into the casing, the cooling air flow is guided by the heat dissipation guiding board and flows from the air inlet in a direction away from the air outlet. Next, the cooling air flow flows to the air outlet according to the embodiment described above. Thereby, the cooling air is allowed to flow in the casing during an increased time within an extended range, so as to improve the heat dissipation efficiency. Besides, dust in the air and rain may be prevented from being blown into the illumination system by strong wind. Namely, the illumination system of the invention is water and dust resistant. Moreover, the cooling air flow contacts the heat dissipation guiding board after flowing into the casing, and the power supply is disposed on the heat dissipation guiding board. Therefore, the cooling air effectively contributes to heat dissipation of the power supply.
Other objectives, features and advantages of the present invention will be further understood from the further technological features disclosed by the embodiments of the present invention wherein there are shown and described preferred embodiments of this invention, simply by way of illustration of modes best suited to carry out the invention.
The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings which form a part hereof, and in which are shown by way of illustration specific embodiments in which the invention may be practiced. In this regard, directional terminology, such as “top,” “bottom,” “front,” “back,” etc., is used with reference to the orientation of the Figure(s) being described. The components of the present invention can be positioned in a number of different orientations. As such, the directional terminology is used for purposes of illustration and is in no way limiting. On the other hand, the drawings are only schematic and the sizes of components may be exaggerated for clarity. It is to be understood that other embodiments may be utilized and structural changes may be made without departing from the scope of the present invention. Also, it is to be understood that the phraseology and terminology used herein are for the purpose of description and should not be regarded as limiting. The use of “including,” “comprising,” or “having” and variations thereof herein is meant to encompass the items listed thereafter and equivalents thereof as well as additional items. Unless limited otherwise, the terms “connected,” “coupled,” and “mounted” and variations thereof herein are used broadly and encompass direct and indirect connections, couplings, and mountings. Similarly, the terms “facing,” “faces” and variations thereof herein are used broadly and encompass direct and indirect facing, and “adjacent to” and variations thereof herein are used broadly and encompass directly and indirectly “adjacent to”. Therefore, the description of “A” component facing “B” component herein may contain the situations that “A” component directly faces “B” component or one or more additional components are between “A” component and “B” component. Also, the description of “A” component “adjacent to” “B” component herein may contain the situations that “A” component is directly “adjacent to” “B” component or one or more additional components are between “A” component and “B” component. Accordingly, the drawings and descriptions will be regarded as illustrative in nature and not as restrictive.
With reference to
With reference to
Through the heat dissipation guiding board 140, the cooling air flow A is allowed to flow in the casing 110 during an increased time within an extended range, such that the heat in the casing 110 may be dissipated effectively. The cooling air flow A takes the heat of the heat dissipation guiding board 140 away, such that the heat generated by the power supply 150 on the heat dissipation guiding board 140 may be dissipated. Besides, a hydrophilic layer may be disposed on a surface 142 of the heat dissipation guiding board 140 facing the air inlet 112 by coating or electroplating, so as to prevent dust. Thereby, the hydrophilic layer apt to absorb dust may protect the illumination system 100 from being contaminated by dust.
The air outlet 114 is located at an up stream in a flow field. Therefore, the cooling air flow A at the air outlet 114 may perform highly efficient heat conduction with the air at low temperature so as to effectively dissipate heat of the power supply 150. In addition, the heat dissipation guiding board 140 is near the air inlet 112, such that the cooling air flow A passing through the air inlet 112 may contact the heat dissipation guiding board 140 for improving heat dissipation efficiency.
According to the embodiment, a material of the heat dissipation guiding board 140 is, for example, metal, which is conducive to dissipation of heat of the power supply 150. As indicated in
With reference to
With reference to
With reference to
According to the embodiments, the heat dissipation guiding board is near the air inlet, and an included angle is formed between the heat dissipation guiding board and the bottom board. Moreover, the heat dissipation guiding board extends in the direction away from the air outlet. After the cooling air flow flows into the casing, the cooling air flow is guided by the heat dissipation guiding board and flows from the air inlet in a direction away from the air outlet. Next, the cooling air flow flows to the air outlet. Thereby, the cooling air flow is allowed to flow in the casing during an increased time within an extended range, so as to improve the heat dissipation efficiency. Besides, dust in the air and rain may be prevented from being blown into the illumination system by strong wind. Namely, the illumination system of the invention is water and dust resistant. Moreover, the cooling air contacts the heat dissipation guiding board after the cooling air flow flows into the casing, and the power supply is disposed on the heat dissipation guiding board. Therefore, the cooling air flow contributes to effective heat dissipation of the power supply.
The foregoing description of the preferred embodiments of the invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form or to exemplary embodiments disclosed. Accordingly, the foregoing description should be regarded as illustrative rather than restrictive. Obviously, many modifications and variations will be apparent to practitioners skilled in this art. The embodiments are chosen and described in order to best explain the principles of the invention and its best mode practical application, thereby to enable persons skilled in the art to understand the invention for various embodiments and with various modifications as are suited to the particular use or implementation contemplated. It is intended that the scope of the invention be defined by the claims appended hereto and their equivalents in which all terms are meant in their broadest reasonable sense unless otherwise indicated. Therefore, the term “the invention”, “the present invention” or the like does not necessarily limit the claim scope to a specific embodiment, and the reference to particularly preferred exemplary embodiments of the invention does not imply a limitation on the invention, and no such limitation is to be inferred. The invention is limited only by the spirit and scope of the appended claims. The abstract of the disclosure is provided to comply with the rules requiring an abstract, which will allow a searcher to quickly ascertain the subject matter of the technical disclosure of any patent issued from this disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Any advantages and benefits described may not apply to all embodiments of the invention. It should be appreciated that variations may be made in the embodiments described by persons skilled in the art without departing from the scope of the present invention as defined by the following claims. Moreover, no element and component in the present disclosure is intended to be dedicated to the public regardless of whether the element or component is explicitly recited in the following claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 200910162734.9 | Aug 2009 | CN | national |
