This application is based upon and claims the priority of PCT patent application No. PCT/CN2017/083628 filed on May 9, 2017 which claims the priority of Chinese Patent Application No. 201610463893.2 filed on Jun. 23, 2016 and Chinese Patent Application No. 201620630935.2 filed on Jun. 23, 2016, the entire content of all of which is hereby incorporated by reference herein for all purposes.
The present disclosure belongs to the field of semiconductor illumination technology, and in particular relates to an illuminator device.
After a lamp, especially a high-power lamp, is illuminated and is used for a period of time, the temperature of the entire lamp can be high, and the service life of the lamp can be greatly shortened if the lamp cannot effectively dissipate heat. Therefore, the high-power lamp is generally provided with a heat dissipation structure between a lamp housing and an encloser.
The present disclosure provides an illuminator device and a method of manufacturing an illuminator device.
According to a first aspect, the present disclosure provides an illuminator device. The device may include: a housing, a heat dissipation member provided at an end of the housing, a light source module configured to include an end in thermal contact with the heat dissipation member, an optical member provided at an other end of the light source module, and a driving power supply module electrically connected with the light source module, where the light source module and the housing are respectively provided at two ends of the heat dissipation member, a plurality of channels communicating inside of the illuminator device with outside of the illuminator device are provided in the illuminator device, and the plurality of channels penetrate through the housing and the heat dissipation member.
According to a second aspect, the present disclosure provides a method of manufacturing an illuminator device. The method may include: providing a housing and a heat dissipation member provided at an end of the housing, providing a light source module configured to include an end in thermal contact with the heat dissipation member, providing an optical member provided at an other end of the light source module, and providing a driving power supply module electrically connected with the light source module, and where the light source module and the housing may be respectively provided at two ends of the heat dissipation member, a plurality of channels communicating inside of the illuminator device with outside of the illuminator device are provided in the illuminator device, and the plurality of channels penetrate through the housing and the heat dissipation member.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure.
The accompanying drawings illustrated here are only provided for further understanding of the present disclosure and constitute one part of the present disclosure. The examples of the present disclosure and the description thereof are used for explaining the present disclosure and do not constitute an improper limitation of the present disclosure. In the accompanying drawings:
In order to make objects, technical details and advantages of the examples of the disclosure apparent, the technical solutions of the examples will be described in a clearly and fully understandable way in connection with the examples of the disclosure and related drawings. Apparently, the described examples are just a part but not all of the examples of the disclosure. Based on the described examples herein, those skilled in the art can obtain other example(s), without any inventive work, which should be within the scope of the disclosure.
The terminology used in the present disclosure is for the purpose of describing exemplary examples only and is not intended to limit the present disclosure. As used in the present disclosure and the appended claims, the singular forms “a,” “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It shall also be understood that the terms “or” and “and/or” used herein are intended to signify and include any or all possible combinations of one or more of the associated listed items, unless the context clearly indicates otherwise.
It shall be understood that, although the terms “first,” “second,” “third,” and the like may be used herein to describe various information, the information should not be limited by these terms. These terms are only used to distinguish one category of information from another. For example, without departing from the scope of the present disclosure, first information may be termed as second information; and similarly, second information may also be termed as first information. As used herein, the term “if” may be understood to mean “when” or “upon” or “in response to” depending on the context.
Some heat dissipation structures may be made of aluminum alloy and provided with a plurality of fins which are closely arranged, so the structure is complex. Thus, the entire lamp has large weight, which exceeds the weight that a lamp holder (e.g., the standard lamp holder E27 or E40) of the lamp can bear. Therefore, the illuminator device also needs to be additionally equipped with a safety chain. The safety chain is connected between a mounting bracket and a light source, thus not only increasing the cost of the high-power lamp but also being inconvenient to replace the light source.
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Detailed description will be given below to the components and the connecting relationships between the components in the illuminator device 100, provided by the example of the present disclosure.
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Specifically, the first through grooves 11 extend to an outer surface of a side wall of the housing 1 from the first end face 15 of the housing 1. The first through groove 11 is communicated with at least one channel 8 and includes a first port 111 and a first groove 112 which are communicated with each other. The first port 111 is provided at the first end face 15. The first groove 112 is formed by denting the outer surface of the side wall. By adoption of the first through grooves 11, the inner space of the housing 1 may be communicated with the outside of the illuminator device 100.
Specifically, the second through grooves 12 penetrate through an inner surface and the outer surface of the side wall of the housing 1. The second through groove 12 is communicated with at least one channel 8. The second through groove 12 includes two second ports 121 and one second groove 122, in which the second ports 121 penetrate through the inner surface and the outer surface of the side wall of the housing 1; the second groove 122 is formed by denting the outer surface of the side wall; and the two second ports 121 are respectively formed on two sides of the second groove 122. The second through grooves 12 further enhance the communication between the inner space of the housing 1 and the outer space of the illuminator device 100. Other examples may also adopt the form of only arranging the first through grooves or the second through grooves.
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The heat dissipation member 2 is preferably made of aluminum profile. The heat dissipation member with required length is cut from an aluminum profile matrix with corresponding diameter according to different lamp powers, luminous fluxes and photoelectric parameters. The powers may range from tens of watts to hundreds of watts, and the luminous fluxes may range from hundreds of lumens to tens of thousands of lumens. The traditional high-power light sources such as high-power fluorescent lamps and high-power metal halide lamps can be well replaced. Meanwhile, one set of aluminum profile mold can obtain a plurality of illuminator devices provided by the example of the disclosure with different powers, so the production cost can be greatly reduced.
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The second substrate 51 may be a printed circuit board, and the second substrate 51 is provided with a plurality of fifth positioning holes 511. The heat homogenization plate 53 is a vacuum cavity having a fine structure at an inner wall, is made of metal with good thermal conductivity such as copper, and is configured to enhance heat dissipation. A surface of the heat homogenization plate 53 is provided with a plurality of sixth positioning holes 531, and the circumference of the heat homogenization plate 53 is further provided with a plurality of seventh positioning holes 532 and a plurality of clamping grooves 533. The illuminator device 100 further includes a plurality of second screws 54. The second screws 54 penetrate through the fifth positioning holes 511 and the sixth positioning holes 531 and are accommodated into the fourth positioning holes 232 to realize the fixed connection between the light source module 5 and the heat dissipation member 2. Moreover, the light source module 5 is bonded to the first end (not signed) of the heat dissipation member 2. In other examples, other connecting means such as bonding connection, fastener connection or welding connection may also be adopted.
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In summary, the illuminator device 100 provided by the examples of the present disclosure is provided with a plurality of channels communicating the inside of the illuminator device 100 with the outside of the illuminator device 100; and the channels may be utilized to realize the convection between the air outside the illuminator device 100 and the air inside the illuminator device 100.
With reference to
The present disclosure provides an illuminator device with good heat dissipation effect.
The present disclosure provides an illuminator device which includes a housing, a heat dissipation member provided at an end of the housing, a light source module configured to include an end in thermal contact with the heat dissipation member, an optical member provided at an other end of the light source module, and a driving power supply module electrically connected with the light source module, the light source module and the housing are respectively provided at two ends of the heat dissipation member, a plurality of channels communicating inside of the illuminator device with outside of the illuminator device are provided in the illuminator device, and the plurality of channels penetrate through the housing and the heat dissipation member.
Further, the illuminator device further includes an encloser which positions the optical member at the other end of the light source module.
Further, the housing is formed with a plurality of first through grooves; a plurality of pipes are formed in the heat dissipation member; the encloser is provided with a plurality of first openings; the plurality of pipes are respectively communicated with the plurality of first through grooves and the plurality of first openings; and the plurality of first through grooves, the plurality of pipes and the plurality of first openings form the plurality of channels.
Further, each of the first through grooves includes a first port and a first groove which are communicated with each other; the first port is provided at the first end face and communicated with at least one of the plurality of pipes; and the first groove is formed by denting the outer surface of the side wall.
Further, the housing is formed with a plurality of second through grooves; and the plurality of second through grooves penetrate through both an inner surface and the outer surface of the side wall of the housing.
Further, each of the second through grooves includes at least one second port and a second groove which are communicated with each other; the at least one second port penetrates through the inner surface and the outer surface of the side wall of the housing and is communicated with at least one of the plurality of pipes; and the second groove is formed by denting the outer surface of the side wall.
Further, the heat dissipation member is toroidal columnar and includes an inner ring, an outer ring and a plurality of connecting plates connecting the inner ring and the outer ring; and the plurality of pipes are formed by enclosure of the inner ring, the outer ring and the plurality of connecting plates.
Further, the light source module includes a substrate and a light source provided on a side of the substrate; and emergent light from the light source is emitted at least after light homogenization or light distribution by the optical member.
Further, the light source is annularly arranged.
Further, the illuminator device further includes a heat homogenization plate which is provided on another side of the substrate and is in thermal contact with the heat dissipation member.
Further, the light source module and the driving power supply module are separately provided; and the driving power supply module is fixed in the housing.
Further, the light source module and the driving power supply module are provided in a one-piece form.
Further, the optical member includes an edge part and a central part; the encloser is provided around the edge part of the optical member; and the central part of the optical member is protruded out of an upper surface of the encloser.
Further, the encloser is combined with the heat homogenization plate.
Further, the heat dissipation member includes a first end and a second end arranged in an upper-lower direction; and the housing is fixedly connected with the second end of the heat dissipation member and bonded to the second end.
Further, the heat dissipation member includes a first end and a second end arranged in an upper-lower direction; and the light source module is fixedly connected with the first end of the heat dissipation member and bonded to the first end.
Further, the illuminator device further includes a lamp holder which is electrically connected with the driving power supply module and configured to electrically connect the illuminator device to an external power supply.
Compared with other implementations, in the illuminator device provided by the examples of the present disclosure, by utilization of an external heat dissipation member and the arrangement of a plurality of channels communicating the inside of the illuminator device with the outside of the illuminator device, the convection between the air outside the illuminator device and the air inside the illuminator device can be realized by utilization of the channels. Thus, the heat emitted by the light source module in the illuminator device can be effectively and rapidly dissipated through the channels. Therefore, the illuminator device has good heat dissipation effect, and then the service life of the light source module in the illuminator device is prolonged.
The present disclosure provides a method of manufacturing an illuminator device. The method may include: providing a housing and a heat dissipation member provided at an end of the housing, providing a light source module configured to include an end in thermal contact with the heat dissipation member, providing an optical member provided at an other end of the light source module, and providing a driving power supply module electrically connected with the light source module, and where the light source module and the housing are respectively provided at two ends of the heat dissipation member, a plurality of channels communicating inside of the illuminator device with outside of the illuminator device are provided in the illuminator device, and the plurality of channels penetrate through the housing and the heat dissipation member.
The present disclosure may include dedicated hardware implementations such as application specific integrated circuits, programmable logic arrays and other hardware devices. The hardware implementations can be constructed to implement one or more of the methods described herein. Applications that may include the apparatus and systems of various examples can broadly include a variety of electronic and computing systems. One or more examples described herein may implement functions using two or more specific interconnected hardware modules or devices with related control and data signals that can be communicated between and through the modules, or as portions of an application-specific integrated circuit. Accordingly, the computing system disclosed may encompass software, firmware, and hardware implementations. The terms “module,” “sub-module,” “circuit,” “sub-circuit,” “circuitry,” “sub-circuitry,” “unit,” or “sub-unit” may include memory (shared, dedicated, or group) that stores code or instructions that can be executed by one or more processors. The module refers herein may include one or more circuit with or without stored code or instructions. The module or circuit may include one or more components that are connected.
The foregoing examples are provided for further detailed description of the objectives, the technical solutions and the advantages of the present disclosure. It should be understood that the foregoing is only the examples of the present disclosure and not intended to limit the present disclosure. Any modification, equivalent replacement, improvement or the like made within the spirit and the principle of the present disclosure shall fall within the scope of protection of the present disclosure.
In addition, it should be also noted that: the language used in the description is mainly selected for the purpose of readability and teaching, and is not selected for the purpose of explaining or limiting the subject of the present disclosure. Therefore, many modifications and variations will be apparent to those skilled in the art without departing from the scope and the spirit of the disclosure. The disclosure of the present disclosure is illustrative and not restrictive as for the scope of the disclosure.
Number | Date | Country | Kind |
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2016 1 0463893 | Jun 2016 | CN | national |
2016 2 0630935 | Jun 2016 | CN | national |
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Entry |
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International Search Report (including English translation) and Written Opinion issued in PCT/CN2017/083628, dated Aug. 8, 2017, 13 pages. |
Number | Date | Country | |
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20190120474 A1 | Apr 2019 | US |
Number | Date | Country | |
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Parent | PCT/CN2017/083628 | May 2017 | US |
Child | 16222556 | US |