Patent Application
20200225600
The present invention relates to an image forming apparatus of an electrophotographic type.
In a printer which is an electrophotographic image forming apparatus, the following exposure method (type) is generally known. That is, a method of exposing a photosensitive drum using an exposure head, such as a LED (Light Emitting Diode) or an organic EL (Organic Electro Luminescence), to form a latent image is generally known. The exposure head comprises a light emitting element array arranged in the longitudinal direction of the photosensitive drum, and a rod lens array which forms an image of light from the light emitting element array, on the photosensitive drum. LEDs and organic ELs having a surface-emitting shape in which the direction of light emitted from the light-emitting surface is the same as that of the rod lens array is known. Here, the length of the light emitting element array is determined depending on the width of the image area on the photosensitive drum, and the interval between the light emitting elements is determined according to the resolution of the printer. For example, in the case of a 1200 dpi printer, the pixel spacing is 21.16 μm, and therefore, the spacing between the adjacent light emitting elements is also the spacing corresponding to 21.16 μm. In a printers which use such an exposure scan a photosensitive drum with a laser beam deflected by a rotating polygonal mirror, use a smaller number of parts, and therefore, downsizing of equipment and cost reduction are easy. In addition, in a printer using an exposure head, the sound generated by the rotation of the rotary polygonal mirror is eliminated.
In the image forming apparatus in recent years, colorization quickly advances, and an image forming apparatus in which photosensitive drums corresponding to respective colors and a plurality of image forming portions including surface light emitting element array chips and which outputs multi-color images has been put into practical use. On the other hand, the LEDs involve heat generation during light emission. For this reason, a heat generation amount of LED arrays including many light emitting portions becomes large. By the influence of this heat generation amount, thermal expansion of a substrate on which the LED arrays are mounted is invited, so that a length of the substrate with respect to a main scan direction of the substrate becomes long and thus a width of an image formed (written) on the photosensitive drum also becomes long. In general, light emission patterns of the respective colors of a color image are different from each other. For this reason, light emission amounts and temperature rise amounts the respective LEDs arrays are also different from each other. As a result, due to a difference in temperature rise amount of the respective colors, a change amount of the width of the image formed on the photosensitive drum is also different from each other among the respective colors, so that there was a problem such that an image deviation among the respective colors occurs.
Therefore, for example, in Japanese Laid-Open Patent Application (JP-A) 2010-64338, in 60 light emitting chips each including 260 light emitting thyristors arranged in one row (line), not only a light emission signal is supplied to each of the light emitting chips, but also the light emitting thyristors and divided into a plurality of groups each consisting of continuous two light emitting thyristors in each of the light emitting chips. The two light emitting thyristors as one group constituting each of the plurality of the groups into which the light emitting thyristors are divided are set as a unit for light emission or non-light emission, and grouping of the 260 light emitting thyristors of each of the light emitting chips is regarded as one fixing unit, and a change in image width due to the difference in temperature rise amount is corrected. A technique such that this light emission signal generating portion is provided for each of the light emitting thyristors divided into the groups and the image deviation with respect to a main scan direction is suppressed has been proposed.
Further, for example, in JP-A 2007-152717, an LED array comprising a plurality of LEDs which are orderly arranged and an adjusting means for adjusting a relative angle between a photosensitive member and the LED array depending on a fluctuation in length with respect to the main scan direction of this LED array are provided. A technique such that the adjusting means changes an angle of the LED array relative to the photosensitive member about a rotation shaft provided with respect to a direction perpendicular to a rotational axis direction of the photosensitive member and thus a main scan image deviation occurring due to thermal expansion is suppressed has been proposed.
However, in the proposal disposed in JP-A 2010-64338, magnification adjustment(correction) with respect to the main scan direction is made using the 260 light emitting thyristors as a unit, and therefore, with respect to a length of about 300 mm in the main scan direction, 55 main scan magnification adjusting circuits are needed. Further, the 260 light emitting thyristors are merely about 5.5 mm in length. In the light emitting thyristors of about 5.5 mm, for example, in order to cause one pixel, i.e., 1200 dpi to less emit the light, when the length of the LED array with respect to the main scan direction is adjusted, a main scan magnification correction trace remains as a vertical stripe and leads to a deterioration of an output image.
Further, in the proposal disclosed in JP-A 2007-152717, the LED array is rotated about the rotation shaft provided with respect to the direction perpendicular to the rotational axis direction of the photosensitive member depending on the fluctuation in length with respect to the main scan direction, and therefore, a distance between the photosensitive member and the LED array changes depending on each of main scan positions. The fluctuation in length between the photosensitive member and the LED array has a great influence on a spot shape change on the photosensitive member, and as a result, a spot is out of focus, so that the spot shape change leads to the deterioration of the output image. Further, a mechanism for rotating the LED array is needed additionally, and for that reason, there also arises a problem such that a cost is increased.
According to an aspect of the present invention, there is provided an image forming apparatus, comprising: a rotatable photosensitive drum; an exposure portion including a plurality of light emitting elements which are arranged in a rotational axis direction of the photosensitive drum and which emit light to which the photosensitive drum is exposed; and a controller configured to control activation of the light emitting elements by outputting image data to the exposure portion, wherein the exposure portion comprises, a plurality of array chips each including the light emitting elements, a substrate on which the array chips are arranged in a staggered fashion in the rotational axis direction, and a temperature detecting portion configured to detect a temperature of the substrate, wherein the controller comprises, a correcting portion configured to correct magnification of the image data with respect to the rotational axis direction depending on a length fluctuation amount of the substrate with respect to the rotational axis direction calculated on the basis of the temperature detected by the temperature detecting portion, and a converting portion configured to arrange the image data on the basis of mounting positions of the array chips arranged in the staggered fashion, and wherein depending on magnification correction by the correcting portion, the image data is arranged by the converting portion on the basis of the mounting positions of the array chips.
Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the mounted drawings.
Parts (a) and (b) of
Parts (a), (b) and (c) of
Part (a) and (b) of
Parts (a) to (d) of
Parts (a), (b) and (c) of
Parts (a) and (b) of
In the following, embodiments of the present invention will be described in detail with reference to the drawings.
The image forming portion 103 includes four image forming stations arranged along the rotational direction (counterclockwise direction) of an endless conveyance belt 111 in the order of cyan (C) image forming station, magenta (M) image forming station, yellow (Y) image forming station, and black (K) image forming station. The four image forming stations have the same structure, and each image forming station includes a photosensitive drum 102 which are photosensitive members rotatable rotate in a direction of an arrow (clockwise), an exposure head 106, a charging device 107, and a developing device 108. Here, the subscripts a, b, c, and d of the photosensitive drum 102, the exposure head 106, the charging device 107, and the developing portion 108 indicates that they are for black (K) yellow (Y), magenta (M), and cyan (C) image forming stations, respectively. Here, in the following, the suffixes are omitted except when referring to specific photosensitive drum or the like.
In the image forming portion 103, the photosensitive drum 102 is driven to rotate, and the photosensitive drum 102 is charged by the charging device 107. The exposure head 106, which is the exposure portion, emits light from the arranged LED array according to the image data, and the light emitted from a surface of the LED array chip surface is collected on the photosensitive drum 102 (on the photosensitive member) by the rod lens array, so that an electrostatic latent image is formed. The developing device 108 develops the electrostatic latent image formed on the photosensitive drum 102 with toner. And, the developed toner image is transferred onto a recording sheet on a conveyance belt 111 which conveys the recording sheet. A series of such electrophotographic processes are executed at each image forming station. Here, during image formation, after a predetermined time has elapsed since image formation at the cyan (C) image forming station is started, image forming operations are executed sequentially at the magenta (M), yellow (Y), and black (K) image forming stations.
Here, as an example of the exposure portion employed in the image forming apparatus of the electrophotographic type, there is a laser beam scanning exposure type in which the photosensitive drum 102 is exposed to light through f-A lens or the like by scanning the photosensitive drum surface with irradiation beam of a semiconductor laser by a rotating polygonal mirror. The “exposure head 106” described in this embodiment is used in an LED exposure type in which the photosensitive drum 102 is exposed to light by using light emitting elements such as LEDs (Light Emitting Diodes) arranged along a rotational axis direction of the photosensitive drum 102, and is not used in the aforementioned laser beam scanning exposure type.
The image forming apparatus shown in
During the image forming operation, recording sheet is fed from a sheet feeding portion designated in advance, and the fed recording sheet is fed to the registration roller 110. The registration roller 110 feeds the recording sheet to the conveyance belt 111 at such a timing that the toner image formed in the image forming portion 103 is transferred onto the recording sheet. The toner images formed on the photosensitive drum 102 of the respective image forming stations are sequentially transferred onto the recording sheet fed by the conveyance belt 111. The recording sheet on which the toner image (unfixed) has been transferred is fed to the fixing portion 104. The fixing portion 104 has a built-in heat source such as a halogen heater, and fixes the toner image on the recording sheet by heating and pressing with two rollers. The recording sheet on which the toner image is fixed by the fixing portion 104 is discharged to the outside of the image forming apparatus by the discharge roller 112.
On the downstream side of the black (K) image forming station in the recording sheet conveyance direction, an optical sensor 113 functioning as a detection portion is disposed at a position facing the conveyance belt 111. The optical sensor 113 detects the position of the test image formed on the conveyance belt 111 to determine the color misregistration amount of the toner image between each image forming station. The amount of color deviation detected by the optical sensor 113 is notified to a control board 415 (
Here, as an example of an electrophotographic image forming apparatus, an image forming apparatus which directly transfers a toner image formed on the photosensitive drum 102 of each image forming station onto a recording sheet on the conveyance belt 111 has been described. The present invention is not limited to a printer which transfers the toner image from the photosensitive drum 102 directly onto the recording sheet. For example, the present invention can also be applied to an image forming apparatus including a primary transfer portion which transfers a toner image from the photosensitive drum 102 onto an intermediary transfer belt and a secondary transfer portion which transfers the toner image from the intermediary transfer belt onto the recording sheet.
Next, for the exposure head 106 which is the exposure portion which exposes the photosensitive drum 102 will be explained referring to parts (a) and (b) of
As shown in part (b) of
Parts (a), (b) and (c) of
As shown in part (a) of
In this embodiment, each light emission point of the surface light emitting element array chip is a semiconductor LED, but, each light emitting element may be, for example, an OLED (Organic Light Emitting Diode). This OLED, also called organic EL (Organic Electro-Luminescence), is a current-driven type light-emitting element. The OLEDs are arranged on a line along the main scanning direction (rotational axis direction of the photosensitive drum 102) on a TFT (Thin Film Transistor) substrate, for example, and are electrically connected to the power supply wiring provided along the main scanning direction, electrically in parallel.
Part (c) of
Further, the even-numbered surface light emitting element array chips and the odd-numbered surface light emitting element array chips are mounted by changing a manner of arrangement of the surface light emitting elements by 180° so that an up-down direction is reversed. For that reason, when the respective surface light emitting element array chips of the surface light emitting element array chips 201 are caused to emit light, the odd-numbered surface light emitting element array chips emit light from an upstream side with respect to the main scan direction, and the even-numbered surface light emitting element array chips emit light from a downstream side with respect to the main scan direction. For that reason, light emission data toward the surface light emitting element array chips are transferred in the directions shown in part (c) of
As shown in part (b) of
In the control board 415, the CPU 400 which is a controller principally performs image data processing and processing for arrangement of the surface light emitting element array chips 1-29. The control board 415 includes functional blocks of a frequency conversion portion 402, a main scan magnification correction portion 404, a staggered conversion portion 406, and a data sending (transmission) portion 405. In the following, processing in each functional block will be described in the order in which image data on the control board 415 is processed.
The frequency conversion portion 420 converts a transfer speed by subjecting the image data, sent from the controller 401 of the image forming apparatus, to frequency conversion. That is, the frequency conversion portion 402 writes input image data, sent from the controller 401, into the memory 403 and reads the input image data from the memory 403 at a frequency designated by the CPU 400, so that conversion of the transfer speed of the image data is carried out. Specifically, the frequency conversion portion 402 stores the input image data, sent from the controller at the frequency depending on resolution, in the memory 403. Then, the frequency conversion portion 402 performs a dithering (processing) such that the stored input image data is read from the memory 403 at the frequency providing the resolution designated by the CPU400, and thus generates image data which is frequency-converted. In this embodiment, the frequency conversion portion 402 performs the dithering in which the resolution is twice that it was by reading twice the same input image data so that the input image data with the resolution of 1200 dpi sent from the controller becomes the resolution of 2400 dpi. As a result, the image data generated by the frequency conversion portion 402 is pixel data equivalent to 2400 dpi, and the transfer speed of the image data is also changed corresponding to the converted resolution. The pixel data equivalent to 2400 dpi in this example is 1 bit data, but one pixel may be expressed by a plurality of bits. The pixel data generated by the frequency conversion portion 402 is line data corresponding to a line corresponding in 2400 dpi resolution in the sub-scanning direction (the rotational direction of the photosensitive drum 102, that is, the conveyance direction of the recording sheet). And, the frequency conversion portion 402 generates pixel data corresponding to each pixel including a resolution equivalent to 2400 dpi in association with the position of the pixel in the main scanning direction (longitudinal direction of the exposure head 106). Incidentally, in this embodiment, the memory 403 is used for performing the frequency conversion, but an FIFO (First In First Out) image may also be used depending on a ratio of the conversion speed.
Then, the image data which is subjected to frequency conversion (resolution conversion) by the frequency conversion portion 402 which is a correcting portion is inputted to a main scan magnification correcting portion 404 in a subsequent stage. In the main scan magnification correcting portion 404, filter(ing) processing of the inputted image data is carried out, so that the resolution of the image data is converted from 2400 dpi to 1200 dpi, and then, main scan magnification correction is carried out on the basis of temperature information of a thermistor 420.
The main scan magnification correcting portion 404 performs the filter processing in which the resolution of an inputted negative image data in the main scanning direction from 2400 dpi to 1200 dpi, and the image data after the filter processing is stored in the memory 405. In this embodiment, the image data is interpolated by filtering in the main scanning direction. Part (c) of
Dn′=D(2×n−1)×K2+D(2×n)×K1+D(2×n+1)×K2 (Equation 1)
Here, the value of the pixel position n is 1 to 14964. When n=14964, the extreme end data D (29929 (=14964×2+1)) has no adjacent surface light emitting element array chip, and therefore, is processed as white (0), for example. K1 as a first coefficient is a weighting coefficient for the output data and input data at the same coordinate position in the main scanning direction. K2 which is said second coefficient is a weighting coefficient for the input data including coordinates shifted by ½ pixel in the main scanning direction with respect to the output data. In this embodiment, interpolation calculation (filter processing) is performed with values of K1=0.5 and K2=0.25, but other weighting coefficients different from those of this embodiment may be used. In this embodiment, by setting the weight coefficient K2 to a value greater than 0, information of image data generated at a resolution (2400 dpi) higher than the resolution of output data (1200 dpi) can be reflected in the output data. More specifically, in the processing up to the previous stage, image position movement in the main scanning direction is performed at 2400 dpi, and then the resolution of the image data is converted to 1200 dpi by the main scan magnification correcting portion 404. By this, it is possible to generate 1200 dpi images while maintaining image movement accuracy in 2400 dpi units.
In addition, in performing the pixel processing at the end of the surface light emitting element array chip, using the filtering process, if there is no pixel data of the adjacent surface light emitting element array chip, the image is omitted with the result of occurrence of an image defect. Therefore, when processing the extreme edge pixel data, the processing is performed by add in g pixel data on the end side of the adjacent surface light emitting element array chip, so that the image omission does not occur.
Part (b) of
For example, the density value of the pixel 1′ in the third row from the top of the right-hand view of part (b) of
Similarly, the density value of the pixel 2′ in the third row from the top of the right-hand view of part (b) of
Furthermore, the density value of the pixel 4′ in the third row from the top of the right-hand view of part (b) of
Here, as an example, an example in which the filter processing of 3 pixels with respect to the main scan direction was described, but the main scan magnification correcting portion 404 includes a line memory 405, and therefore, for example, 3×3 filter processing using 3 pixels with respect to the main scan direction and 3 pixels with respect to the sub-scan direction may also be carried out.
Then, main scan magnification correction in which deletion of the image data with respect to the main scan direction is made on the basis of temperature information of the thermistor 420 mounted on the exposure head 106 will be described. As described above, the surface light emitting element array chip includes many light emitting portions, so that a heat generation amount during light emission becomes large. For that reason, by the influence of the heat generation amount, thermal expansion of the drive substrate 202 on which the surface light emitting element array chips are mounted is invited, so that a length of the drive substrate 202 in the main scan direction becomes long and a width of the image written (formed) on the photosensitive drum also becomes long, and therefore there is a need to delete the pixel(s). For that reason, in the main scan magnification correction, on the basis of the temperature of the thermistor 420 provided on the drive substrate 202, an image width is corrected depending on a degree of extension (length fluctuation amount) of the drive substrate 202 in the main scan direction.
A table 1 is a table in which a temperature (° C.) acquired from the thermistor 420 and a main scan correction magnification (%) for correcting the image width are associated with each other, the number of the light emitting elements, capable of exposing the photosensitive drum to light, in the surface light emitting element array element group 201 is 14964 (elements), and is capable of meeting the image right of about 316 mm (=about 10.9 mm×29 chips) with respect to the main scan direction. For example, from the table 1, the main scan correction magnification when a thermistor acquisition temperature is 30° C. is 0.0095238%. When the length, of about 316 mm, of the surface light emitting element array element group 201 is multiplied by this main scan correction magnification of 0.0095238%, about 30 μm results. A pitch of the resolution of 1200 dpi is approximately 21.16 μm, so that when the thermistor acquisition temperature is 30° C., there is a need that of the image data, the image data corresponding to one pixel is deleted.
The CPU 400 acquires the temperature information from the thermistor 420 mounted on the exposure head 106. The CPU 400 includes the table in which the temperature (° C.) acquired from the thermistor 420 and the main scan correction magnification (%) for correcting the image width which are shown in table 1, and acquires the main scan correction magnification on the basis of the acquired temperature information of the main scan correction magnification. Then, the CPU 400 determines the number of the image data to be deleted on the basis of the acquired main scan correction magnification, and provides an instruction to the main scan magnification correcting portion 404 as to a pixel position of the image data to be deleted. The main scan magnification correcting portion 404 performs shift processing of the image data stored in the line memory 405, and then makes a deletion of the image data.
Incidentally, in this embodiment, deletion processing of the image data on the basis of the main scan correction magnification corresponding to the temperature information of the thermistor 420 was described. For example, a method in which the image data deletion processing is processing is performed depending on the temperature of the exposure head 106 estimated on the basis of the number of times of light emission (video count) in the light emitting elements of the surface light emitting element array element group 201 may also be employed. The CPU 400 includes a table in which an integrated value, acquired by counting the number of light emission in all the light emitting elements of the surface light emitting element array element group 201 in advance, a temperature of the exposure head 106 corresponding to the integrated value, and main scan correction magnification corresponding to the temperature of the exposure head 106 are associated with each other. Here, the value to be counted may also be the number of times of sending of the image data to the light emitting element array chips. Corresponding to the number of times of sending of the image data to the light emitting element array chips, the light emitting elements of the light emitting element array chips emit light. By counting this value, it is possible to estimate that the temperature of the light emitting element array chips becomes what degree of temperature. Then, the CPU 400 performs processing in which of the image data, the image data for light emission is integrated and added, and acquires information on the main scan correction magnification corresponding to an integrated value from the table, and then the CPU 400 may also perform the image data deletion processing on the basis of the acquired main scan correction magnification.
The image data corrected in main scan magnification by the main scan magnification correcting portion 404 which is a conversing portion is inputted to a group conversion portion 406. The surface light emitting element array chips 1-29 are arranged in a staggered fashion such that the array chips are alternately disposed chip by chip with respect to the sub-scan direction as shown in part (a) of
For example, in the memory 421, information on the mounting position of each of the light emitting element array chips 2-29 relative to the light emitting element array chip 1 with respect to the sub-scan direction is stored. As described above, on design nominal, odd-numbered light emitting element array chips (1, 3, . . . 29) are mounted on the substrate 202 so that the light emitting elements of each odd-numbered light emitting element array chip are arranged in a line in the main scan direction. Further, on design nominal, even-numbered light emitting element array chips (2, 4, . . . 28) are mounted on the substrate 202 so that the light emitting elements of each even-numbered light emitting element array chip are arranged in a line in the main scan direction. Further, the even-numbered light emitting element array chips are disposed so as to shift from the odd-numbered light emitting element array chips by 4 pixels in terms of 1200 dpi. In the memory 421, information on a difference in mounting position between the odd-numbered light emitting element array chip and the even-numbered light emitting element array chip is stored. As the information on the difference, it is possible to cite data indicating that these array chips are shifted from each other by 4 pixels in terms of 1200 dpi and data indicating that these array chips are shifted from each other by 84 μm (≈21.16 μm as an example. Further, information on the difference may also be data indicating a difference in relative light emission timing between the odd-numbered light emitting element array chip and the even-numbered light emitting element array chip. In this case, depending on which is disposed on an upstream side with respect to a rotational direction of the photosensitive drum as to the odd-numbered light emitting element array chips and the even-numbered light emitting element array chips, whether or not the odd-numbered light emitting element array chips and the even-numbered light emitting element array chips are caused to emit light in a delayed manner is determined. For that reason, the memory 421 may also store the data indicating that which is disposed on the upstream side with respect to the rotational direction of photosensitive drum as to the odd-numbered light emitting element array chips and the even-numbered light emitting element array chips, in combination.
As another example, in the memory 421, information on a deviation amount, with respect to the sub-scan direction, of each light emitting element array chip relative to the light emitting element array chip 1 as a reference may also be stored. That is, how degree each of the light emitting element array chips 2-29 is deviated from the light emitting element array chip 1 is actually measured by a measuring device in the factory, and the memory 421 may also store arrangement information based on a result thereof. In this case, for the odd-numbered light emitting element array chips (3, 5, . . . 29), arrangement information relating to a mounting error D relative to the light emitting element array chip 1 is stored in the memory 421. Further, for the odd-numbered light emitting element array chips (2, 4, . . . 28), arrangement relating to 84 μm+mounting error D relative to the light emitting element array chip 1 is stored in the memory 421.
The CPU 400 reads the arrangement information from the memory 421, and on the basis of the arrangement information, divides the image data among memories corresponding to the respective surface light emitting element array chips. In this embodiment, the surface light emitting element array chips are arranged in the sub-scan direction, and therefore, the memory 407 for maintaining the image data is connected to the staggered conversion portion 406.
Parts (a) to (d) of
Parts (b) and (c) of
Part (d) of
As described above, in this embodiment, after the image data is subjected to the main scan magnification correction processing, the image data is divided among the memories corresponding to the associated surface light emitting element array chips. In a conventional technique, after the image data are once divided among the memories corresponding to the surface light emitting element array chips, the main scan magnification correction processing for deleting the image data is carried out by shifting the image data. For that reason, the shift of the image data is performed among the memories corresponding to the surface light emitting element array chips, and therefore, a complicated mechanism (circuit structure) for performing the shift of the image data is needed and thus leads to an increase in cost. On the other hand, in this embodiment, before the image data are divided among the memories 407 corresponding to the associated surface light emitting element array chips, the main scan magnification correction processing in which the image data is subjected to the shift processing on the memory. For that reason, after the image data are divided among the memories 407 corresponding to the associated surface light emitting element array chips, there is of no need to perform the shift of the image data among the memories corresponding to the surface light emitting element array chips, so that a simple circuit structure can be realized.
As described with reference to part (c) of
Incidentally, the memory 407 may also be constituted by a memory element such as an SRAM (Static Random Access Memory) or a DRAM (Dynamic Random Access Memory) or by a flip-flop circuit. Further, a storing device or the like provided outside the control substrate 415.
The image data subjected to the staggered conversion processing by the staggered conversion portion 406 are transferred to the drive substrate 202 of the exposure head 106 via connectors 416 and 305 in the data sending portion 408. Specifically, the image data are inputted from the connector 416 on the control substrate 415 side to the connector 305 of the drive substrate 202 on the exposure head 106 side via a signal line (wire) 417. Further, a communication signal from the CPU 400 is inputted from the connector 416 on the control substrate 415 side to the connector 305 of the drive substrate 202 on the exposure head 106 side via a signal line (wire) 418.
Next, the processing inside the drive portion 303a of the exposure head 106 will be described.
The drive portion 303a mounted on the drive substrate 202 includes functional blocks of a data receiving portion 410, a PWM signal generation portion 411, a timing controller 412, a control signal generation portion 413, and a drive voltage generation portion 414. In the following, the processing of each functional block will be described in the order in which image data is processed by the drive portion 303a. Here, the staggered conversion portion 406 of the control substrate 415 arranges image data for each of the 29 surface light emitting element array chips, and the subsequent processing blocks are constituted to process each image data stored in the 29 chips in parallel. The driving portion 303a includes a circuit which receives image data corresponding to the surface light emitting element array chips 1 to 15 and can process each surface light emitting element array chip in parallel.
The data receiving portion 410 receives a signal transmitted from the data sending (transmitting) portion 408 of the control board 415. Here, the data receiving portion 407 and the data sending portion 405 send (transmit) and receive image data in the portion of lines in the sub-scanning direction in synchronization with the line synchronization signal.
The PWM signal generator 411 generates a pulse width signal (hereinafter referred to as the pulse width signal) provided corresponding to the light emission time performed in one pixel portion by the surface emitting element array chip in accordance with the data value for each pixel. The timing for outputting the PWM signal is controlled by the timing controller 412. The timing controller 412 generates a synchronization signal corresponding to the pixel section of each pixel from the Line synchronization signal extracted from the data receiving portion 410, and outputs the synchronization signal to the PWM signal generation portion 411. The drive voltage generator 414 generates a drive voltage for driving the surface light emitting element array chip in synchronization with the PWM signal. Here, the drive voltage generation portion 414 has a structure in which the voltage level of the output signal can be adjusted around 5V so that the CPU 400 provides a predetermined light intensity. In this embodiment, each surface light emitting element array chip is constituted such that four light emitting elements can be driven independently from each other at the same time. The drive voltage generator 414 supplies drive signals to 4 lines of drive signal for each surface light emitting element array chip, that is, for the entire exposure head 106, supplies drive signals to staggered 1 line ((15 chips)×4=60 lines). Drive signals supplied to each light emitting element array chip are ΦW1 to ΦW4 (
The operation of the SLED circuit shown in
Part (a) of
In addition, for shift thyristors connected to transfer line Φ1, the threshold voltage of the shift thyristor Tn+1 where the threshold voltage is the lowest is 3.2V (=1.7V+1.5V). Next, the shift thyristor Tn+3 (not shown in
Next, a light emitting operation of the light emitting thyristor will be described. When only the shift thyristor Tn is on, the gates of the four light emitting thyristors L4n-3 to L4n are connected in common to the common gate Gn of the shift thyristor Tn. Therefore, the gate potentials of the light emitting thyristors L4n-3 to L4n are 0.2V, which is the same as that of the common gate Gn. Therefore, the threshold value of each light emitting thyristor is 1.7V (=0.2V+1.5V), and if a voltage of 1.7V or more is inputted from the lighting signal lines ΦW1 to ΦW4 of the light emitting thyristors, the light emitting thyristors L4n-3 to L4n can be turned on. Therefore, by inputting a lighting signal to the lighting signal lines ΦW1 to ΦW4 when the shift thyristor Tn is on, the four light emitting thyristors L4n-3 to L4n can selectively emit light. At this time, the potential of the common gate Gn+1 of the shift thyristor Tn+1 next to the shift thyristor Tn is 1.7V, and the threshold voltage of the light emitting thyristors L4n+1 to 4n+4 connected to the common gate Gn+1 is 3.2V (=1.7V+1.5V) The lighting signal inputted from lighting signal lines ΦW1 to ΦW4 is 5V, and therefore, the light-emitting thyristors L4n+1 to L4n+4 are likely to light up with the same lighting pattern as the light-emitting thyristors L4n-3 to 4n. However, the threshold voltage is lower in the light emitting thyristors L4n-3 to L4n, and therefore, when a lighting signal is inputted through the lighting signal lines ΦW1 to ΦW4, they turn on earlier than light-emitting thyristors L4n+1 to L4n+4. Once the light emitting thyristors L4n-3 to L4n are turned on, the connected lighting signal lines ΦW1 to ΦW4 are lowered to about 1.5V (diffusion potential) Therefore, the potential of the lighting signal lines ΦW1 to ΦW4 becomes lower than the threshold voltage of the light emitting thyristors L4n+1 to L4n+4, and therefore, the light emitting thyristors L4n+1 to L4n+4 cannot be turned on. As described above, by connecting the multiple light-emitting thyristors L to one shift thyristor T, the plurality of light-emitting thyristors L can be turned on simultaneously.
The voltage of 5V is always applied to the gate line VGK. In addition, the clock signal Φ1 for the odd-numbered shift thyristor and the clock signal Φ2 for the even-numbered shift thyristor are inputted at the same period Tc, and 5V is supplied as the signal Φs for the start pulse line. To make a potential difference on the gate line VGK shortly before the clock signal Φ1 for the odd-numbered shift thyristor first becomes 5V, the signal Φs on the start pulse line is dropped to 0V. By this, the gate potential of the first shift thyristor Tn−1 is lowered from 5V to 1.7V, so that the threshold voltage becomes 3.2V, and therefore it can be turned on by a signal from the transfer line Φ1. Voltage 5V is applied to the transfer line Φ1, and 5V is supplied to the start pulse line Φs, slightly after the first shift thyristor Tn−1 is turned on, and thereafter, 5V is continuously supplied to the start pulse line Φs.
The structure is such that the transfer line Φ1 and the transfer line Φ2 have a time period Tov where the ON states (5V in this case) overlap each other, and are in a substantially complementary relationship. The light-emitting thyristor lighting signal lines ΦW1 to ΦW4 are transmitted in half the cycle of the transfer lines Φ1 and Φ2, and lights up when 5V is applied under the condition that the corresponding shift thyristor is on. For example, in the period a, all four light emitting thyristors connected to the same shift thyristor are turned on, and in the period b, the three light emitting thyristors are turned on simultaneously. In addition, in the period c, all the light emitting thyristors are turned off, and in the period d, the two light emitting thyristors are turned on simultaneously. In the period e, only one light-emitting thyristor is turned on.
In this embodiment, the number of light emitting thyristors connected to one shift thyristor is four, but it is not limited to this example, and may be less or more than four depending on the situation. Here, in the circuit described above, the cathode of each thyristor is shared, but an anode common circuit can be used by appropriately inverting the polarity.
Parts (a) and (b) of
In part (b) of
In addition, in the mesa structure type surface light emitting element, the light emission efficiency is improved by using a current confinement mechanism to prevent the current from flowing to the side surface of the mesa structure 922. Here, the current confinement mechanism in this embodiment will be described. As shown in part (b) of
In the exposure head 106 in this embodiment, the density of light emitting points (interval between light emitting elements) is determined depending on the resolution. The light emitting elements inside the surface light emitting element array chip are separated into mesa structures 922 by element separating grooves 924, and, when forming an image with a resolution of 1200 dpi, for example, the distance between the element centers of adjacent light emitting elements (light emitting points) is arranged to be 21.16 μm.
As described above, in this embodiment, in the case where the main scan magnification correction depending on the fluctuation in length of the exposure head 106 with respect to the main scan direction is made, staggered conversion is carried out after the main scan magnification correction is performed by the main scan magnification correcting portion 404. As a result, it becomes possible to suppress the magnification fluctuation with respect to the main scan direction due to thermal expansion of each exposure head 106 without generating main scan magnification correction trace. In addition, it becomes possible to correct the magnification with respect to the main scan direction by the main scan magnification correcting portion 404, and therefore, there is no need to add a new mechanism, so that it becomes possible to suitably correct the main scan magnification while suppressing an increase in cost.
As described above, according to this embodiment, the magnification correction with respect to the main scan direction is carried out with a simple constitution, so that a deterioration of the output image can be suppressed.
While the present invention has been described with reference to exemplary embodiments, it is to understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Application No. 2019-Φ02581 filed on Jan. 10, 2019, which is hereby incorporated by reference herein in its entirety.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2019-002581 | Jan 2019 | JP | national |
