Claims
- 1. An amorphous p-type semiconductor matrix formed by the process comprising:
- (a) depositing on a support a matrix of amorphous hydrogenated silicon containing at least one chemical modifier, said chemical modifier being nitrogen in an amount from 0.1 to 30 atomic percent; and
- (b) simultaneously incorporating a p-type doping impurity in said matrix by gradually changing a rate of addition of said p-type impurity during step (a) to incorporate said p-type impurity in a non-uniform distribution in a gradual decreasing concentration from a support side to a free surface side within a range from 10.sup.15 to 10.sup.19 cm.sup.-3 to form a region which acts as a depletion region in order to provide improved electrical properties and acts as a barrier layer in order to inhibit injection of carriers from the support side.
- 2. An amorphous p-type semiconductor matrix as defined in claim 1, wherein said doping impurity is boron.
- 3. An amorphous p-type semiconductor matrix formed by the process comprising:
- (a) depositing on a support a matrix of amorphous hydrogenated silicon containing at least one chemical modifier, said chemical modifier being nitrogen in an amount from 0.1 to 30 atomic %; and
- (b) simultaneously incorporating a p-type doping impurity in said matrix by changing a rate of addition of said p-type impurity during step (a) to incorporate said p-type impurity in a higher amount at a support side and a lower amount at a free surface side within a range from 10.sup.15 to 10.sup.19 cm.sup.-3 to form a region which acts as a depletion region in order to provide improved electrical properties and acts as a barrier layer in order to inhibit injection of carriers from the support side.
- 4. A semiconductor device formed by the process comprising:
- (a) depositing on a support a photosensitive amorphous material comprising silicon as a matrix, hydrogen atoms and at least one element selected from the group consisting of oxygen, carbon and nitrogen; and
- (b) simultaneously incorporating an impurity for controlling conductive type in said photosensitive amorphous material by gradually changing a rate of addition of said impurity during step (a) to form on the support, in order, a first region containing a higher amount of said impurity and a second region containing a lower amount of said impurity to form a region which acts as a depletion region in order to provide improved electrical properties and acts as a barrier layer in order to inhibit injection of carriers from the support side.
- 5. The semiconductor device according to claim 4, wherein the impurity comprises p-type doping impurity.
- 6. The semiconductor device according to claim 4, wherein the one element selected from the group consisting of oxygen, carbon and nitrogen is contained in an amount from 0.1 to 30 atomic percent.
- 7. The semiconductor device according to claim 4, wherein the hydrogen atom is contained in an amount from 1 to 40 atomic percent.
- 8. The semiconductor device according to claim 5, wherein the p-type doping impurity comprises boron.
- 9. The semiconductor device according to claim 7, wherein the semiconductor device is an electrophotographic photosensitive member.
- 10. An electrophotographic image forming member produced by process comprising the steps of:
- (a) providing a support in a film formation space;
- (b) introducing into the space (i) a silane gas as a starting material gas, (ii) a starting material gas being a gas at room temperature containing at least one element selected from the group consisting of oxygen, carbon and nitrogen as a constituent element, and (iii) an impurity gas for controlling conductive type;
- (c) generating a glow discharge; and
- (d) reducing an amount of the impurity gas introduced into the space during the generation of the glow discharge, thereby forming on the support an amorphous material having sufficient photosensitivity and dark resistance for electrophotography comprising silicon atom as a matrix, 0.1 to 30 atomic percent of at least one element selected from the group consisting of oxygen, carbon and nitrogen, 1 to 40 atomic percent of hydrogen atom and an impurity for controlling conductive type, wherein the impurity is distributed non-uniformly in the layer thickness direction in a larger amount at a support side and a smaller amount at a free surface side to form a region which acts as a depletion region in order to provide improved electrical properties and acts as a barrier layer in order to inhibit injection of carriers from the support side.
- 11. The member according to claim 10, wherein the impurity gas comprises diborane.
- 12. The member according to claim 10, wherein the impurity gas comprises phosphine.
- 13. A light-receiving member comprising a layer of hydrogenated amorphous silicon provided on a support, said layer comprising silicon atoms as a matrix, boron atoms, hydrogen atoms and 1 to 30 atomic percent of at least one element selected from the group consisting of oxygen, carbon and nitrogen atom, wherein the layer comprises a first region containing a higher amount of boron at a support side and a second region containing a lower amount of boron than said first region to form a region which acts as a depletion region in order to provide improved electrical properties and acts as a barrier layer in order to inhibit injection of carriers from the support side.
- 14. The member according to claim 13, wherein the boron is present in an atomic amount of from 10.sup.15 to 10.sup.19 cm.sup.-3.
- 15. The member according to claim 13, wherein the light-receiving member is an electrophotographic photosensitive member.
- 16. The member according to claim 13, wherein the light-receiving member is an electrophotographic photosensitive member containing the boron atoms in an amount from 10.sup.15 to 10.sup.19 cm.sup.-3 and hydrogen atoms in an amount from 1 to 40 atomic percent, thereby providing sufficient photosensitivity and dark resistance for electrophotography.
Priority Claims (2)
Number |
Date |
Country |
Kind |
53/53605 |
May 1978 |
JPX |
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53/53606 |
May 1978 |
JPX |
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Parent Case Info
This application is a continuation of application Ser. No. 08/171,979, filed Dec. 23, 1993, now abandoned, which in turn, is a continuation of application Ser. No. 08/044,881, filed Apr. 7, 1993, now abandoned, which in turn, is a continuation of application Ser. No. 07/873,889, filed Apr. 24, 1992, now abandoned; which in turn, is a continuation of application Ser. No. 07/716,768, filed Jun. 19, 1991, now abandoned; which in turn, is a continuation of application Ser. No. 07/449,310, filed Dec. 6, 1989, now abandoned; which in turn, is a continuation of application Ser. No. 333,759, filed Apr. 5, 1989, now abandoned; which in turn, is a continuation of application Ser. No. 104,584, filed Oct. 2, 1987, now abandoned; which in turn is a continuation of application Ser. No. 912,699, filed Sep. 29, 1986, now abandoned; which in turn is a continuation of application Ser. No. 719,445, filed Apr. 3, 1985 now abandoned; which in turn, is a continuation of application Ser. No. 561,161, filed Dec. 14, 1983 now abandoned; which in turn, is a continuation of application Ser. No. 418,293, filed Sep. 15, 1982, now U.S. Pat. No. 4,565,731; which in turn, is a continuation of application Ser. No. 036,226, filed May 4, 1979, now issued as U.S. Pat. No. 4,471,042.
US Referenced Citations (19)
Non-Patent Literature Citations (4)
Entry |
Sze, S.M., Physics of Semiconductor Devices, John Wiley, 1981, pp. 32 & 293. |
"Electrical and Optical Properties of Amorphous Silicon Carbide, Silicon Nitride and Germanium Carbide Prepared by Glow Dis-charge", Philosophical Magazine, vol. 35, pp. 1-16 (1977). |
M. Le Contellec, et al., "Effects of the Silc on to Carbon Ratio and the H Content of Amorp. S.C. Thin Films Prepared by Reactive Sputtering," Thin Solid Films, 58 (1979) pp. 407-411. |
Moustakas, et al. Preparation of Highly Photoconductive Amorphous Silicon by rf Sputtering, Solid State Comm., vol. 23, pp. 155-158. |
Continuations (12)
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171979 |
Dec 1993 |
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Parent |
44881 |
Apr 1993 |
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873889 |
Apr 1992 |
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Parent |
716768 |
Jun 1991 |
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Parent |
449310 |
Dec 1989 |
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Parent |
333759 |
Apr 1989 |
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Parent |
104584 |
Oct 1987 |
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Parent |
912699 |
Sep 1986 |
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Parent |
719445 |
Apr 1985 |
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Parent |
561161 |
Dec 1983 |
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Parent |
418293 |
Sep 1982 |
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36226 |
May 1979 |
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