Image intensifier tube

Information

  • Patent Grant
  • 6465938
  • Patent Number
    6,465,938
  • Date Filed
    Tuesday, September 25, 2001
    22 years ago
  • Date Issued
    Tuesday, October 15, 2002
    21 years ago
Abstract
An image intensifier tube includes a photocathode (20) with an active layer (52) providing an electrical spectral response to photons of light. The photocathode (20) also includes integral spacer structure (42) which extends toward and physically touches a microchannel plate (22) of the image intensifier tube in order to establish and maintain a desirably precise and fine-dimension spacing distance “G” between the photocathode and the microchannel plate. A method of making the photocathode and a method of making the image intensifier tube are described also.
Description




BACKGROUND OF THE INVENTION




1. Field of the Invention




The present invention is in the field of night vision devices. More particularly, the present invention relates to an image intensifier tube usable in such night vision devices. Such image intensifier tubes are generally responsive to infrared radiation to provide an image in visible light which is replicative of a scene which may be too dim to be viewed with the unaided natural human vision. Still more particularly, the present invention relates to a photocathode for use in such an image intensifier tube, which photocathode according to the preferred embodiment includes integral structure for establishing and maintaining a precise fine-dimension spacing between the photocathode and a microchannel plate of the image intensifier tube. In other words, in the preferred embodiment, part of the photocathode extends to and physically touches the microchannel plate to establish a minimal spacing dimension between the photocathode and the microchannel plate. Further, the present invention relates to a method of making such a photocathode and an image intensifier tube including such a photocathode.




2. Related Technology




Image intensifier tubes which are responsive to low-level visible or infrared light are commonly used in night vision systems. Night vision systems are used by military and law enforcement personnel for conducting operations in low light conditions, or at night. Further, such night vision devices find many civilian uses for hunting, conservation, industrial observations in low-light conditions, and many other uses. For example, night vision systems are used by pilots of helicopters and airplanes to assist their ability to fly at night.




A night vision system converts the available low-intensity ambient light of the visible spectrum, and also at the near infrared portion of the invisible infrared spectrum to a visible image. These systems require some minimal level of ambient light, such as moon light or star light, in which to operate. This minimal level of ambient light may be infrared light which does not provide visibility to the natural human vision. The ambient light is intensified by the night vision system to produce an output image which is visible to the human eye. The present generation of night vision systems utilize image intensification technologies to intensify the low-level visible light as well as the near-infrared invisible light. This image intensification process involves conversation of the received ambient light into electron patterns, intensification of the electron patterns while retaining the relative intensity levels and contrast of the scene, and projection of the electron patterns onto a phosphor screen for conversion into a visible-light image for the operator. The visible-light image is then viewed by an operator of the night vision system through a lens provided in an eyepiece of the system.




The typical night vision system has an optics portion and a control portion. The optics portion comprises lenses for focusing on a scene to be viewed, and an image intensifier tube. The image intensifier tube performs the image intensification process described above, and includes a photocathode liberating photo-electrons in response to light photons to convert the light energy received from the scene into electron patterns, a micro channel plate to multiply the electrons, a phosphor screen to convert the electron patterns into visible light, and possibly a fiber optic transfer window to invert the image. The control portion includes the electronic circuitry necessary for controlling and powering the image intensifier tube portion of the night vision system.




A factor limiting the performance of conventional image intensification tubes is the photocathode, and its spacing from the microchannel plate. That is, the photocathode of conventional image intensifier tubes is spaced sufficiently from the microchannel plate that a phenomenon known as halo occurs, and such that a higher than desired voltage must be maintained between the photocathode and the microchannel plate.




On the other hand, manufacturing economies, limitations, and practices have heretofore frustrated attempts to reduce the spacing dimension between a photocathode and the microchannel plate of an image intensifier tube. To place this problem in perspective, conventional spacing dimensions for GEN III image intensifier tubes are on the order of 250μ meter (+ or − about 25μ meter). This dimension is 0.000250 meter. Understandably, manufacturing tolerances and practices must be very precise to position a photocathode and microchannel plate at this distance from one another, parallel to one another—within tolerances, and without having these two structures touch one another. Further, the electric field which exists between these two structures is strongly affected by the spacing dimension between them. If the spacing is too small in conventional image intensifier tubes, then electrical discharge areas can occur—rendering the tube unusable. Similarly, too great of a spacing dimension results in a tube of sub-par performance.




A conventional photocathode for an infra-red type of sensor is known in accord with U.S. Pat. No. 3,959,045, issued May 25, 1976, to G. A. Antypas. The photocathode taught by the '045 patent is one version of the now-conventional Gen 3 photocathode described above.




However, the conventional spacing dimension used in conventional image intensifier tubes is much greater than desired. In order to allow the image intensifier tube to operate with a lower level of voltage applied between the photocathode and the microchannel plate, it is desirable to reduce the spacing between the photocathode and the microchannel plate, perhaps by as much as an order of magnitude below that spacing that is presently conventional. Such a reduction in spacing dimension between the photocathode and microchannel plate would, it is believed, also be effective to reduce or eliminate the halo phenomenon.




SUMMARY OF THE INVENTION




In view of the above, a need exists to provide an image intensifier tube (I


2


T) which has a spacing dimension between the photocathode (PC) and microchannel plate (MCP) of the tube which is substantially smaller than conventional.




Further to the above, it is desirable and is an object for this invention to provide a photocathode for an image intensifier tube which includes integral spacer structure, for extending toward and physically touching the microchannel plate of the image intensifier tube, so as to precisely space this microchannel plate away from the photocathode.




Additionally, a need exists for a method of making such a photocathode, and for making an image intensifier tube including such a photocathode.




Accordingly the present invention provides according to a particularly preferred exemplary embodiment of the invention, apparatus including a paired photocathode and microchannel plate, the photocathode responding to photons of light by releasing photoelectrons, and the microchannel plate receiving the photoelectrons and responsively releasing secondary-emission electrons, the photocathode/microchannel plate pair comprising: a photocathode active layer defining an active area responsive to photons of light to liberate photoelectrons, and an insulative spacing structure circumscribing the active area and extending between the photocathode at the active area and the microchannel plate, the spacing structure having an end surface confronting and physically contacting one of the photocathode and microchannel plate to establish a minimum spacing distance between the active area and the microchannel plate.




Also, the present invention provides a method of making such a photocathode, and an image intensifier tube including such a photocathode.




In view of the above, it will be apparent that an advantage of the present invention resides in the provision of a photocathode with integral PC-to-MCP spacer structure. Further, this spacer structure of the PC actually extends toward and physically touches the MCP to establish the spacing between these two structures. It follows that physically tolerances of the body of an I


2


T embodying the present invention have a much lesser or no significant effect upon the PC-to-MCP spacing.




These and additional objects and advantages of the present invention will be apparent from a reading of the present detailed description of a single particularly preferred exemplary embodiment of the present invention, taken in conjunction with the appended drawing Figures, in which the same reference numeral refers to the same feature, or to features which are analogous in structure or function to one another.











BRIEF DESCRIPTION OF THE DRAWING FIGURES





FIG. 1

provides a schematic depiction of an night vision device including an image intensifier tube (I


2


T);





FIG. 2

is a longitudinal cross section of an image intensifier tube, with an associated power supply, and includes schematically depicted optical elements for a night vision device;





FIG. 3

is a greatly enlarged view of an encircled portion of

FIG. 2

;





FIG. 4

presents a perspective view of a window member for an image intensifier tube according to the present invention, which window member includes an inventive photocathode;





FIG. 5

is a greatly enlarged fragmentary cross sectional taken at line


5





5


of

FIG. 4

;





FIG. 6

is a still more greatly enlarged view of an encircled portion of

FIG. 5

;





FIG. 7

schematically presents a photocathode workpiece at a selected stage of manufacture;





FIG. 8

is a perspective view similar to

FIG. 3

, but showing an alternative embodiment of a photocathode according to the present invention; and





FIG. 9

is a greatly enlarged fragmentary perspective view of the photocathode seen in FIG.


8


.











DETAILED DESCRIPTION OF THE PREFERRED EXEMPLARY EMBODIMENTS OF THE INVENTION




While the present invention may be embodied in many different forms, disclosed herein are two specific exemplary embodiments which each individually as well as together illustrate and explain the principles of the invention. It should be emphasized that the present invention is not limited to the specific embodiments illustrated and described.




Referring first to

FIG. 1

, there is shown schematically the basic elements of one version of a night vision device


10


of the light amplification type. Night vision device


10


generally comprises a forward objective optical lens assembly


12


(illustrated schematically as a single lens element, although it will be understood that the objective lens assembly


12


may include one or more lenses. This objective lens


12


focuses incoming light from a distant scene (which may be a night-time scene illuminated with only star light or with infrared light from another source) through the front light-receiving end surface


14




a


of an image intensifier tube (I


2


T)


14


. As will be seen, this surface


14




a


is defined by a transparent window portion


14




c


of the tube—to be further described below.




As was generally explained above, the I


2


T provides an image at light output end


14




b


in phosphorescent yellow-green visible light, which image replicates the scene. The visible image from the I


2


T is presented by the device


10


to a user via an eye piece lens illustrated schematically as a single lens


16


producing a virtual image of the rear light-output end of the tube


14


at the user's eye


18


.




More particularly now viewing the I


2


T


14


, it is seen that this tube includes: a photocathode (PC)


20


which is carried upon an inner surface of the window portion


14


c, and which is responsive to photons of visible light and of invisible infrared light to liberate photoelectrons; a microchannel plate (MCP)


22


which receives the photoelectrons in a pattern replicating the (and which provides an amplified pattern of electrons also replicating this scene); and a display electrode assembly


24


. In the present embodiment the display electrode assembly


24


may be considered as having an aluminized phosphor coating or phosphor screen


26


. When this phosphor coating is impacted by the electron shower from microchannel plate


22


, it produces a visible image replicating the pattern of the electron shower. Because the electron shower in pattern intensity still replicates the scene viewed via lens


12


, a user of the device can effectively see in the dark, viewing a scene illuminated by, for example, only star light or other low-level or invisible infrared light.




A transparent image output window portion


24




a


of the assembly


24


, to be further described below, defines the surface


14




b


and conveys the image from screen


26


outwardly of the tube


14


so that it can be presented to the user


18


. The image output window portion


24




a


may be plain glass, or may be fiber optic, as depicted in FIG.


2


. Those ordinarily skilled will understand that a fiber optic output window


24




a


may include a 1800 twist of the fibers over the length of this window portion, so that it inverts the image provided by the screen


26


.




The tube


20


is powered by a conventional image tube power supply


28


, connected to the tube


20


by plural power supply conductors


28




a


. Those ordinarily skilled in the pertinent arts will understand that the power supply


28


maintains a electrostatic voltage gradient in the (I


2


T)


14


, and provides a current flow which is necessary to provide a shower of electrons in a pattern which replicates the image of the viewed scene. As is seen in

FIG. 1

, and as will be further explained, the power supply


28


provides via connections


28




a


, a voltage and current supply connection to the PC


20


, to opposite facial electrodes of the MCP


22


, and to the display assembly


24


.




Light which is received through the window portion


14




c


is incident upon the photocathode portion


20


of the image intensification tube


14


. The photocathode


20


in one respect which is conventional, is responsive to incident photons of particular frequencies and wavelengths to emit photoelectrons in response to the photons, as is indicated by the arrows


30


. The photoelectrons


30


move rightwardly, viewing

FIG. 1

, under the influence of the prevailing electrostatic field from power supply


28


and into the various microchannels of the microchannel plate


22


. This microchannel plate


22


is specially constructed to provide secondary emission electrons in response to the photoelectrons


30


. As is indicated by the arrowed reference numeral


32


and the associated lead line, at the outlet side of the MCP


22


, a shower of photoelectrons and secondary emission electrons is provided by the microchannel plate


22


. The pattern of the shower


32


of electrons replicates the pattern of the photons falling on the photocathode


20


. This shower of electrons


32


is directed to the phosphorescent screen


26


where it produces a visible image replicative of the image falling on the photocathode


20


, but more intense by several orders of magnitude.




It will be noted further viewing

FIG. 1

, that the tube


14


includes a generally tubular housing, which is indicated generally by the numeral


34


. This housing


34


is sealingly closed at one end by the window portion


14




c


and at the other end is closed by the image output window


24




a


. Between the window portions


14




c


and


24




a


, the housing


34


includes a plurality of metallic ring elements, indicated with the reference numeral


36


, having alphabetic suffixes added thereto in order to distinguish the individual metallic rings from one another. Disposed between the metallic ring elements


36


, is a plurality of insulator ring elements, which in this case are preferably made of ceramic material, and which are indicated with the numeral


38


having an alphabetic suffix added thereto to distinguish the individual insulator rings.




At the interface of metallic ring element


36




a


and window portion


14




c


, is disposed a variable-dimension, selectively-deformable metallic seal element, indicated with the arrowed numeral


40


. By “variable-dimension” in this instance is meant that the seal element


40


may have a variety of axial lengths along the length dimension of tube


14


between the window portions


14




c


and


24




a


. Because of this variable-dimension seal element, the spacing “G” defined between the PC


20


and the MCP


22


is potentially variable. However, as will be seen, according to the present invention the spacing “G” of the image tube


14


is precisely established and maintained at a fine-dimension value which is much smaller than was heretofore reliably obtainable in serial production of image intensifier tubes.




Turning now to

FIGS. 3 and 4

, which respectively provide a greatly enlarged fragmentary view of an encircled portion of

FIG. 2

, and a perspective view of the window portion


14




c


in isolation (but including the metallic ring element


36




a


and PC


20


), it is seen that the PC


20


carried on window portion


14




c


includes a circumferentially extending fine-dimension insulative rib


42


. This rib


42


in the I


2


T


14


extends axially toward and actually physically touches, the MCP


22


. Preferably, the rib


42


is formed of Aluminum Gallium Arsenide (AlGaAs). As will be seen further, because of the insulative rib


42


, during manufacturing of the I


2


T


14


at a time when the window portion


14




c


including PC


20


and metallic ring element


36




a


is sealingly united with the variable-dimension, selectively deformable seal element


40


, this seal element is selectively deformed such that the rib


42


at an end surface


42




a


thereof, contacts the MCP


22


. This contact of the rib


42


with the MCP


22


establishes and maintains a selected fine-dimension spacing distance “G” between an active area of the PC


20


and the MCP


22


, as is explained below.




At this point in the explanation, it is well to note that within the rib


42


, the PC


20


has an active area


44


. The active area


44


defines the surface from which photoelectrons are liberated by the PC


20


in response to photons of light from the scene. In order to make electrical connection with the active area


44


, the window portion


14




c


includes a thin metallic metallization layer


46


extending across a surface of the window portion


14




c


between metallic ring element


36




a


and the peripheral edge of the PC


20


. Viewing

FIG. 4

, it is seen that the metallization layer


46


contacts a peripheral portion of material of the active area


44


, but that this contact is outside of the rib


42


. Further, the rib


42


is integral with but a different material from the material of the active area


44


. The material of the active area


44


extends integrally under the rib


42


in order to make sufficient electrical contact with the metallization layer


46


.




Turning to

FIG. 6

, it is seen that the PC


20


includes plural sub-layers, which are all carried upon the window portion


14




c


, and which are cooperative in achieving the objective for the PC


20


to release photoelectrons in response of photons of light from the scene, and also to establish the PC-to-MCP spacing at the interface of the PC


20


with the MCP


22


. To this end, the PC


20


includes an anti-reflective layer


48


, which interfaces directly with the window portion


14


c. The anti-reflective layer


48


may be formed of Silicon dioxide, and Silicon nitride (i.e., SiO


2


and Si


3


N


4


). Upon the anti-reflective layer


48


is carried a window layer


50


, which is principally formed of Aluminum Gallium Arsenide (AlGaAs) as will be more particularly explained below. The window layer


50


carries an active layer


52


, which may be formed of Gallium Arsenide (GaAs). It is this active layer


52


which carries the rib


42


and defines the active area


44


, as is seen in FIG.


5


.




Particularly, it is to be noted that the active layer


52


extends between the metallization


46


(seen in

FIG. 5

, for example), and the active area


44


. Thus, the electrical connection to the active area portion of layer


52


is effected by the ring


36




a


, which has connection to the metallization,


46


, and from this metallization


46


to the outer circumferential portion of the layer


52


outwardly of rib


42


. From the outer circumferential portion of layer


52


outwardly of rib


42


, the electrical connection to the area


44


is effectively defined by that portion of the active layer


52


which is immediately under the rib


42


. Thus in this embodiment, the conductivity of an annular circumferential portion of the layer


52


, which immediately under the rib


42


, and which is indicated on

FIG. 5

, by the dashed lines coincident with the inner and outer edges of this rib


42


, and the reference numeral


52




a


, is relied upon to conduct the necessary electron current to the active area


44


.





FIG. 6

provides a schematic illustration of a PC work piece (indicated with reference numeral


20




a


) which will become the PC


20


, but which in

FIG. 6

is shown at an unfinished intermediate stage of manufacture. Viewing

FIG. 6

, the work piece


20




a


includes a bulk substrate


54


, which provides a foundation upon which the other layers of the PC


20


may be formed. The bulk substrate


54


is preferably formed of Gallium Arsenide (GaAs), and carries a buffer layer


56


of high quality single crystalline GaAs which has been formed by MOCVD technique. The bulk substrate


54


is preferably a low defect density single crystal wafer in the crystal orientation of (001). The buffer layer


56


effectively reduces or eliminates the propagation into subsequent layers of crystal-quality imperfections or degradations, which could result from crystalline defects in the GaAs substrate material


54


. The buffer layer


56


also minimizes contamination (i.e., from the substrate


54


) of the subsequent layers of material to be grown atop this substrate. Preferably, the buffer layer


56


is about 1.0 microns thick.




Atop the buffer layer


56


is placed a stop layer


58


, which is about 0.5 microns thick, and which is preferably in the range of from about 50 to about 60 atomic percent aluminum in a stop layer of aluminum gallium arsenide (AlGaAs). As will be better understood in view of following explanation, the etch rate of this stop layer can be controlled by varying the proportion of aluminum in this layer.




On the stop layer


58


is placed a spacer layer


60


, which is again formed of aluminum gallium arsenide (AlGaAs), with the atomic percentage of aluminum selected to allow this layer to be selectively patterned and etched, as is further explained below. The active layer


52


of GaAs, which is about a micron or more in thickness is formed atop the spacer layer


60


. This active layer


52


is doped with a p-type of impurity, such as zinc, for example, to produce a negative electron affinity for the active layer


52


. Preferably, the active layer


52


is doped at a concentration of about 1×10


19


dopant atoms per cubic centimeter of GaAs material in the active layer


52


. This active layer


52


, may be controlled in thickness, as is explained below, in order to be sufficiently thin as to maximize the yield of photoelectrons arriving at the lower surface of the active layer


52


(i.e., via the window portion


14




c


, which will be disposed there after completion of manufacturing). Dependent upon the spectral response desired for a particular photocathode, the thickness of the finished active layer


52


may be in the range of from about 1.2 microns or more to as little as about 0.2 micron to 0.7 micron. For a high sensitivity to blue-green light, for example, the active layer


52


would be between 0.4 and 0.5 micron thick. Most preferably if a high blue-green sensitivity is desired, then the active layer


52


is about 0.45 micron thick.




On the active layer


52


is formed the window layer


50


of AlGaAs, which is also of a thickness of less than or equal to about one micron. Preferably, this window layer


50


has a thickness of about 0.5 to about 0.7 micron. This window layer


50


is doped also with a p-type of impurity, preferably to a concentration of impurity atoms of about 1×10


18


dopant atoms per cubic centimeter of AlGaAs in the window layer


50


, or lower.




In order to make the window layer


50


more transparent to light in the shorter wavelengths, such as light as short in wavelength as the blue-green transition, and blue light as well, if desired, the window layer


50


may be formed with a concentration of aluminum in the AlGaAs of at least eighty (80) percent. Preferably, if blue-green and blue light sensitivity is desired, then the window layer


50


of AlGaAs has a concentration of Al in the range of 83 to 90 atomic percent. Because of considerations having to do with preparation of a high quality interface with the active layer


52


and minimization of difficulties in the photocathode fabrication process, concentrations of aluminum in the window layer of greater than 90 percent are probably not advisable. Atop the window layer


50


a temporary top layer


62


of GaAs may be formed.




Consideration of

FIG. 7

will show that the steps and structure so far described are depicted diagrammatically as the structural result of steps 1 through 7 (i.e., by the circled step number associated with each respective structural layer of the work piece structure seen in FIG.


7


). If used, the temporary top layer


62


is subsequently etched away using a suitable concentration of a conventional etchant, such as NH


4


OH and H


2


O


2


, A thin anti-reflective layer


48


of SiO


2


and Si


3


N


4


is deposited on the window layer


50


. A thin passivating layer (indicated by arrowed numeral


64


in FIG.


6


), which is formed of SiO


2


, may be placed over the anti-reflective layer


48


.




Next, the resulting assembly is thermal compression bonded to a glass face plate which forms the window portion


14




c


. Preferably, the glass face plate may be made of 7056 borosilicate glass. Such a glass is available from Corning Glass. Next, the assembly described so far then has the bulk substrate


54


etched away using a suitable concentration of a conventional etchant, such as NH


4


OH and H


2


O


2


. The stop layer


58


is removed using Hcl solution.




Subsequently, the spacer layer


60


is patterned and etched using photoreactive masking material and etchant, to produce the rib


42


. The thickness of the active layer


52


may be adjusted in two steps using suitable etchants, as is further explained below. The thickness of the active layer


52


is preferably reduced to be in the range from about 1.2 microns to as thin as about 0.45 micron. Using an etchant solution of NH


4


OH and H


2


O


2


, the active layer


52


may be initially thinned. Then in a second step, an etchant solution of H


2


SO


4


and H


2


O


2


is used to further adjust the active layer thickness so that it matches the selected thickness for this layer. Thus, it will be appreciated that the thickness of the active layer


52


may be greater immediately under the rib


42


(viewing

FIG. 6

once again—and recalling that the drawings are not to scale) than it is in the active portion


44


of this active layer. For purposes of illustration, the height of rib


42




a


, for example, is shown somewhat exaggerated. The peripheral metallization electrode


46


is applied for connection of electrostatic charge from the power supply


28


to the photocathode


20


via this ring and the metallization layer.




This second etch step, as well as a definition step for the rib


42


may be conducted just before the photocathode assembly is loaded into a vacuum exhaust system in preparation for uniting this photocathode (i.e., on window portion


14




c


) with the remainder of the tube


14


so as to minimize contamination of the active layer surface in active area


44


. Once the active layer


52


is thinned to the desired thickness, the rib


42


may be planarized using conventional techniques known to the semiconductor fabrication industry, to produce the end surface


42




a


on this rib at a precisely controlled spacing distance from the surface of active area


44


. As will be appreciated in view of the above, the spacing of surface


42




a


from the surface of the active area


44


is essentially the gap dimension “G” explained above. This correlation of the dimension of the end surface


42




a


of the rib


42


above the surface of active area


44


, and the gap dimension “G” is shown on FIG.


3


.




Next, the active layer


52


is thermally surface cleaned in a very high vacuum exhaust station to remove surface oxides and absorbed gas species. The active layer


52


is next activated with Cs and O


2


to enhance the photosensitivity of the photocathode


20


. The resulting finished photocathode assembly is then bonded to the remainder of the tube


14


by use of a cold weld effected under high vacuum, oxygen-free conditions. As this cold weld process is conducted, the rib


42


is effective to insure establishment and maintenance of a precisely controlled and fine-dimension gap “G” between the PC


20


(i.e., at the surface of active area


44


) and the closest face of the MCP


22


.





FIG. 8

provides a perspective view of an alternative embodiment of the present invention, which is similar to

FIG. 4

, except as described below. Because of the similarities of this alternative embodiment of the invention to that which has already been described, the same reference numeral used above, but increased by one-hundred (100) is used in

FIG. 8

to indicate features which are the same or which are equivalent in structure or function to a feature already described above. Viewing now

FIG. 8

, a window portion


114




c


is seen in the same perspective position as window portion


14


of FIG.


4


. However, in this alternative embodiment, the rib


142


has a crenellated configuration, with plural circumferentially spaced apart merlons


142




c


spacing apart a corresponding plurality of arcuate circumferentially extending crenels


142




b


extending between the active area


144


and the electrode


146


.




The merlons


142




c


cooperatively define end surface


142




a


for the rib


142


, which end surface is at a spacing from the surface of the active area


144


as was described above (i.e., to establish gap “G”). Further, the metallic electrode


146


has plural radially extending portions


146




a


which pass inwardly though the crenels


142




b


to make multiple circumferentially spaced apart electrical contacts with the active area


144


. Thus, in this embodiment, the rib


142


is discontinuous circumferentially, and radially extending portions


146




a


of the electrode


146


extend through plural openings of the rib to make electrical contact directly with the active area of the PC.




While the present invention has been depicted, described, and is defined by reference to particularly preferred embodiments of the invention, such reference does not imply a limitation on the invention, and no such limitation is to be inferred. The invention is capable of considerable modification, alteration, and equivalents in form and function, as will occur to those ordinarily skilled in the pertinent arts. For example, the spacer structure does not have to be integral with the photocathode in order to effect the establishment and maintenance of the desired fine-dimension gap dimension. That is, the spacing structure could be carried by some other element of the structure. However, the spacing structure does extend axially between the photocathode and the input face of the microchannel plate in order to space these two structures apart. Accordingly, it is seen that the depicted and described preferred embodiments of the invention are exemplary only, and are not exhaustive of the scope of the invention. Consequently, the invention is intended to be limited only by the spirit and scope of the appended claims, giving full cognizance to equivalents in all respects.



Claims
  • 1. Apparatus including a paired photocathode and microchannel plate, the photocathode responding to photons of light by releasing photoelectrons, and the microchannel plate receiving the photoelectrons and responsively releasing secondary-emission electrons, said photocathode/microchannel plate pair comprising:a photocathode active layer defining an active area responsive to photons of light to liberate photoelectrons, and an insulative spacing structure circumscribing said active area and extending between said photocathode at said active area and the microchannel plate, said spacing structure having an end surface confronting and physically contacting one of said photocathode and microchannel plate to establish a minimum spacing distance between said active area and said microchannel plate.
  • 2. The apparatus of claim 1 wherein said insulative spacing structure includes a rib of insulative material extending outwardly upon the active layer of the photocathode and toward the microchannel plate.
  • 3. The apparatus of claim 2 wherein said insulative spacing structure is configured as a circumferential rib carried by said photocathode.
  • 4. The apparatus of claim 3 wherein said circumferential rib is circumferentially discontinuous.
  • 5. The apparatus of claim 4 wherein said circumferential rib defines plural circumferentially spaced apart merlons.
  • 6. The apparatus of claim 5 wherein said circumferential spaced apart merlons cooperatively define plural crenellations each opening radially from said active area toward an outer circumferential portion of said photocathode.
  • 7. The apparatus of claim 4 wherein said photocathode further includes a metallic conductive electrode, and said electrode includes a portion extending between adjacent sections of said discontinuous rib to contact said active area of said active layer.
  • 8. The apparatus of claim 3 wherein said photocathode further includes a metallic conductive electrode, said electrode circumscribing said photocathode and making electrical contact with an outer circumferential portion thereof, a portion of said photocathode underlying said rib and making electrical contact between said outer circumferential portion of said photocathode and said active area.
Parent Case Info

This application is a divisional of application Ser. No. 09/272,039, filed on Mar. 18, 1999, now U.S. Pat. No. 6,331,753.

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Entry
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