1. Field of the Invention
The present invention relates to an image pickup apparatus and endoscope equipped with a solid-state image pickup device chip, a flexible printed circuit board connected to the solid-state image pickup device chip at one end, and multiple electronic components mounted at least on one side of the flexible printed circuit board.
2. Description of the Related Art
In electronic endoscope apparatus which have come into widespread use in recent years, an image pickup apparatus which uses a solid-state image pickup device chip as image pickup means is disposed at a distal end of an insertion portion of an endoscope. In medical applications, for example, the insertion portion with the image pickup apparatus disposed is inserted in a body cavity to allow images of an area to be examined in the body cavity to be observed on a monitor.
Generally, principal part of the image pickup apparatus includes a solid-state image pickup device chip which has an image pickup surface, a cover glass which, being affixed to the image pickup surface, protects the image pickup surface, a TAB (Tape Automated Bonding) or other flexible printed circuit board (hereinafter referred to as an FPC) on which electronic components such as capacitors, resistors, and transistors are mounted, and a signal cable which transmits electrical signals of images of an area to be examined received from the solid-state image pickup device chip to external apparatus such as an image processing apparatus and monitor, where the FPC is connected at one end to a bonding portion of the solid-state image pickup device chip, and a lead wire connecting portion at the other end of the FPC is connected with lead wires of the signal cable.
To prevent the electronic components mounted on the FPC as well as other components in the lead wire connecting portion from contacting each other and downsize the image pickup apparatus, behind a back face opposite the image pickup surface of the solid-state image pickup device chip, the FPC conventionally is disposed in such a way as to be superimposed over a package unit whose principal part includes the cover glass, the solid-state image pickup chip, and bonding portion, when seen in planar view from the image pickup surface.
Specifically, the FPC is disposed, being inclined at a predetermined angle with respect to the back face of the solid-state image pickup device chip so that the FPC will be superimposed over the package unit when seen in planar view from the image pickup surface. That is, the FPC is disposed in such a way as substantially not to jut out from the package unit when seen in planar view from the image pickup surface.
However, downsizing of the package unit and increase in the number of electronic components mounted on the FPC pose a problem in that the FPC disposed behind the solid-state image pickup device chip juts out greatly from the package unit when seen in planar view from the image pickup surface.
In view of the above problem, Japanese Patent Application Laid-Open Publication No. 2000-210252 discloses a solid-state image pickup apparatus which can dispose an FPC so as not to jut out from a package unit when seen in planar view from an image pickup surface by providing plural bending lines on the FPC, bending the FPC into a box along the bending lines, housing plural electronic components and lead wire connecting portions efficiently in space of the FPC box even when the number of electronic components is increased or the package unit is downsized.
The present invention provides an image pickup apparatus including: a solid-state image pickup device chip; a flexible printed circuit board connected at one end to the solid-state image pickup device chip; and a plurality of electronic components mounted on one side of the flexible printed circuit board, wherein behind a back face opposite an image pickup surface of the solid-state image pickup chip, the flexible printed circuit board is disposed by being folded in such a way that the flexible printed circuit board will provide mounting surfaces for the plurality of electronic components in a plurality of layers and that the electronic components will be superimposed via the flexible printed circuit board.
Also, the present invention provides an endoscope which includes an image pickup apparatus, the image pickup apparatus including: a solid-state image pickup device chip; a flexible printed circuit board connected at one end to the solid-state image pickup device chip; and a plurality of electronic components mounted on one side of the flexible printed circuit board, wherein behind a back face opposite an image pickup surface of the solid-state image pickup chip, the flexible printed circuit board is disposed by being folded in such a way that the flexible printed circuit board will provide mounting surfaces for the plurality of electronic components in a plurality of layers and that the electronic components will be superimposed via the flexible printed circuit board.
Embodiments of the present invention will be described below with reference to the drawings. In the embodiments described below, it is assumed that an image pickup apparatus is installed in a distal end portion of an insertion portion of a medical endoscope.
As shown in
Principal part of the peripheral apparatus 100 includes, a light source 21, video processor 22 which is an external apparatus, connection cable 23, keyboard 24, and monitor 25, all of which are placed on a rack 26. The endoscope 2 and peripheral apparatus 100 configured as described above are interconnected via a connector 19.
The operation portion 3 of the endoscope 2 is provided with a bending operation knob 9, air/water supply button 16, suction button 17, and treatment instrument insertion port 18.
The insertion portion 4 of the endoscope 2 includes a distal end portion 6, bending portion 7, and flexible tubular portion 8. The bending portion 7 is disposed between the distal end portion 6 and flexible tubular portion 8 and operated via the bending operation knob 9 installed in the operation portion 3.
A cover glass 99 is disposed on a distal end face on a distal side in an insertion direction (hereinafter simply referred to as the distal side) of the distal end portion 6, where the cover glass 99 covers an objective lens 11a located on the distal side, in the insertion direction, of an objective lens group 11 of an image pickup unit 200 (described later) (see
Also, in the distal end face on the distal side of the distal end portion 6, there are a nozzle 12, an illumination window 13, and a distal opening 14 of a treatment instrument passage (not shown), where the nozzle 12 is used to spray a fluid such as water or air onto a surface of the cover glass 99 and thereby clean the surface of the cover glass 99.
The distal end portion 6 incorporates an image pickup apparatus 20 of the image pickup unit 200 described later (see
The nozzle 12 selectively ejects gas and liquid when the air/water supply button 16 in the operation portion 3 is pressed. When the suction button 17 in the operation portion 3 is pressed, mucus and the like in a body cavity are selectively recovered through the distal opening 14 of the treatment instrument passage which extends in the insertion portion 4 from the distal opening 14 to the treatment instrument insertion port 18.
The connector 19 is installed at a tip of the universal cord 5 of the endoscope 2 and is connected to the light source 21 of the peripheral apparatus 100. The connector 19 is provided with a light guide ferrule (not shown) used to hold an end of a light guide (not shown), an electrical contact unit connected with an end of a signal cable 34 (described later; see
From the light guide ferrule (described above) on the connector 19, the light guide is inserted to a position near the illumination window 13 in the distal end portion 6 by passing through the universal cord 5, operation portion 3, and insertion portion 4 to transmit illumination light from the light source 21 to the illumination window 13 and thereby illuminate the body cavity widely through the illumination window 13.
The signal cable 34 is inserted from a solid-state image pickup device chip 32 (described later; see
Next, a configuration of the image pickup apparatus 20 installed in the distal end portion 6 will be described with reference to
As shown in
An outer circumference on a rear side, in the insertion direction (hereinafter simply referred to as the rear side), of the lens frame 36 is fitted and fixed in an inner circumference on the distal side of the device frame 37. The distal side of the shielding member 33 is fixed to an outer circumference on the rear side of the device frame 37.
Furthermore, the heat-shrinkable tube 45 which covers outer circumferences of the device frame 37 and shielding member 33 is fixed to an outer circumference on the distal side of the device frame 37. The rear side of the heat-shrinkable tube 45 is fixed to an outer circumference on the distal side of the protective tube 46. The protective tube 46 covers an outer circumference of the signal cable 34 to protect the signal cable 34.
The image pickup apparatus 20 is disposed together with the thermoplastic resin 49 in an airtight space sealed by the shielding member 33 and heat-shrinkable tube 45, on the rear side, in the insertion direction (hereinafter simply referred to as the rear side), of the objective lens group 11.
Principal part of the image pickup apparatus 20 includes the solid-state image pickup device chip 32, a first cover glass 38, a second cover glass 39, an FPC 43, and the signal cable 34.
The first cover glass 38 is affixed to the image pickup surface 32m of the solid-state image pickup device chip 32 to protect the image pickup surface 32m. The second cover glass 39 larger in external dimensions than the first cover glass 38 is affixed to a distal end face of the first cover glass 38. Incidentally, an outer circumference of the second cover glass 39 is fixed to an inner circumference of the device frame 37.
Also, as shown in
Behind a back face 32h of the solid-state image pickup device chip 32, with terminals 90 (described later; see
As shown in
Also, the lead wire connecting portions 73 and 74 are provided on the front surface 43i of the FPC 43 in order to be electrically connected with multiple lead wires 44 of the signal cable 34, for example, by soldering.
Specifically, as shown in
Also, in the first region 51 on the front surface 43i of the FPC 43, electronic components smaller than the predetermined size, e.g., electronic components 70c smaller than the known standard, 1005, and compliant with a known standard, 0603, 0402, or the like, are disposed in a region 170 surrounded by the electronic components 70a and 70b equal to or larger than the known standard 1005 when seen in planar view.
Also, the terminals 90 connected to the bonding portion 41 of the solid-state image pickup device chip 32 are installed at the left end of the first region 51 in
Furthermore, the first region 51 has a tapered portion 130, tapering down toward the end at which the terminals 90 are installed.
When, for example, an epoxy adhesive is applied to a predetermined thickness on the front surface 43i of the FPC 43 to fix the shape of the FPC 43 or reinforce the electronic components 70 to 72 mounted on the FPC 43, the tapered portion 130 serves to prevent the adhesive from running out of narrowed part of the first region 51 on the front surface 43i of the FPC 43.
Generally, when part near the terminals 90 narrows abruptly from the other part of the first region 51, if a thin coat of adhesive is applied to accommodate the narrower part, it is not possible to reinforce the electronic components mounted on the wider part sufficiently. On the other hand, if a thick coat of adhesive is applied to accommodate the wider part, the adhesive will run out of the narrower part. Consequently, there is a problem in that application thickness of the adhesive needs to be varied between the narrower part and wider part, requiring a complicated adhesive application operation.
However, with the FPC 43 of the image pickup apparatus 20 according to the present embodiment, since the tapered portion 130 is formed near the terminals 90 in the first region 51, even if a thick coat of adhesive is applied to accommodate the wider part, the tapered portion 130 whose shape changes gradually prevents the adhesive from running out of the narrower part. That is, even if the first region 51 of the FPC 43 contains the narrower part and wider part, the adhesive can be applied easily to a uniform thickness.
In the first region 51 of the FPC 43, the tapered portion 130, which narrows down toward the part where the terminals 90 are installed, allows the terminals 90 to be mounted on the bonding portion 41 of the solid-state image pickup device chip 32 by saving space as shown in
Also, a second region 52 is provided above the first region 51 of the FPC 43 in
Furthermore, in the second region 52 on the front surface 43i of the FPC 43, electronic components smaller than the predetermined size, e.g., electronic components 71b smaller than the known standard, 1005, and compliant with a known standard, 0603 or 0402 are disposed in a region 171 sandwiched by the electronic components 71a when seen in planar view.
That is, the electronic components 71a equal to or larger than the predetermined size are disposed in such a way as to sandwich the electronic components 71b smaller than the predetermined size in a direction orthogonal to the folding direction P, when seen in planar view.
Also, a third region 53 is provided above the second region 52 of the FPC 43 in
Also, a fifth region 55 is provided on the right side of the first region 51 of the FPC 43 in
Furthermore, a sixth region 56 is provided on the right side of the fifth region 55 of the FPC 43 in
A tapered portion 120 may be formed at the right end of the sixth region 56 in
The FPC 43 configured as described above is disposed obliquely at a predetermined angle with respect to the back face 32h in a region superimposed over the package unit 150 when seen in planar view from the image pickup surface 32m. Also, as shown in
If the FPC 43 is folded in a region superimposed over the package unit 150 when seen in planar view in such a way that the front surface 43i of the FPC 43 will provide mounting surfaces for the electronic components 70 to 72 in one or two layers, a region 111 surrounded by a dash-and-dot line in
Furthermore, as shown in
Now, a method for folding the FPC 43 configured as shown in
Specifically, the terminals 90 in the first region 51 are electrically connected to the bonding portion 41 of the solid-state image pickup device chip 32 by soldering or the like. Then, as shown in
Next, the second region 52 is folded below the first region 51. Specifically, the second region 52 is folded in the folding direction P over the first region 51 by bending the deformation portion 151 so that a rear surface 43t on the other side of the FPC 43 in the second region 52 will face the rear surface 43t of the FPC 43 in the first region 51. Consequently, the electronic components 71 mounted on the front surface 43i of the FPC 43 in the second region 52 are oriented obliquely downward in
Thus, the electronic components 71 are disposed out of direct contact with the electronic components 70. In other words, the electronic components 71 are superimposed over the electronic components 70 via the first region 51 and second region 52.
Next, by deforming the deformation portion 152, the third region 53 is bent in the folding direction P so as to be approximately perpendicular to the front surface 43i of the FPC 43 in the first region 51.
Next, the fourth region 54 is folded over the first region 51. Specifically, the fourth region 54 is folded in the folding direction P by bending the deformation portion 153 so that the rear surface 43t of the FPC 43 in the fourth region 54 will face the front surface 43i of the FPC 43 in the first region 51.
Consequently, the electronic components 72 mounted on the front surface 43i of the FPC 43 in the fourth region 54 are oriented obliquely upward in
Next, the fifth region 55 is folded below the second region 52. Specifically, the fifth region 55 is folded in a folding direction Q which is a second folding direction by bending the deformation portion 154 so that the rear surface 43t of the FPC 43 in the fifth region 55 will face the front surface 43i of the FPC 43 in the second region 52.
Consequently, the lead wire connecting portion 73 on the front surface 43i of the FPC 43 in the fifth region 55 is oriented obliquely downward in
Next, the sixth region 56 is bent upward in
Incidentally, the fifth region 55 and sixth region 56, which are placed in the bottom layer of the folded FPC 43, are located in regions different from the regions in which the electronic components 70 to 72 are mounted.
When the tapered portion 120 is formed in the sixth region 56, even if the sixth region 56 is not bent as indicated by a dotted line in
Subsequently, to fix the shape of the folded FPC 43 and reinforce the electronic components 70 to 73, an adhesive is applied to a predetermined thickness on the FPC 43. The tapered portion 130 prevents the adhesive from running out of the narrowed part near the terminals 90 in the first region 51, as described above.
Finally, the lead wire connecting portions 73 and 74 provided on the front surface 43i of the FPC 43 in the fifth region 55 and sixth region 56 are electrically connected with multiple lead wires 44 of the signal cable 34, for example, by soldering.
The lead wire connecting portions 73 and 74, which are located in regions different from the regions in which the electronic components 70 to 72 are mounted, specifically, in the bottom layer of the folded FPC 43, and oriented obliquely downward in
If the FPC 43 is folded in a region superimposed over the package unit 150 when seen in planar view in such a way that the front surface 43i of the FPC 43 will provide mounting surfaces for the electronic components 70 to 72 in one or two layers, a region 112 surrounded by a dash-and-dot line in
Consequently, the FPC 43 is disposed behind the solid-state image pickup chip 43 in the shape described above.
In this way, according to the present embodiment, behind the solid-state image pickup device chip 32, the FPC 43 is disposed obliquely at a predetermined angle with respect to the back face 32h, in a region superimposed over the package unit 150 when seen in planar view from the image pickup surface 32m.
Also, as described above, the FPC 43 is disposed, being folded in such a way that the front surface 43i of the FPC 43 will provide mounting surfaces for the electronic components 70 to 72 in three layers and that the electronic components 70 to 72 will be superimposed via the regions 51 to 55 of the FPC 43.
This makes it possible to dispose the FPC 43 reliably behind the solid-state image pickup device chip 32 without jutting out from the package unit 150 when seen in planar view from the image pickup surface 32m. Also, the electronic components 70 to 72 as well as the lead wire connecting portions 73 and 74, which are superimposed over each other via the regions 51 to 55 of the FPC 43, are kept out of contact from each other.
Also, according to the present embodiment, as described above, in the first region 51 on the front surface 43i of the FPC 43, electronic components 71c smaller than a predetermined size are disposed in a region 170 surrounded by the electronic components 70a and 70b equal to or larger than the predetermined size, when seen in planar view.
Consequently, when the second region 52 to the fourth region 54 are folded in the folding direction P over the first region 51, even if the first region 51 warps due to an external force acting on the first region 51 and pulling the first region 51 in the folding direction P, strength, i.e., rigidity, of the first region 51 in the folding direction P is increased by the electronic components 70a which are equal to or larger than the predetermined size and mounted in the first region 51 in such a way as to sandwich the electronic components 70c smaller than the predetermined size in the direction orthogonal to the folding direction P. This reduces the tendency of the electronic components 70c smaller than the predetermined size to separate from the FPC 43 due to warping of the first region 51 and thus improves ease of assembly of the image pickup apparatus 20.
Also, when the fifth region 55 and sixth region 56 are folded over the first region 51 in the folding direction Q, even if the first region 51 warps due to an external force acting on the first region 51 and pulling the first region 51 in the folding direction Q, strength, i.e., rigidity, of the first region 51 in the folding direction Q is increased by the electronic components 70b which are equal to or larger than the predetermined size and mounted in the first region 51 in such a way as to sandwich the electronic components 70c smaller than the predetermined size in a direction orthogonal to the folding direction Q. This reduces the tendency of the electronic components 70c smaller than the predetermined size to separate from the FPC 43 due to warping of the first region 51 and thus improves ease of assembly of the image pickup apparatus 20.
Furthermore, according to the present embodiment, as described above, in the second region 52 on the front surface 43i of the FPC 43, the electronic components 71a equal to or larger than the predetermined size are disposed in such a way as to sandwich the electronic components 71b smaller than the predetermined size in the direction orthogonal to the folding direction P, when seen in planar view.
Consequently, when the third region 53 and fourth region 54 are folded in the folding direction P over the second region 52, even if the second region 52 warps due to an external force acting on the second region 52 and pulling the second region 52 in the folding direction P, strength, i.e., rigidity, of the second region 52 in the folding direction P is increased by the electronic components 71a which are equal to or larger than the predetermined size and mounted in the second region 52 in such a way as to sandwich the electronic components 71b smaller than the predetermined size in the direction orthogonal to the folding direction P. This reduces the tendency of the electronic components 71b smaller than the predetermined size to separate from the FPC 43 due to warping of the second region 52 and thus improves ease of assembly of the image pickup apparatus 20.
Thus, the present embodiment provides the image pickup apparatus 20 having a configuration which makes it possible to downsize the package unit 150 while preventing the electronic components 70 to 72 as well as lead wire connecting portions 73 and 74 mounted on the FPC 54 from contacting each other and improve ease of assembly by preventing the electronic components 70 to 72 from coming off the FPC 43.
Now, a variation will be shown below. According to the present embodiment, as described above, in the second region 52 on the front surface 43i of the FPC 43, the electronic components 71a equal to or larger than the predetermined size are disposed in such a way as to sandwich the electronic components 71b smaller than the predetermined size in the direction orthogonal to the folding direction P, when seen in planar view.
This is not restrictive. As long as a large area can be secured for the second region 52, the electronic components 71a equal to or larger than the predetermined size may be disposed in such a way as to surround the electronic components 71b smaller than the predetermined size, when seen in planar view as in the case of the electronic components 70. This configuration also reduces the tendency of the electronic components 71b smaller than the predetermined size to separate from the FPC 43 due to warping of the second region 52.
Another variation will be described below with reference to
According to the present embodiment, as described above, in the first region 51 on the front surface 43i of the FPC 43, the electronic components 70c smaller than the predetermined size are disposed in the region 170 surrounded by the electronic components 70a and 70b equal to or larger than the predetermined size, when seen in planar view.
This is not restrictive. As shown in
With this configuration, even if the first region 51 warps due to external forces acting on the first region 51 in the folding directions P and Q, strength, i.e., rigidity, of the first region 51 in the folding directions P and Q is increased by the electronic components 70d and 70e equal to or larger than the predetermined size, reducing the tendency of the electronic components 70f smaller than the predetermined size to separate from the FPC 43.
A configuration of the image pickup apparatus according to the second embodiment differs from the image pickup apparatus according to the first embodiment shown in
As shown in
Furthermore, an eighth region 58 is provided on the right side of the seventh region 57 of the FPC 43 in
The FPC 43 configured as described above is disposed obliquely at a predetermined angle with respect to the back face 32h in a region superimposed over the package unit 150 when seen in planar view from the image pickup surface 32m. Also, as shown in
Furthermore, the lead wire connecting portions 73 and 74 are disposed in regions different from the regions in which the electronic components 70 to 72 are mounted, specifically, in the bottom layer of the folded FPC 43 as shown in
Now, a method for folding the FPC 43 configured as shown in
Specifically, the first region 51 to the fourth region 54 are folded in the folding direction P as in the case of the first embodiment described above.
Next, the seventh region 57 is folded below the second region 52 by bending the deformation portion 156. Specifically, the seventh region 57 is folded in the folding direction Q so that the front surface 43i of the FPC 43 in the seventh region 57 will face the front surface 43i of the FPC 43 in the second region 52.
According to the present embodiment, since no region is superimposed between the second region 52 and seventh region 57 as shown in
Consequently, the lead wire connecting portion 73 provided on the rear surface 43t of the FPC 43 in the seventh region 57 is oriented obliquely downward in
Next, the eighth region 58 is bent upward in
Incidentally, the seventh region 57 and eighth region 58, which are placed in the bottom layer of the folded FPC 43, are located in regions different from the regions in which the electronic components 70 to 72 are mounted.
Subsequent processes are the same as those of the first embodiment, and thus description thereof will be omitted.
Consequently, the FPC 43 is disposed behind the solid-state image pickup chip 43 in the shape described above.
In this way, according to the present embodiment, the lead wire connecting portions 73 and 74 are provided on the rear surface 43t of the FPC 43 in the seventh region 57 and eighth region 58 located on the right side of the second region 52 in
Thus, the present embodiment provides the same advantages as those of the first embodiment. Besides, since the seventh region 57 with the lead wire connecting portion 73 mounted is installed immediately below the second region 52, bendable width of the deformation portion 156 can be made smaller than in the first embodiment. That is, the FPC 43 can be disposed behind the solid-state image pickup device chip 32 more compactly than in the first embodiment described above.
A configuration of the image pickup apparatus according to the third embodiment differs from the image pickup apparatus according to the first embodiment shown in
As shown in
Electronic components equal to or larger than the predetermined size, e.g., electronic components 76 equal to or larger than the known standard, 1005, are disposed on the front surface 43i of the FPC 43 in the tenth region 60.
Also, a mounting strength enhancement portion 61 is located via a deformation portion 161 on each end of the second region 52 in the direction orthogonal to the folding direction P to enhance mounting strength in the folding direction P in the second region 52. Bending the mounting strength enhancement portions 61 toward the second region 52 increases the mounting strength of the electronic components 71b smaller than the predetermined size in the folding direction P in the second region 52.
Furthermore, on the front surface 43i of the FPC 43 in the second region 52, the electronic components 71b smaller than the predetermined size are disposed near a mounting strength enhancement portion 61.
According to the present embodiment, as in the case of the first embodiment described above, a tapered portion 120 may be provided in the sixth region 56.
The FPC 43 configured as described above is disposed obliquely at a predetermined angle with respect to the back face 32h in a region superimposed over the package unit 150 when seen in planar view from the image pickup surface 32m.
Also, as shown in
Furthermore, as shown in
Now, a method for folding the FPC 43 configured as shown in
Specifically, first, the first region 51 to the fourth region 54 are folded in the folding direction P as in the case of the first embodiment described above. Also, by deforming the deformation portion 161, the mounting strength enhancement portions 61 in the second region 52 are bent downward in
Next, by deforming the deformation portion 159, the ninth region 59 is bent in the folding direction P so as to be perpendicular to the rear surface 43t of the FPC 43 in the fourth region 54. Then, the tenth region 60 is folded below the second region 52. Specifically, by bending the deformation portion 160, the tenth region 60 is folded in the folding direction P so that the rear surface 43t of the FPC 43 will face the front surface 43i of the FPC 43 in the second region 52.
Consequently, electronic components 76 mounted on the front surface 43i of the FPC 43 in the tenth region 60 are oriented obliquely downward in
Thus, the electronic components 76 are disposed out of direct contact with the electronic components 71. In other words, the electronic components 76 are superimposed over the electronic components 71 via the ninth region 59 and tenth region 60.
Finally, by bending the deformation portion 158, the fifth region 55 is bent in the folding direction Q so that the rear surface 43t of the FPC 43 in the fifth region 55 will be substantially parallel to the back face 32h of the solid-state image pickup device chip 32. Then, the sixth region 56 is folded below the tenth region 60. Specifically, by bending the deformation portion 155, the sixth region 56 is folded in the folding direction Q so that the rear surface 43t of the FPC 43 in the sixth region 56 will face the front surface 43i of the FPC 43 in the tenth region 60.
Subsequent processes are the same as those of the first embodiment, and thus description thereof will be omitted.
Consequently, the FPC 43 is disposed behind the solid-state image pickup chip 43 in the shape and positions described above.
In this way, according to the present embodiment, the FPC 43 is folded in such a way that the front surface 43i of the FPC 43 will provide mounting surfaces for the electronic components 70 to 72 and 76 in four layers, and this configuration provides advantages similar to the advantages of the image pickup apparatus 20 according to the first embodiment in which the FPC 43 is folded in such a way that the front surface 43i of the FPC 43 will provide mounting surfaces for the electronic components 70 to 72 in three layers.
Also, according to the present embodiment, as described above, the mounting strength enhancement portion 61 is located via the deformation portion 161 on each end of the second region 52 in the direction orthogonal to the folding direction P to enhance mounting strength in the folding direction P in the second region 52. Furthermore, as described above, on the front surface 43i of the FPC 43 in the second region 52, the electronic components 71b smaller than the predetermined size are disposed near a mounting strength enhancement portion 61.
Consequently, on the front surface 43i of the FPC 43 in the second region 52, even if the electronic components 71b smaller than the predetermined size are not disposed in such a way as to be sandwiched, when seen in planar view, by the electronic components 71a equal to or larger than the predetermined size in the direction orthogonal to the folding direction when seen in planar view as in the case of the first embodiment described above, by simply disposing the electronic components 71b smaller than the predetermined size near the mounting strength enhancement portions 61, it is possible to reliably prevent the electronic components 71b smaller than the predetermined size from coming off the front surface 43i of the FPC 43 due to warping of the second region 52 caused by an external force acting in the folding direction P on the second region 52.
A configuration of the image pickup apparatus according to the fourth embodiment differs from the image pickup apparatus described above according to the third embodiment shown in
As shown in
A twelfth region 63 is provided on the right side of the fourth region 54 of the FPC 43 in
Also, a thirteenth region 64 is provided on the right side of the twelfth region 63 of the FPC 43 via a deformation portion 164 and the lead wire connecting portion 74 is installed on the front surface 43i of the FPC 43 in the thirteenth region 64.
A tapered portion 120 may be provided in the thirteenth region 64 as in the case of the first embodiment.
The FPC 43 configured as described above is disposed obliquely at a predetermined angle with respect to the back face 32h in a region superimposed over the package unit 150 when seen in planar view from the image pickup surface 32m.
Also, as shown in
Furthermore, as shown in
Now, a method for folding the FPC 43 configured as shown in
Specifically, the first region 51 to the fourth region 54 are folded in the folding direction P as in the case of the first embodiment described above.
Next, the eleventh region 62 is folded below the second region 52. Specifically, by bending the deformation portion 162, the eleventh region 62 is folded in the folding direction Q so that the rear surface 43t of the FPC 43 in the eleventh region 62 will face the front surface 43i of the FPC 43 in the second region 52.
Consequently, the electronic components 77 mounted on the front surface 43i of the FPC 43 in the eleventh region 62 are oriented obliquely downward in
Thus, the electronic components 77 are disposed out of direct contact with the electronic components 71. In other words, the electronic components 77 are superimposed over the electronic components 71 via the eleventh region 62.
Finally, by bending the deformation portion 163, the twelfth region 63 is folded in the folding direction Q so that the rear surface 43t of the FPC 43 will be substantially parallel to the back face 32h of the solid-state image pickup device chip 32. Then, the thirteenth region 64 is folded below the eleventh region 62. Specifically, by bending the deformation portion 164, the thirteenth region 64 is folded in the folding direction Q so that the rear surface 43t of the FPC 43 in the thirteenth region 64 will face the front surface 43i of the FPC 43 in the eleventh region 62.
Subsequent processes are the same as those of the first embodiment, and thus description thereof will be omitted.
Consequently, the FPC 43 is disposed behind the solid-state image pickup chip 43 in the shape and positions described above.
In this way, according to the present embodiment, the FPC 43 is folded in such a way that the front surface 43i of the FPC 43 will provide mounting surfaces for the electronic components 70 to 72 and 77 in four layers, and the folding direction Q of the eleventh region 62 in which the electronic components 77 are mounted is different from the folding direction P of the second region 52 and fourth region 54 in which the other electronic components 71 and 72 are mounted.
This configuration also provides advantages similar to the advantages of the third embodiment. Besides, compared to the third embodiment described above, since the number of times of folding in the folding direction P is reduced by one, width of the FPC 43 as seen in planar view from the image pickup surface 32m can be made smaller than in the third embodiment.
A configuration of the image pickup apparatus according to the fifth embodiment differs from the image pickup apparatus according to the first embodiment shown in
As shown in
Also, a fifteenth region 66 is located on the right side of the fourteenth region 65 of the FPC 43 in
Also, an eighteenth region 69 is located below the fifteenth region 66 in
Incidentally, the eighteenth region 69, nineteenth region 81, and twentieth region 82 are similar in configuration to the second region 52, third region 53, and fourth region 54.
The FPC 43 configured as described above is disposed obliquely at a predetermined angle with respect to the back face 32h in a region superimposed over the package unit 150 when seen in planar view from the image pickup surface 32m.
Also, as shown in
Furthermore, as shown in
Now, a method for folding the FPC 43 configured as shown in
Specifically, the terminals 90 in the fourteenth region 65 are electrically connected to the bonding portion 41 of the solid-state image pickup device chip 32 by soldering or the like. Then, as shown in
Next, the fifteenth region 66 is bent obliquely downward in
Next, the eighteenth region 69 is folded over the fifteenth region 66. Specifically, by bending the deformation portion 167, the eighteenth region 69 is folded in a folding direction R which is a first folding direction so that the rear surface 43t of the FPC 43 in the eighteenth region 69 will face the rear surface 43t of the FPC 43 in the fifteenth region 66. Consequently, the electronic components 71 mounted on the front surface 43i of the FPC 43 in the eighteenth region 69 are oriented obliquely upward in
Thus, the electronic components 71 are disposed out of direct contact with the electronic components 70. In other words, the electronic components 71 are superimposed over the electronic components 70 via the fifteenth region 66 and eighteenth region 69.
Next, by bending the deformation portion 168, the nineteenth region 81 is bent in the folding direction R so as to be substantially perpendicular to the front surface 43i of the FPC 43 in the fifteenth region 66.
Then, the twentieth region 82 is folded below the fifteenth region 66. Specifically, the twentieth region 82 is folded in the folding direction R via the deformation portion 169 so that the rear surface 43t of the FPC 43 in the twentieth region 82 will face the front surface 43i of the FPC 43 in the fifteenth region 66.
Consequently, the electronic components 72 mounted on the front surface 43i of the FPC 43 in the twentieth region 82 are oriented obliquely downward in
Next, by bending the deformation portion 165, the sixteenth region 67 is folded over the eighteenth region 69. Specifically, the sixteenth region 67 is folded in the folding direction Q so that the rear surface 43t of the FPC 43 in the sixteenth region 67 will face the front surface 43i of the FPC 43 in the eighteenth region 69.
Consequently, the lead wire connecting portion 73 in the sixteenth region 67 on the front surface 43i of the FPC 43 is oriented obliquely upward in
Next, by bending the deformation portion 166, the seventeenth region 68 is folded downward in the folding direction Q in
Incidentally, the sixteenth region 67 and seventeenth region 68, which are located in the top layer of the folded FPC 43, are located in regions different from the regions in which the electronic components 70 to 72 are mounted.
Subsequently, to fix the shape of the folded FPC 43 and reinforce the electronic components 70 to 73, an adhesive is applied to a predetermined thickness on the FPC 43.
Finally, the lead wire connecting portions 73 and 74 provided on the front surface 43i of the FPC 43 in the sixteenth region 67 and seventeenth region 68 are electrically connected with multiple lead wires 44 of the signal cable 34, for example, by soldering.
The lead wire connecting portions 73 and 74, which are located in regions different from the regions in which the electronic components 70 to 72 are mounted, specifically, in the top layer of the folded FPC 43, are easily connected with the multiple lead wires 44 of the signal cable 34. This makes it possible to downsize the mounting space of the FPC 43.
Consequently, the FPC 43 is disposed behind the solid-state image pickup chip 43 in the shape and positions as described above.
In this way, according to the present embodiment, after the eighteenth region 69, nineteenth region 81, and twentieth region 82 are folded in the folding direction R, the sixteenth region 67 and seventeenth region 68 are folded over the top layer of the FPC 43.
Thus, the lead wire connecting portions 73 and 74 can be disposed not only in the bottom layer as in the case of the first embodiment described above, but also in the top layer of the FPC 43. Consequently, the lead wires 44 of the signal cable 34 can be connected to the lead wire connecting portions 73 and 74 in the top layer if connecting conditions of the lead wires 44 so require. Other advantages are similar to those of the first embodiment.
Also, according to the first to fifth embodiments described above, the FPC 43 is folded in such a way that the front surface 43i of the FPC 43 will provide mounting surfaces for the electronic components 70 to 72 and 77 in three or four layers, but this is not restrictive and the FPC 43 may be folded into two layers or more than five layers as long as the FPC 43 can be superimposed over the package unit 150 when seen in planar view from the image pickup surface 32m.
Furthermore, according to the first to fifth embodiments described above, it has been assumed that the image pickup apparatus is installed in the distal end portion of the insertion portion of a medical endoscope, but this is not restrictive and the embodiments will provide similar advantages when the image pickup apparatus is installed in the distal end portion of the insertion portion of an industrial endoscope.
Having described the preferred embodiments of the invention referring to the accompanying drawings, it should be understood that the present invention is not limited to those precise embodiments and various changes and modifications thereof could be made by one skilled in the art without departing from the spirit or scope of the invention as defined in the appended claims.
Number | Date | Country | Kind |
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2007-007430 | Jan 2007 | JP | national |
This application is a continuation application of PCT/JP2007/069299 filed on Oct. 2, 2007 and claims benefit of Japanese Application No. 2007-007430 filed in Japan on Jan. 16, 2007, the entire contents of which are incorporated herein by this reference.
Number | Date | Country | |
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Parent | PCT/JP2007/069299 | Oct 2007 | US |
Child | 12499441 | US |