The present invention relates to an image pickup apparatus having a heat radiation structure.
In recent image pickup apparatuses, cooling of the inside of the apparatus is important because heat generation in a signal processing part such as an image pickup part increases with improvement in image quality. Japanese Laid-Open Patent Publication (kokai) No. 2019-9553 discloses an image pickup apparatus having a heat radiation structure that forcibly air-cools the inside of the image pickup apparatus.
In the image pickup apparatus disclosed in Japanese Laid-Open Patent Publication (kokai) No. 2019-9553, a forced air cooling flow path is built in a grip portion gripped by a shooter, and outside air sucked from an intake port on a front side of the apparatus passes through the forced air cooling flow path to exchange heat, and then is discharged from an exhaust port on a rear side of the apparatus.
In this way, a main heat source inside the apparatus is cooled.
In the future, as a writing bit rate increases due to high image quality, there is a concern about further heat generation of a recording medium, and thus the recording medium also needs to be efficiently cooled. However, Japanese Laid-Open Patent Publication (kokai) No. 2019-9553 does not mention cooling of the recording medium included in the grip portion.
Further, a cooling structure of Japanese Laid-Open Patent Publication (kokai) No. 2019-9553 is suitable in a case where a main circuit board for controlling the entire image pickup apparatus is disposed in parallel with an optical axis. However, in a case where the main circuit board is disposed orthogonal to the optical axis as in many grip integrated lens interchangeable image pickup apparatuses, it is not easy to apply the cooling structure mentioned above.
The present invention provides an image pickup apparatus capable of efficiently cooling a mounted recording medium.
Accordingly, the present invention provides an image pickup apparatus comprising a grip portion including a protrusion portion protruding toward a subject side in an optical axis direction of the image pickup apparatus, the grip portion being provided at an end portion of a main body, a medium circuit board on which a medium accommodation portion for accommodating a recording medium is mounted, the medium circuit board being disposed on a side opposite to the subject side in the optical axis direction with respect to the protrusion portion, a main circuit board disposed substantially orthogonal to the optical axis, a cooling duct including a first extension portion extending parallel to the optical axis direction in the grip portion, the cooling duct being thermally connected to the medium circuit board and the main circuit board, and an air cooling fan configured to introduce air into the cooling duct.
According to the present invention, a recording medium mounted on an image pickup apparatus can be efficiently cooled.
Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the attached drawings.
The present invention will now be described in detail below with reference to the accompanying drawings showing embodiments thereof.
Each direction used for description is defined using X, Y, and Z-coordinate axes shown in the drawings. Here, for convenience, the subject side in a direction parallel to the optical axis C0 is defined as “front”. The optical axis C0 and a Z direction are parallel. For example, in
As shown in
On the front side of the main body 100, an intake port 1341 that sucks (introduces) cold outside air into the main body 100 by a heat radiation structure H (
As shown in
An outline of an internal structure of the image pickup apparatus 1 will be described with reference to
As shown in
The image pickup device circuit board 161 is fixed to a circuit board holding member 162 made of a metal. By adjusting an assembling position of the circuit board holding member 162, a lens attachment portion to which the lens 101 is attached and the image pickup device 160 can be adjusted to a desired distance.
In the main body 100, the main circuit board 170 is disposed orthogonal to the optical axis C0 on the rear side of the image pickup device circuit board 161. The medium slot 143 is disposed behind the protrusion portion 111. That is, the medium circuit board 140 is arranged on the side (−Z side) opposite to the subject side in the direction of the optical axis C0 with respect to the protrusion portion 111. This arrangement is made in consideration of convenience in layout of the components inside the main body 100 and operability of insertion/removal of the recording medium 141.
A heat radiation structure H in the main body 100 will be described with reference to
During the shooting operation of the image pickup apparatus 1, an electric device mounted on the image pickup device circuit board 161 and an electric device mounted on the main circuit board 170 consume power and generate heat. In addition, the recording medium 141 also generates heat along with the recording operation of the shot data. In particular, in a case where a moving image having a high resolution and a high bit rate is shot, the power consumption in each electric device increases and the power consumption in the recording medium 141 also increases, so that each part tends to have a high temperature. Therefore, in order to prevent performance degradation of the electric device and/or the recording medium 141, a temperature rise of the exterior surface, and the like, the heat radiation structure H is provided inside the main body 100.
The heat radiation structure H includes a cooling duct 120. The cooling duct 120 is thermally connected to the medium circuit board 140 and the main circuit board 170. The cooling duct 120 includes a first extension portion D1 and a second extension portion D2. The first extension portion D1 is a portion extending parallel to the direction of the optical axis C0 in the grip portion 110 (in the grip portion). The second extension portion D2 is a portion extending along the main circuit board 170, and is substantially orthogonal to the direction of the optical axis C0. When viewed from the +Y side, the cooling duct 120 has a substantially L shape as a whole. With this shape, a long air flow path is formed to increase a surface area, and a heat radiation amount of the cooling duct 120 is improved. Furthermore, a heat transfer path from a heat generator (heat generation component or heat generation portion) inside the main body 100 to the cooling duct 120 can be simplified.
In particular, the layout is designed such that the main circuit board 170 is orthogonal to the optical axis C0, and the medium circuit board 140 is arranged at a rear portion of the grip portion 110 or behind the grip portion 110. Such a layout is advantageous in that it is easy to arrange the cooling duct 120 to be close to the main circuit board 170 and the medium circuit board 140 that require heat radiation. In the first extension portion D1, air flows mainly parallel to the direction of the optical axis C0. In the second extension portion D2, air flows mainly in a direction (+X direction) along the main circuit board 170.
The heat generation portion 171 shown in
The heat conduction member 142 is disposed so as to be sandwiched between the medium circuit board 140 and the cooling duct 120 in the optical axis direction. The heat conduction member 142 is in contact with the cooling duct 120 on the front surface and is in contact with the medium circuit board 140 on the rear surface, thereby efficiently transferring the heat of the recording medium 141 to the cooling duct 120.
As shown in
The cooling duct 120 is formed of a metal having high thermal conductivity such as aluminum. An exhaust duct 133 is connected to the cooling fan 131 that is an air cooling fan. The cooling fan 131 introduces air into the cooling duct 120. The outside air taken in from the intake port 1341 (
An elastic member 123 is sandwiched between the cooling duct 120 and the cooling fan 131. As a result, it is possible to avoid foreign matters such as dust from entering the main body 100 due to leakage of air flowing through the cooling duct 120.
Next, a heat transfer path from the recording medium 141 to the cooling duct 120 will be described with reference to
The heat of the recording medium 141 is radiated by being transferred to the cooling duct 120 via the medium circuit board 140 (
As shown in
The medium lid 150 is rotatably supported about a rotation shaft 151 with respect to the main body 100. As shown in
As shown in
According to the present embodiment, the cooling duct 120 includes the first extension portion D1 extending parallel to the optical axis direction, and is thermally connected to the medium circuit board 140 and the main circuit board 170. By arranging the first extension portion D1 in the grip portion 110, the first extension portion D1 can be arranged in the vicinity of the medium circuit board 140, so that heat radiation efficiency of the recording medium 141 is enhanced. In addition, since the cooling duct 120 has a substantially L shape, heat radiation performance is high, and heat is smoothly transferred from the heat generation component. Therefore, the recording medium 141 can be efficiently cooled.
In particular, even in a configuration in which the main circuit board 170 is disposed substantially orthogonal to the optical axis C0 and the medium circuit board 140 is disposed behind the protrusion portion 111, a structure for cooling the recording medium 141 can be easily realized. Moreover, since the recording medium 141 can also be cooled using the cooling duct 120 that cools the main circuit board 170, the configuration is less complicated.
Since at least a part of the intake port 1341 is disposed in the protrusion portion 111, cold air can be efficiently supplied to the first extension portion D1. From this viewpoint, the entire intake port 1341 may be disposed in the protrusion portion 111. Furthermore, since the exhaust port 135 is disposed at the end portion of the main body 100 on the side opposite to the grip portion 110 in the left-right direction, a long path from the intake port 1341 to the exhaust port 135 can be secured, which contributes to improvement of cooling efficiency.
Further, in the closed state of the medium lid 150, the contact portion 152 which is a part of the medium lid 150 comes into contact with the recording medium 141, so that the heat of the recording medium 141 can be released through the medium lid 150.
In the closed state of the medium lid 150, the contact portion 153 which is another part of the medium lid 150 comes into contact with the duct side surface 121 of the cooling duct 120, so that the heat of the air in the cooling duct 120 can be released through the medium lid 150.
As shown in
As shown in
As shown in
The medium lid 150 covers and protects the recording medium 141 by rotating about the rotation shaft 151 from the opened state shown in
That is, in a process of changing the state of the medium lid 150 from the closed state to the locked state by sliding the cover member 154 in the +Z direction, the locking portion 158 is pushed toward the +Z side by the claw portion 154a via the elastic member 157, whereby the entire heat conduction member 155 also moves toward the +Z side. Thereafter, when the contact portion 152 comes into contact with the recording medium 141, the movement of the heat conduction member 155 substantially stops. As the cover member 154 further slides toward the +Z side, the elastic member 157 is compressed, and thereafter, the medium lid 150 is in the locked state (
In the locked state of the medium lid 150, the locking portion 158 is biased toward the +Z side by the biasing force of the elastic member 157 in the compressed state. As a result, the entire heat conduction member 155 is biased toward the +Z side, so that the contact portion 152 is in pressure contact with the −Z side surface of the recording medium 141. Therefore, the heat is reliably transferred from the recording medium 141 to the heat conduction member 155.
In the locked state of the medium lid 150, the contact portion 153 closes the duct hole 122, and the fin shape 156 is inserted into the air flow path of the cooling duct 120 through the duct hole 122. As a result, the heat of the air in the cooling duct 120 can be released through the medium lid 150. It should be noted that a cushion 124 (
According to the second embodiment, regarding efficient cooling of the recording medium 141, effects similar to those of the first embodiment can be obtained. Further, since a heat transfer path from the recording medium 141 to the cooling duct 120 via the medium lid 150 is formed, the cooling efficiency of the recording medium 141 can be further enhanced.
An image pickup apparatus according to a third embodiment of the present invention will be described.
As shown in
Therefore, in the third embodiment, by disposing a part of the cooling fan 131 inside the protrusion portion 111, it is possible to mount the cooling fan 131 inside the main body while suppressing the dimension increase of the image pickup apparatus in the Z direction.
The outside air taken in from an intake port 1341 by the cooling fan 131 passes through an intake duct 132, and then flows and passes through the cooling fan 131 and the cooling duct 120 in this order. The flowing air exchanges heat with the cooling duct 120 having a high temperature by heat transfer from a heat generator, rises in temperature, and is then discharged to the outside from an exhaust port 135.
According to the third embodiment, regarding efficient cooling of a recording medium 141, effects similar to those of the first embodiment can be obtained. In addition, since a part of the cooling fan 131 enters the inside of the protrusion portion 111, it is possible to suppress an increase in the dimension of the image pickup apparatus in the Z direction. It should be noted that, in the present embodiment, the same configuration as any of the first and second embodiments may be adopted for a configuration other than the arrangement of the cooling fan 131.
In each of the above embodiments, with respect to a positional relation between the main circuit board 170 and the cooling duct 120 in the Z direction, the cooling duct 120 is disposed on the −Z side with respect to the main circuit board 170. However, instead of this, the cooling duct 120 may be disposed on the +Z side with respect to the main circuit board 170. Regarding the arrangement of the intake ports 1341 and 1342, in each of the above embodiments, the intake ports are arranged at the base on the +X side of the protrusion portion 111 of the grip portion 110. However, the intake ports 1341 and 1342 may be provided at the tip or on the −X side of the protrusion portion 111, and may be disposed closer to one of the top surface side and the bottom surface side in the Y direction.
It should be noted that, in each embodiment, what is denoted by “substantially” is not intended to exclude completeness. For example, “substantially orthogonal” and “substantially L-shaped” include completely orthogonal and substantially L-shaped, respectively.
Embodiment(s) of the present invention can also be realized by a computer of a system or apparatus that reads out and executes computer executable instructions (e.g., one or more programs) recorded on a storage medium (which may also be referred to more fully as a ‘non-transitory computer-readable storage medium’) to perform the functions of one or more of the above-described embodiment(s) and/or that includes one or more circuits (e.g., application specific integrated circuit (ASIC)) for performing the functions of one or more of the above-described embodiment(s), and by a method performed by the computer of the system or apparatus by, for example, reading out and executing the computer executable instructions from the storage medium to perform the functions of one or more of the above-described embodiment(s) and/or controlling the one or more circuits to perform the functions of one or more of the above-described embodiment(s). The computer may comprise one or more processors (e.g., central processing unit (CPU), micro processing unit (MPU)) and may include a network of separate computers or separate processors to read out and execute the computer executable instructions. The computer executable instructions may be provided to the computer, for example, from a network or the storage medium. The storage medium may include, for example, one or more of a hard disk, a random-access memory (RAM), a read only memory (ROM), a storage of distributed computing systems, an optical disk (such as a compact disc (CD), digital versatile disc (DVD), or Blu-ray Disc (BD)™), a flash memory device, a memory card, and the like.
While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.
This application claims the benefit of Japanese Patent Application No. 2023-143083, filed Sep. 4, 2023, which is hereby incorporated by reference wherein in its entirety.
Number | Date | Country | Kind |
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2023-143083 | Sep 2023 | JP | national |