Patent Application
20050098865
1. Field of the Invention
The invention relates to an image sensor package, and more particularly to an image sensor with increased product reliability and facilitated manufacturing processes.
2. Description of the Related Art
Referring to
The above-mentioned the patent has some advantages, but it has following drawbacks.
1. Since the wires 20 are electrically connected the chip 18 to the upper surface 38 of the upper metal sheets 12 for transmitting signals from the chip 18 to the lower metal sheets 12. Thus, the upper metals 12 and the lower metal sheets 10 much be tight stacked.
An object of the invention is to provide an image sensor package with improved package reliability.
Still another object of the invention is to provide an image sensor package, wherein the wire bonding process may be easily performed and the product yield may be increased.
To achieve the above-mentioned objects, the invention includes plural lower metal sheets, plural upper metal sheets stacked on the lower metal sheets, and an encapsulant for encapsulating the lower and upper metal sheets. The lower metal formed with a first hole, the upper metal sheets formed a second hole penetrated from the upper surface to the lower surface. Wherein the encapsulant filled into the second hole and first hole to tighten the upper metal sheets and the lower metal sheets. A photosensitive chip arranged within the chamber, plural wires for electrically connecting the chip to the upper surfaces of the lower metal sheets, and a transparent layer arranged on the frame layer to cover the chip.
Referring to
Please referring to
Each of the upper metal sheet 48 has an upper surface 68 and a lower surface 70, and formed with a second hole 72 penetrated from the upper surface 68 to the lower surface 70. The lower surfaces 70 of the upper metal sheets 48 are stacked on the upper surfaces 60 of the lower metal sheets 46, then the second hole 72 corresponding with the first hole 64.
The encapsulant 54 is encapsulated the lower metal sheets 46 and the upper metal sheets 48 via integrated mold, and filled into the first hole 64 and the second hole 72 to tighten the lower metal sheets 46 and upper metal sheets 48. Wherein the upper surfaces 60 of the lower metal sheets 46 are exposed from the encapsulant 54. The lower surfaces 62 of the lower metal sheets 46 are exposed from the encapsulant 54 and electrically connected to the printed circuit board 32 via solder 30. The encapsulant 54 is formed with a frame layer 52 around the upper surfaces 68 of the upper metal sheets 48 to define a chamber 74 together with the upper metal sheets 48.
The photosensitive chip 54 is arranged on the middle board 67 and located within the chamber 74.
The plurality of wires 56 are electrically connected the photosensitive chip 54 to the upper surfaces 60 of the upper metal sheets 46 so as to transfer signals from the photosensitive chip 54 to the lower metal sheets 46.
The transparent layer 58 is a piece of transparent glass arranged on the frame layer 52 of the encapsulant 50 to cover the photosensitive chip 54. Thus, the photosensitive chip 54 may receive optical signals passing through the transparent layer 58.
The invention has the following advantages.
While the invention has been described by way of examples and in terms of preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments. To the contrary, it is intended to cover various modifications. Therefore, the scope of the appended claims should be accorded the broadest interpretation so as to encompass all such modifications.
