Subject matter disclosed in this document relates to antenna systems and, more particularly, to antenna array elements for imaging systems.
Many modern imaging antenna applications require (broad) bandwidth in array antennas. In addition, many of these applications also require high isolation and low cross polarization between antenna elements. A further desirable quantity is for the elements of an array antenna to have coincident phase centers for different polarizations to reduce the need for complicated polarization calibrations. Imaging arrays present a significant challenge in material selection, apparatus design development of materials adaptation (Hints: dielectric layers), and manufacturing processes to manufacture the photonic detectors (pixels) array. It is also generally desirable that antenna designs be relatively easy and low cost to manufacture. Due to size and weight constraints in some applications, it may also be desirable that antennas be lightweight and relatively low-profile. Thus, there is a general need for antenna designs that are capable of providing some or all of these various attributes.
In accordance with one aspect of the concepts, systems, circuits, and techniques described herein, an array antenna comprises a plurality of layers of dielectric material and a log-periodic toothed planar antenna. The planar antenna includes two substantially planar conductive sections, which are inlaid in a top layer of the dielectric material so a top surface of the planar sections is substantially perpendicular to an outer surface of the top layer of dielectric material. The antenna also includes a conductive balun, comprising at least two conductive sections, each of the conductive sections coupled to one of the planar sections of the antenna and embedded in one or more layers of the dielectric material. The balun extends through at least some of the layers of dielectric material in a direction substantially perpendicular to the planar conductive sections of the antenna. At least two conductive sections of the balun are arranged in an alternating staircase pattern.
In another embodiment, an imaging system comprises a two-dimensional array of antenna sections, each antenna section including a plurality of layers of dielectric materials and a log-periodic toothed planar antenna. The planar antenna includes two substantially planar conductive sections, which are inlaid in a top layer of the dielectric material so a top surface of the planar sections is substantially perpendicular to an outer surface of the top layer of dielectric material. The antenna also includes a conductive balun, comprising at least two conductive sections, each of the conductive sections coupled to one of the planar sections of the antenna and embedded in one or more layers of the dielectric material. The balun extends through at least some of the layers of dielectric material in a direction substantially perpendicular to the planar conductive sections of the antenna. At least two conductive section of the balun are arranged in an alternating staircase pattern.
The foregoing features may be more fully understood from the following description of the drawings. The drawings illustrate exemplary embodiments and examples of the technology disclosed in this application. Therefore, the scope of the illustrations and drawings should not be construed to limit the scope of the disclosure, but rather, to provide examples of what is disclosed.
Like reference designators in the figures may denote like elements or similar elements.
Each antenna element may provide a pixel for use in an imaging system. The pixels provided by each antenna can be compiled and processed to form an image. The use of small or sub-compact antenna elements 12 increases the pixel density of the processed image. Thus, the array antenna 10 is well suited for imaging systems, for example, systems that receive electromagnetic radiation from randomly generated body heat and form an image of the source of the radiation.
In an embodiment, array antenna 10 comprises a layered substrate, which will be discussed below. The substrate may be a semiconductor substrate, such as a doped silicon die, or other substrate having layers of dielectric material. In embodiments, the substrate may be constructed so that different layers of the substrate have different dielectric properties.
The substrate may be sectioned into a two dimensional array of antenna elements 12, as shown in
Antenna component 12 may be designed to receive radiation in the microwave spectrum, for example, in the W band (i.e. 75 to 110 GHz), in the V band (i.e. 50 to 75 GHz), in the U band (i.e. 40 to 60 GHz), or in any other microwave frequency range. Using the W band as an example, if antenna component 12 is designed to receive W band signals, λ0 may be chosen to be 11×10−12 meters, which may roughly correlate to a center frequency of 90 GHz. λ0 can also be chosen as any wavelength according to design requirements for antenna array 10 and/or antenna component 12, and according to a desired center frequency or frequency band to be received. In certain embodiments, λ0 may be chosen as a wavelength in the W band, and the resulting antenna component 12 may be able to successfully receive signals in other bands, such as the V band, the U band, the F band, the D band, etc.
As shown in
In an embodiment, first layer 302 and second layer 304 comprise a dielectric epoxy material. The material may have a dielectric constant of about 2.9 and a loss tangent of about 0.04. During manufacturing, layer 304 may be formed on substrate 200. Subsequently antenna elements 202 and 204 may be masked and/or etched (or otherwise formed) onto the surface of layer 304. Once antenna elements 202 and 204 are formed, layer 302 of dielectric material may be deposited on top of layer 304 in the areas not covered by antenna elements 202 and 204. Alternatively, the dielectric material of layer 302 may be deposited onto the surface of substrate 200 so that layer 302 covers both layer 304 and the antenna elements. In an embodiment, material may then be removed from the top surface of substrate 200 until antenna elements 202 and 204 are exposed and the surface of antenna element 202 and antenna element 204 is flush or parallel with the surface of layer 302. However, removal of the material to expose antenna elements 202 and 204 is not a requirement.
Layers 302, 304, 308, and 312 may comprise the same or a similar dielectric epoxy. As noted above, the dielectric epoxy in layers 302, 304, 308, and 312 may have a dielectric constant of about 2.9 and a loss tangent of about 0.04. These constants are provided as examples only; the material in layers 302, 304, 308, and 312 may have other dielectric constants and loss tangents as desired. Also, layers 302, 304, 308, and 312 may be formed from different dielectric materials if desired.
Layers 306 and 310 are conductive layers. For example, layers 306 and 310 may be copper, aluminum, gold, or any other type of conductive material. In an embodiment, layers 306 and 310 are electrically connected to a ground reference and act as ground planes for the antenna array 10.
Reference designator 314 denotes a multi-layered section of substrate 200. These layers in section 314 may be relatively thinner than layers 302, 304, 306, 308, 310, and/or 312. Accordingly, these layers 314 are broken out and enlarged in
As shown in
The table above illustrates an exemplary embodiment of the layers in substrate 200, and is not intended to limit the scope of the disclosure. The layers above can be removed, replaced, or modified with material having different properties as required by design requirements.
Antenna elements 202 and 204 may comprise a log-periodic toothed planar array antenna, where antenna element 202 is one side of the log periodic planar antenna and antenna element 204 is the other side of the log periodic planar antenna. In an embodiment, antenna element 202 has a central body 404 with a roughly triangular shape, with a point or apex of the triangle terminating at or near a central point 402. Extending from the central body 404 are a series of teeth or leaves 406. The leaves 406 extend from the body 404 and have a curvature or radius relative to central point 402. The leaves 406 closest to central point 402 may be relatively smaller in width and length, and the leaves 406 further from central point 402 may increase in width and length the further they are from central point 402. As shown, the leaves 406 extend from the body 404 in an alternating pattern relative to their distance from central point 402. In other words, as body 404 extends radially from central point 402, leaves 406 extend first from one side of body 404 then on the other side, etc., so that the leaves 406 alternate sides.
In an embodiment, the leaves 406 of the antenna may approximate the shape of a spiral planar antenna. However, leaves 406 need not form a spiral. For example, the curvature of leaves 406 may follow a spiral pattern. In other embodiments, leaves 406 may have a circular, elliptical, semi-circular, or arced pattern, as shown in
In an embodiment, antenna elements 202 and 204 may each have four leaves 406 on one side of body 404 and five leaves on the other side of body 404. However, this is not a requirement. Antenna elements 202 and 204 can have more or fewer leaves 406 on each side of body 404. The leaves 406 may increase in length and thickness as they increase in distance from central point 402.
Antenna element 202 may also include a hole 408. As shown in
Antenna elements 202 and 204 may be radially symmetric, i.e. antenna element 202 and antenna element 204 may be identical about the central point 402. Accordingly, antenna element 204 may include at least all the features described above with respect to antenna element 204 including, but not limited to, body 404, leaves 406, and hole 408.
Balun 502 extends through substrate 200 substantially perpendicularly to antenna elements 202 and 204. By extending balun 500 down through the substrate, antenna component 12 can be constructed in a sub-compact arrangement because the area and volume used by antenna elements 202 and 104, and balun 502, is reduced.
Balun 502, when electrically connected to antenna element 202 and antenna element 204, may act to extend the electrical length of antenna element 202 and antenna element 204 so that the antenna length is a multiple of a quarter wavelength of the intended frequency to be received by antenna component 12, i.e. so that the electrical length is the same as or similar to λ0/4, λ0/2, λ0, etc. However, this is not a requirement. For example, the electrical length of the antenna may be a quarter wavelength at a high frequency, but may be less than a quarter wavelength for slower frequencies, which can also be received by the antenna. This is due, at least in part, to the balun 502 being embedded in the layers of dielectric material, which effectively increases the electrical length of the balun 502.
Balun 502 acts to electrically extend the length of the antenna by affecting the impedance, capacitance, resistance, and other electrical properties of the antenna. As described previously, balun 502 may be embedded within dielectric layers of substrate 200. Also, dielectric material may fill voids within balun 502, as shown in
The electrical length of the antenna and/or the balun may be less than a quarter-wavelength of the intended frequency. As is known, extending the electrical length of the antenna can aid in reception of the intended frequencies by the antenna. In an embodiment, the electrical length of the antenna and/or the balun may be less than a quarter wavelength of the intended frequency. For example, the dielectric material in which balun 502 is embedded, and which fills voids within balun 502, imparts electrical properties on balun 502 making balun appear (i.e. act) as though it is electrically longer than its physical dimensions.
As shown in
Balun 502 may also pass through conductive layers 306 and 310. As such, conductive layers 306 and 310 may contain one or more holes through which balun 502 can extend so that balun 502 does not make direct electrical contact with layers 306 and 310, which may be coupled to ground. Referring briefly to
Referring again to
Annular sections 504 may each have a top end 507 and a bottom end 508 coupled to a substantially planar conductive element 510. Annular sections 504 and conductive elements 510 are connected to form a transverse pattern where annular sections 504 are placed in alternating positions with respect to conductive elements 510. This so-called alternating staircase pattern forms a substantially alternating or zigzag conduction path as shown by line 512. This allows balun 502 to provide a sufficiently long conduction path 512 for antenna component 12 to receive microwave signals while conserving the amount of area and/or volume used by balun 502 within substrate 200.
Although shown as having three annular sections 504 on each side of the balun 502, balun 502 may include more or fewer than three annular sections (and thus more or fewer conductive elements 510) as desired. Reducing the number of annular sections 504 may reduce the electrical length of balun 502 and increasing the number of annular sections 504 may increase the electrical length of balun 502.
Balun 502 also includes one or more antenna connectors 514 that electrically couple balun 502 to antenna elements 202 and 204. Antenna connectors 514 may extend through the holes 408 in the antenna elements 202 and 204, as shown in
Antenna connectors 514 may be annular connectors with a substantially cylindrical shape, and may have a hollow core 506. The hollow core 506 may be filled with a dielectric material similar to or the same as the dielectric material used in one or more of the layers of substrate 200. In an embodiment, the diameter of the connectors 514 and holes 408 may be smaller than the diameter of annular sections 504. However, this is not a requirement. In other embodiments, the diameter of connectors 514 and holes 408 may be the same as or greater than the diameters of annular sections 504.
Referring again to
In embodiments, terminal connectors 516 are coupled to external circuitry capable of receiving signals from antenna component 12. For example, terminal connectors 516 may be coupled to an amplifier, a filter, a processor, or another circuit capable of receiving and processing signals coupled by antenna component 12 as antenna component 12 receives microwave transmissions and signals. In an embodiment, terminal connectors 516 extend through the bottom substrate 200 so that external, electrical connections can be made to terminal connectors 516. In another embodiment, terminal connectors 516 are embedded within substrate 200 and are coupled to connectors that extend externally to substrate 200.
For example, turning to the embodiment illustrated in
Connection pads 802 may be coupled to a signal lead, such as signal lead 902 in
A conductor 904 may be positioned adjacent to the signal leads 902. In an embodiment, conductor 904 may be positioned below signal leads 902. Conductor 904 may be coupled to a ground reference so that conductor 904 acts as a ground plane to enhance signal quality of the signals on signal leads 902. Additionally/alternatively, conductor 904 may act as an impedance transformer to match the impedance of the signal paths of the antenna to external circuitry connections.
Referring again to
In the description above, various features, techniques, and concepts are described in the context of an imaging antenna array and antenna components. It should be appreciated, however, that these features are not limited to use within an imaging array. That is, most of the described features may be implemented in any type of antenna application.
Having described exemplary embodiments of the invention, it will now become apparent to one of ordinary skill in the art that other embodiments incorporating their concepts may also be used. The embodiments contained herein should not be limited to the disclosed embodiments, but rather should be limited only by the spirit and scope of the appended claims. All publications and references cited herein are expressly incorporated herein by reference in their entirety.
The invention or inventions disclosed in this document were made with government support under contract number N68936-12-C-0114. The government has certain rights in the invention(s).
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