Claims
- 1. An imaging method comprising the steps of:
- a. providing an imaging member comprising a layer of migration material spaced apart from at least one surface of, but contacting a softenable layer;
- b. applying a migration force to said migration layer; and
- c. imagewise developing the softenable layer to change its resistance, in image configuration, to migration of material from the migration layer to cause an imagewise migration of migration material at least in depth in said softenable layer.
- 2. An imaging method according to claim 1 wherein said softenable layer is on a substrate spaced apart from said migration layer.
- 3. An imaging method according to claim 2 wherein said substrate is electrically conductive.
- 4. An imaging method according to claim 2 wherein said migration layer is fracturable and from about 0.01 to about 2.0 microns thick.
- 5. An imaging method according to claim 4 wherein said fracturable migration layer comprises particles with an average particle size between about 0.01 and about 2.0 microns.
- 6. An imaging method according to claim 5 wherein the average particle size is between about 0.01 and about 0.7 microns.
- 7. An imaging method according to claim 4 wherein said softenable layer is from about 1/2 to about 16 microns thick.
- 8. An imaging method according to claim 7 wherein said migration layer is photosensitive.
- 9. An imaging method according to claim 8 wherein said migration layer is photoconductive.
- 10. An imaging method according to claim 2 wherein said migration layer is thermoconductive.
- 11. An imaging method according to claim 1 wherein said migration layer is substantially photosensitively including photoconductively inert.
- 12. An imaging method according to claim 1 wherein said migration layer is magnetizable.
- 13. An imaging method according to claim 2 wherein said migration layer is fracturable and is contiguous that surface of said softenable layer opposed to the softenable layer surface-substrate interface.
- 14. An imaging method according to claim 13 wherein said fracturable migration layer is between about 0.01 to about 2.0 microns thick and is photosensitive.
- 15. An imaging method according to claim 14 wherein said photosensitive fracturable layer comprises selenium.
- 16. An imaging method according to claim 15 wherein said photosensitive fracturable layer comprises amorphous selenium.
- 17. An imaging method according to claim 1 wherein said softenable layer is substantially electrically insulating and said migration force is substantially uniform and is applied to said migration layer by steps comprising uniformly electrostatically charging said member.
- 18. An imaging method according to claim 17 wherein the electric field within the softenable layer is greater than about 10 volts/micron.
- 19. An imaging method according to claim 17 wherein said force applying step includes applying an external electric field to said member.
- 20. An imaging method according to claim 19 wherein the total electric field within the softenable layer resulting from said uniform charging and external electric field applying steps is greater than about 10 volts/micron.
- 21. An imaging method according to claim 1 wherein said migration force is substantially uniform and is applied to said layer by steps comprising applying a uniform magnetic field to a uniformly migration layer.
- 22. An imaging method according to claim 1 wherein said migration force is substantially uniform and comprises the earth's gravitational force.
- 23. An imaging method according to claim 1 wherein said migration force is substantially uniform and comprises centrifugal force.
- 24. An imaging method according to claim 1 wherein said imagewise developing is by steps comprising exposing a softened softenable layer to an image pattern of hardening radiation.
- 25. An imaging method according to claim 2 wherein said imagewise developing is by steps comprising exposing a softenable layer to an image pattern of hardening radiation and applying a developing agent to said softenable layer to cause developing in the relatively softer areas.
- 26. An imaging method according to claim 2 wherein said imagewise developing is by steps comprising exposing the softenable layer to an image pattern of softening radiation.
- 27. An imaging method comprising the steps of:
- a. providing a softenable layer;
- b. imagewise developing said layer to change its permeability in image configuration;
- layering a migration layer on said imagewise developed softenable layer; and
- d. applying a migration force to said migration layer.
- 28. An imaging method according to claim 25 wherein said migration force is substantially uniform.
- 29. An imaging method according to claim 25 wherein said developing agent comprises heat.
- 30. An imaging method according to claim 25 wherein said developing agent comprising the vapor of a softening liquid for said material.
- 31. An imaging method according to claim 25 wherein said developing agent comprises heat and the vapor of a softening liquid for said material.
- 32. An imaging method according to claim 29 wherein said softenable material is heated to between about 50.degree. C. to about 150.degree. C.
- 33. An imaging method according to claim 32 wherein said softenable material is maintained in said heated condition for from about 1 to about 10 seconds.
- 34. An imaging method according to claim 30 wherein said material is exposed to said softening liquid vapor for a period of from about 1/2 to about 60 seconds.
- 35. An imaging method according to claim 16 wherein said migration layer is photoconductive and wherein said migration force applying step includes a uniform exposure to activating radiation simultaneous with or after said charging step.
CROSS-REFERENCES TO RELATED APPLICATIONS
This is a division of application Ser. No. 837,780 filed June 30, 1969 now U.S. Pat. No. 3,975,195, which is a continuation-in-part of my copending U.S. Patent Applications (1) Ser. No. 725,676, filed May 1, 1968 abandoned; (2) Ser. No. 460,377, filed June 1, 1965 now U.S. Pat. No. 3,520,681 and (3) Ser. No. 483,675, filed Aug. 30, 1965 now U.S. Pat. No. 3,656,990; Application (1) being a continuation-in-part of (2)and (3) and Application Ser. No. 403,002, filed Oct. 12, 1964, now abandoned; (2) and (3) both being continuations-in-part of Ser. No. 403,002.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
3676117 |
Kinoshita |
Jul 1972 |
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3719482 |
Goffe |
Mar 1973 |
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Related Publications (5)
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Number |
Date |
Country |
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460377 |
Jun 1965 |
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483675 |
Aug 1965 |
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483675 |
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403002 |
Oct 1964 |
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483675 |
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Divisions (1)
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Number |
Date |
Country |
Parent |
837780 |
Jun 1969 |
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Continuation in Parts (3)
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Number |
Date |
Country |
Parent |
725676 |
May 1968 |
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Parent |
460377 |
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Parent |
403002 |
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