Patent Application
20140307360
1. Field of the Invention
The subject invention relates to bulk capacitors, and more particularly, to an immersion cooled bulk film capacitor for use in aerospace power electronics converter equipment.
2. Description of Related Art
Power conversion equipment requires the rapid switching of large currents by power electronic semiconductor devices. Typically, in power convertor circuits, reactive current is provided by a bank of bulk capacitors, as disclosed for example in U.S. Pat. No. 5,729,450 to Dimino et al., the disclosure of which is herein incorporated by reference in its entirety. Bulk film capacitors are an important aspect in any aerospace power electronic converter.
Often these capacitors are sized by their current rating and thus become thermally limited due to excessive heating and internal hot spots. Unless, properly designed and controlled, high rates of heat generation can result in high operating temperatures for electronic equipment. This will jeopardize its safety and reliability. Therefore, thermal control has become increasingly important in the design and operation of power conversion equipment.
Several cooling techniques are commonly used in electronic equipment. These include conduction cooling, natural convection and radiation cooling, forced-air cooling, liquid cooling and immersion cooling. The immersion cooling technique is the most reliable, since it does not involve any penetration into the electronic enclosure and the component resides in a completely sealed liquid environment. The subject application, employs the technique of immersion cooling to optimize heat transfer and reduce thermal stress in a uniquely constructed bulk film capacitor.
The subject invention is directed to a power electronics converter and more particularly to a new and useful immersion cooled capacitor for use in power electronics converters. The power electronics convertor includes a housing, a cooling liquid contained within the housing, and at least one capacitive element disposed within the housing and submerged in the cooling liquid.
Preferably, there is a bank of capacitive elements disposed within the housing and submerged in the cooling liquid. Each capacitive element in the bank of capacitive elements has an open interior region configured to optimize heat transfer between the capacitive element and the cooling liquid and reduce thermal stress in the capacitor.
The housing of the power electronics convertor is hermetically sealed and the cooling liquid is a non-conductive liquid, such as for example, a fluorocarbon fluid. Each capacitive element is wound about a thermally conductive hollow core forming the open interior region of the capacitive element. In one aspect of the invention, the hollow core of the capacitive element has a smooth interior surface finish. Alternatively, the hollow core of the capacitive element has a roughened interior surface finish to help initiate nucleated boiling of the cooling fluid.
The capacitive element may be an inductively wound element or a non-inductively wound element. In either case, the capacitive element is configured with two alternating layers of metallized foil and two alternating layers of insulative film, wherein one foil layer provides a positive terminal for the capacitor and the other foil layer provides a negative terminal for the capacitor. Those skilled in the art should readily appreciate that although the two terminals are referred to herein as positive and negative, bulk film capacitors are typically not polarized.
In the case of the non-inductively wound element, end portions of one foil layer extend from one end of the capacitive element and end portions of the other foil layer extend from an opposed end of the capacitive element. Preferably, the end portions of the respective foil layers are joined to one another by an end connection, and a terminal tab is provided at each end connection, whereby one end terminal defines a positive terminal for the capacitor and the other terminal defines a negative terminal for the capacitor.
These and other features of the immersion cooled capacitor of the subject invention and the manner in which it is employed within a power electronics convertor will become more readily apparent to those having ordinary skill in the art from the following enabling description of the preferred embodiments of the subject invention taken in conjunction with the several drawings described below.
So that those skilled in the art to which the subject invention appertains will readily understand how to make and use the immersion cooled capacitor of the subject invention without undue experimentation, preferred embodiments thereof will be described in detail herein below with reference to certain figures, wherein:
Referring now to the drawings, wherein like reference numerals identify similar structural features or aspects of the subject invention, there is illustrated in
Referring to
Referring to
As best seen in
The capacitive element 16 is cooled through nucleated boiling of the cooling liquid 114 and will have a heat transfer coefficient of about 15,000 W/m2K, as compared to 5 W/m2K with natural convection air. In operation, heat dissipated into the cooling liquid 114 from the capacitive element 16 is transferred to the walls of the housing 112, and then to the external fins 116. That heat can then be readily removed by external cooling means, such as, for example, by a cooling fan.
With continuing reference to
The high heat transfer coefficient of 3M's Fluorinert™ FC-72 and its ability to move through very small passages leads to the need for only a small diameter passage through the hollow core 18 of the capacitor 16. This small core passage of core member 18 effectively enables the removal of heat from the capacitor element 16 and maintains the volumetric density thereof. The size of the bore hole of core member 18 can vary depending upon the application, but it is typically small in diameter relative to the overall diameter of the capacitor 16.
In one embodiment of the subject invention, the hollow core 18 has a smooth interior surface finish. In another embodiment of the subject invention, the hollow core 18 has a roughened interior surface finish to help initiate nucleated boiling of the cooling liquid 114 as it passes through the central passage of the hollow core 18.
The capacitive element 16 can be formed as an inductively wound element as illustrated in
In the case of the inductively wound element shown in
In the case of the non-inductively wound element shown in
Preferably, the end connections 34, 36 is formed by applying a conductive spray. For this application the hollow core 18 is first covered and then the spray is applied. After the spray has been applied, the coolant channel of the core 18 is uncovered. Thereafter, terminal tabs (now shown) are inserted into the end connections 34, 36 on either side of the capacitive element 16.
Those skilled in the art will readily appreciate that there is no need to isolate the hollow aluminum core 18, as typically the first layer in the stack is an insulative film layer. Nevertheless, if the first layer in the stack was a foil layer, it would not affect the capacitor since the hollow aluminum core 18 would only make contact with a single foil layer.
While the immersion cooled capacitor 10 of the subject invention has been shown and described with reference to preferred embodiments, those skilled in the art will readily appreciate that various changes and/or modifications may be made thereto without departing from the spirit and scope of the subject invention as defined by the appended claims.
