Patent Application
20220330464
The present invention relates to an impedance matching film and a radio wave absorber.
A technique that is for impedance matching by means of a predetermined film and by which impedance of a front surface of a radio wave absorber is matched to a characteristic impedance of air has been conventionally known. Meanwhile; an effort has been made to provide a transparent radio wave absorber.
For example, Patent Literature 1 describes a radio wave absorber in which all component layers are transparent or semi-transparent. In this radio wave absorber, a whole-surface conductor layer; a first dielectric layer, a linear pattern resistance layer, a second dielectric layer; and a pattern layer are stacked in this order. The pattern layer being the uppermost layer of this radio wave absorber can favorably receive an electromagnetic wave. Since the pattern layer and the second dielectric layer are in contact with each other, a large portion of the electromagnetic wave received by the pattern layer leaks to the second dielectric layer. Since the second dielectric layer and the linear pattern layer are in contact with each other, the linear pattern layer can efficiently convert the electromagnetic wave leaking to the second dielectric layer into heat. A highly resistive conductor having a volume resistivity of 1.0×10−4 Ωcm or more and 1.0×10−1 Ωcm or less forms the linear pattern resistance layer.
Patent Literature 1: JP 2006-179671 A
In the radio wave absorber described in Patent Literature 1, the linear pattern layer is for efficiently converting an electromagnetic wave leaking to the second dielectric layer into heat, and Patent Literature 1 does not describe impedance matching by means of the linear pattern layer.
Meanwhile, it is expected that impedance matching films having transparency will be needed in sensing using a sensor disposed around a headlight and a windshield. Moreover, it is expected that impedance matching films having transparency and being advantageous in noise reduction will be needed in a wide range of technical fields, such as fields of the 5th generation mobile communication system (5G) and the Internet of things (IoT). In view of these circumstances, the present invention provides a new impedance matching film having transparency.
The present invention provides an impedance matching film, including: a plurality of openings regularly arranged along a principal surface of the impedance matching film, wherein
a value obtained by dividing a specific resistance of a material of the impedance matching film by a thickness of the impedance matching film is 1 to 300 Ω/□.
The present invention also provides a radio wave absorber, including:
the above impedance matching film;
a reflector that reflects a radio wave; and
a dielectric layer disposed between the impedance matching film and the reflector in a thickness direction of the impedance matching film.
The above impedance matching film is a new impedance matching film having transparency.
A plurality of openings of an impedance matching film are advantageous in view of imparting transparency to an impedance matching film. Moreover, a plurality of openings regularly arranged along a principal surface of an impedance matching film is advantageous in view of reducing spatial variation in transparency of the impedance matching film. Studies by the present inventors revealed that the description in Patent Literature 1 was insufficient to produce such an impedance matching film. Therefore, as a result of intensive studies, the present inventors newly found that adjusting a value obtained by dividing the specific resistance of the material of an impedance matching film by the thickness of the impedance matching film within a given range is advantageous in view of achieving both desirable impedance matching and high transparency. The present inventors have invented the impedance matching film according to the present invention on the basis of this new finding. The term “transparency” as used herein means transparency to visible light unless otherwise described.
Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to the following embodiments.
As shown in
The specific resistance ρ of the material of the impedance matching film 10a can be determined, for example, by measuring the electrical resistance and size of a piece taken from the impedance matching film 10a and having a given size. The thickness t of the impedance matching film 10a can be determined, for example, by observing a cross-section of the impedance matching film 10a using a transmission electron microscope (TEM).
In the impedance matching film 10a, pit may be 250Ω/□ or less, 200Ω/□ or less, or less than 200Ω/□. This makes it easy to arrange the plurality of openings 11 so that the impedance matching film 10a will have high transparency and to perform desirable impedance matching.
In the impedance matching film 10a, pit may be 2Ω/□ or more, 3Ω/□ or more, or 4Ω/□ or more. This makes it easy to perform desirable impedance matching by means of the impedance matching film 10a.
A maximum size D1 of the opening 11 on the principal surface 10f is not limited to a particular value. The maximum size D1 is, for example, 7.5×104 μm or less. This makes it easy to perform desirable impedance matching by means of the impedance matching film 10a. For example, a radio wave absorber produced using the impedance matching film 10a is likely to exhibit high radio wave absorption performance for a radio wave having a desirable frequency. As shown in
The maximum size D1 may be 5.0×104 μm or less, 0.5×104 μm or less, 0.1×104 μm or less, or 0.03×104 μm or less.
The lower limit of the maximum size D1 is not limited to a particular value. The maximum size D1 is, for example, 1 μm or more, and may be 5 μm or more or 10 μm or more. This makes it easy to produce the impedance matching film 10.
In the impedance matching film 10a, a minimum D2 of a distance between the openings 11 is not limited to a particular value. The minimum D2 is, for example, 0.1 to 650 μm. In this case, the impedance matching film 10a more reliably has transparency and desirable impedance matching can be performed by means of the impedance matching film 10a. For example, a radio wave absorber produced using the impedance matching film 10a is likely to exhibit high radio wave absorption performance for a radio wave having a desirable frequency.
The minimum D2 may be 0.3 μm or more or 0.5 μm or more. The minimum D2 may be 640 μm or less, 600 μm or less, 500 μm or less, 400 μm or less, or 300 μm or less.
The thickness t of the impedance matching film 10a is not limited to a particular value as long as pit is 1 to 300Ω/□, The thickness t of the impedance matching film 10a is, for example, 5 to 500 nm. In this case, it is easy to reduce warping of the impedance matching film 10a, and a crack is unlikely to happen in the impedance matching film 10a. Moreover, it is easy to suppress a change in the properties of the impedance matching film 10a placed in a given environment.
The thickness t of the impedance matching film 10a may be 10 nm or more or 15 nm or more. In this case, it is easy to suppress a change in the properties of the impedance matching film 10a placed in a given environment. The thickness t of the impedance matching film 10a may be 450 nm or less or 400 nm or less. In this case, warping of the impedance matching film 10a can be reduced more reliably.
The specific resistance ρ of the material of the impedance matching film 10a is not limited to a particular value as long as ρ/t is 1 to 300Ω/□. ρ is, for example, 5×10−6 to 2×10−3 Ω·cm. In this case, the thickness t of the impedance matching film 10 is likely to be the desirable thickness when pit is adjusted within the desirable range. As a result, it is easy to suppress a change in the properties of the impedance matching film 10a placed in a given environment. Additionally, it is easy to reduce warping of the impedance matching film 10a, and a crack is unlikely to happen in the impedance matching film 10a.
The specific resistance ρ of the material of the impedance matching film 10a may be, for example, 1×10−5 Ω·cm or more or 5×10−5 Ω·cm or more. This makes it easy to decrease the thickness t of the impedance matching film 10 and to reduce warping of the impedance matching film 10a. As a result, a crack is unlikely to happen in the impedance matching film 10a. The specific resistance ρ of the material of the impedance matching film 10a may be, for example, 1.8×10−3 Ω·cm or less or 1.6×10−3 Ω·cm or less. This makes it easy to increase the thickness t of the impedance matching film 10 and to suppress a change in the properties of the impedance matching film 10a placed in a given environment.
The arrangement of the plurality of openings 11 is not limited to a particular arrangement as long as the openings 11 are regularly arranged. For example, in the impedance matching film 10a, the plurality of openings 11 are arranged such that centers of the openings 11 make a square lattice on the principal surface 10f.
The shape of each opening 11 is not limited to a particular shape as long as the openings 11 are regularly arranged. For example, in the impedance matching film 10a, the plurality of openings 11 are each in a square shape in plan view.
, An opening proportion of the openings 11 in the impedance matching film 10a is not limited to a particular value. The opening proportion of the openings 11 in the impedance matching film 10a is, for example, 50% or more, and may be 60% or more or 70% or more. The opening proportion of the openings 11 in the impedance matching film 10a is, for example, 99% or less, and may be 97% or less or 95% or less. The opening proportion of the openings 11 is a proportion Sa/(Sa+Sb) of an opening area Sa of the plurality of openings 11 of the impedance matching film 10a viewed in plan in the sum Sa+Sb of the opening area Sa of the plurality of openings 11 and an area Sb of a non-opening portion of the impedance matching film 10a viewed in plan.
The material of the impedance matching film 10a is not limited to a particular material as long as pit can be adjusted to 1 to 300Ω/□. The material of the impedance matching film 10a may be an inorganic material such as a metal, an alloy, or a metal oxide or may be an organic material such as an electrically conductive polymer or a carbon nanotube.
The impedance matching film 10a may be a film that has a uniform thickness and in which a plurality of through holes are formed or may be made of a fabric. Fibers of the fabric may be an organic material such as an electrically conductive polymer or a carbon nanotube or may be an inorganic material such as a metal or an alloy.
As shown in
The substrate 22 plays a role, for example, as a support that supports the impedance matching film 10a. The impedance matching film 10a of the impedance matching film-attached film 15 can be produced, for example, by forming the plurality of openings 11 by laser processing, etching, or the like in an imperforate film formed on one principal surface of the substrate 22 by a film formation method such as sputtering. In some cases, the imperforate film to be formed into the impedance matching film 10a may be formed by a film formation method such as ion plating or coating (for example, bar coating).
The substrate 22 has a thickness of, for example, 10 to 150 μm and desirably has a thickness of 15 to 100 μm. In this case, the substrate 22 has low flexural rigidity, and occurrence of a wrinkle in the substrate 22 or deformation of the substrate 22 can be reduced at the time of formation of the impedance matching film 10a.
The impedance matching film 10a may be modified such that the plurality of openings 11 are arranged and have the shapes as shown by an impedance matching film 10b shown in
As shown in
As shown in
As shown in
The plurality of openings 11 may be in another polygonal shape, such as a rectangular shape, or an elliptical shape in plan view. The plurality of openings 11 may be arranged such that centers thereof make another plane lattice, such as a rectangular lattice, on the principal surface 10f. Herein, the term “plane lattice” refers to an array of points on a plane, the array being unchanged by parallel displacement in two independent directions over a constant distance each.
As shown in
The radio wave absorber 1a is, for example, a λ/4 radio wave absorber. The radio wave absorber 1a is designed to cause interference between a radio wave reflected by the surface of the impedance matching film 10a (front surface reflection) and a radio wave reflected by the reflector 30 (back surface reflection) upon incidence of a radio wave having a wavelength λ0 to be absorbed on the radio wave absorber 1a. In the λ/4 radio wave absorber, the wavelength 10 of a radio wave to be absorbed is determined according to a thickness t of the dielectric layer and a relative permittivity εr of the dielectric layer, as shown in the following equation (1). That is, a radio wave having a wavelength to be absorbed can be set by appropriately adjusting the relative permittivity and thickness of the dielectric layer. In the equation (1), sqrt(Er) means a square root of the relative permittivity εr.
λ0=4t×sqrt(εr) Equation (1)
In the radio wave absorber 1a, the maximum size D1 of the opening 11 is, for example, 114 or less of an absorption peak wavelength λp. The absorption peak wavelength λp is a radio wavelength at which an absolute value of a reflection amount measured for the radio wave absorber 1a according to Japanese Industrial Standards (JIS) R 1679: 2007 is largest. In other words, the absorption peak wavelength λp is a radio wavelength at which a radio wave absorption amount of the radio wave absorber 1a is largest. The radio wave absorption amount is an absolute value of the reflection amount measured according to JIS R 1679: 2007. With this configuration, front surface reflection of a radio wave with the absorption peak wavelength λp occurs properly on the radio wave absorber 1a, and the radio wave absorber 1a can favorably absorb the radio wave with the absorption peak wavelength λp.
The radio wave absorber 1a is configured to perform, for example, impedance matching for a radio wave having a frequency of 1 GHz or more. As a result, the radio wave absorber 1a can effectively absorb a radio wave having a frequency of 1 GHz or more.
The frequency of a radio wave for which the radio wave absorber 1a performs impedance matching may be 1 GHz or more, 4 GHz or more, or 20 GHz or more. The frequency of a radio wave for which the radio wave absorber 1a performs impedance matching is, for example, 3000 GHz or less, and may be 300 GHz or less or 100 GHz or less.
The reflector 30 is not limited to a particular embodiment as long as the reflector 30 can reflect a radio wave to be absorbed. The reflector 30 is, for example, a transparent conductive film. In this case, the reflector 30 has transparency and the radio wave absorber 1a is likely to be entirely transparent. The material of the transparent conductive film may be an inorganic material such as a metal, an alloy, or a metal oxide or may be an organic material such as an electrically conductive polymer or a carbon nanotube.
The transparent conductive film has, for example, a plurality of openings 31 regularly arranged along a principal surface of the transparent conductive film. With this configuration, the reflector 30 can properly reflect a radio wave to be absorbed and is likely to have desirable transparency. The transparent conductive film may be an imperforate film.
When the reflector 30 has the plurality of openings 31, the impedance matching film 10a may be a film that has a uniform thickness and in which a plurality of through holes are formed or may be made of a fabric. Fibers of the fabric may be an organic material such as an electrically conductive polymer or a carbon nanotube or may be an inorganic material such as a metal or an alloy.
The shape of each opening 31 of the reflector 30 is not limited to a particular shape. Examples of the shape of each opening 31 in plan view may include a triangle, a quadrangle such as a square and a rectangle, a hexagon, other polygons, a circle, and an ellipse.
The arrangement of the plurality of openings 31 of the reflector 30 is not limited to a particular arrangement. The plurality of openings 31 may be arranged, for example, such that centers thereof make a plane lattice such as a square or parallelogram lattice.
The relative permittivity of the dielectric layer 20 is, for example, 2.0 to 20.0. In this case, the thickness of the dielectric layer 20 is easily adjusted, and so is the radio wave absorption performance of the radio wave absorber 1a. The relative permittivity of the dielectric layer 20 is, for example, a relative permittivity measured at 10 GHz by a cavity resonance method.
The dielectric layer 20 is formed of, for example, a given polymer. The dielectric layer 20 includes, for example, at least one polymer selected from the group consisting of ethylene-vinyl acetate copolymer, vinyl chloride resin, urethane resin, acrylic resin, acrylic urethane resin, polyethylene, polypropylene, silicone, polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, and cydoolefin polymer. In this case, the thickness of the dielectric layer 20 is easily adjusted and the manufacturing cost of the radio wave absorber 1a can be maintained at a low level. The dielectric layer 20 can be produced, for example, by hot-pressing a given resin composition.
The dielectric layer 20 may be formed as a single layer or as a plurality of layers made of the same material or different materials. When the dielectric layer 20 includes n layers (n is an integer of two or greater), the relative permittivity of the dielectric layer 20 is determined, for example, as follows. The relative permittivity εi of each layer is measured (i is an integer of one to n). Next, the relative permittivity εi of each layer is multiplied by the proportion of the thickness t of the layer in the total thickness T of the dielectric layer 20 to determine εi×(ti/T). The relative permittivity of the dielectric layer 20 can be determined by adding the εi×(ti/T) values of all layers.
As shown in
In the radio wave absorber 1a, the second layer 22 doubles as a substrate for the impedance matching film 10a. The second layer 22 is, for example, disposed closer to the reflector 30 than the impedance matching film 10a is. As shown in
In the radio wave absorber 1a, the third layer 23 supports, for example, the reflector 30. In this case, the reflector 30 may be produced, for example, by forming a film on the third layer 23 by a method such as sputtering, ion plating, or coating (for example, bar coating). Furthermore, the plurality of openings 11 may be formed by laser processing, etching, or the like. As shown in
The examples of the material of the second layer 22, for example, can be used as the material of the third layer 23. The material of the third layer 23 may be the same as or different from the material of the second layer 22. The material of the third layer 23 is desirably PET in terms of the balance among good heat-resistance, dimensional stability, and manufacturing cost.
The third layer 23 has a thickness of, for example, 10 to 150 μm and desirably 15 to 100 μm. In this case, the third layer 23 has low flexural rigidity, and occurrence of a wrinkle in the third layer 23 or deformation of the third layer 23 can be reduced at the time of formation of the reflector 30. The third layer 23 can be omitted in some cases.
The first layer 21 may be composed of a plurality of layers. The first layer 21 can be composed of a plurality of layers particularly when the first layer 21 is in contact with at least one of the impedance matching film 10a and the reflector 30, as shown in
The first layer 21 may or may not have adhesiveness. When the first layer 21 has adhesiveness, an adhesive layer may be disposed in contact with at least one of the principal surfaces of the first layer 21 or may be disposed in contact with neither of the principal surfaces of the first layer 21. When the first layer 21 does not have adhesiveness, an adhesive layer is desirably disposed in contact with each of the principal surfaces of the first layer 21. When the dielectric layer 20 includes the second layer 22 which may not have adhesiveness, an adhesive layer may not be disposed in contact with both of the principal surfaces of the second layer 22. When the dielectric layer 20 includes the second layer 22, an adhesive layer can be disposed in contact with one principal surface of the second layer 22. When the dielectric layer 20 includes the third layer 23 which may not have adhesiveness, an adhesive layer may not be disposed in contact with both of the principal surfaces of the third layer 23. In this case, an adhesive layer can be disposed in contact with at least one principal surface of the third layer 23. The adhesive layer includes, for example, a rubber pressure-sensitive adhesive, an acrylic pressure-sensitive adhesive, a silicone pressure-sensitive adhesive, or a urethane pressure-sensitive adhesive.
The radio wave absorber 1a may include at least one of a dielectric loss material and a magnetic loss material. In other words, the radio wave absorber 1a may be a dielectric loss-type radio wave absorber or a magnetic loss-type radio wave absorber. In this case, pit required of the impedance matching film 10a is likely to be large. The dielectric layer 20 may include at least one of a dielectric loss material and a magnetic loss material. The material of the impedance matching film 10a may be a magnetic material.
The radio wave absorber 1a can be modified in various respects. For example, the radio wave absorber 1a may be modified to a radio wave absorber 1b shown in
As shown in
For example, the radio wave absorber 1b can be attached to a given article by bringing the adhesive layer 40a into contact with the article and pressing the radio wave absorber 1b to the article. A radio wave absorber-attached article can be obtained in this manner.
The adhesive layer 40a includes, for example, a rubber pressure-sensitive adhesive, an acrylic pressure-sensitive adhesive, a silicone pressure-sensitive adhesive, or a urethane pressure-sensitive adhesive. The radio wave absorber 1b may further include a separator (not illustrated). In this case, the separator covers the adhesive layer 40a. The separator is typically a film capable of maintaining the adhesiveness of the adhesive layer 40a while covering the adhesive layer 40a, the film being easily removable from the adhesive layer 40a. The separator is, for example, a film made of a polyester resin such as PET. Removal of the separator exposes the adhesive layer 40a and makes it possible to attach the radio wave absorber 1b to an article.
The present invention will be described in more detail by examples. The present invention is not limited to the examples given below. First, methods for evaluation of Examples and Comparative Examples will be described.
[Tem Observation]
Samples for observation of cross-sections of imperforate films according to Examples and Comparative Examples and alloy films of alloy film-attached films according to Examples and Comparative Examples were produced using a focused ion beam processing and observation system (manufactured by Hitachi High-Technologies Corporation; product name: FB-2000A). After that, the samples for observation of cross-sections were observed using a field-emission transmission electron microscope (manufactured by Hitachi High-Technologies Corporation; product name: HF-2000), and thicknesses of the imperforate films according to Examples and Comparative Examples were measured. Thicknesses of the alloy films of the alloy film-attached films according to Examples and Comparative Examples were measured in the same manner. The results are shown in Table 1.
[Specific Resistance]
Sheet resistances of the imperforate films according to Examples and Comparative Examples were measured by an eddy current method according to JIS Z 2316 using a non-contact resistance measurement apparatus (manufactured by NAPSON CORPORATION; product name: NC-80MAP). A product of the thickness and sheet resistance of each of the imperforate films according to Examples and Comparative Examples measured in the above manner was obtained to determine a specific resistance of the material of the imperforate film. The specific resistance of the material of each imperforate film was regarded as a specific resistance of the material of the alloy film of each of the alloy film-attached films according to Examples and Comparative Examples. The results are shown in Table 1.
[Radio Wave Absorption Performance]
A radio wave having a frequency of 1 to 90 GHz was incident on samples according to Examples and Comparative Examples at an incident angle of 0°, and an absolute value of a reflection amount at each frequency was determined for each sample according to JIS R 1679: 2007. For each sample, the largest absolute value of the reflection amount, a frequency (absorption peak frequency) at which the largest absolute value was shown, and a frequency range in which the absolute value of the reflection amount was 20 dB or more were determined.
An Al—Si alloy film was formed on a PET film by DC magnetron sputtering using Al (aluminum) and Si (silicon) as target materials and argon gas as a process gas. In the DC magnetron sputtering, discharging involving the Al (aluminum) target material and discharging involving the Si (silicon) target material were simultaneously performed. In this manner, an imperforate film according to Example 1 was formed on the PET film. The material of the imperforate film according to Example 1 had a specific resistance of 1.0×10−4 Ω·cm. Next, a plurality of square openings were formed in the imperforate film according to Example 1 using a laser pattern metal processing machine to obtain an alloy film-attached film according to Example 1. The maximum size of the opening was 127 μm and the minimum of a distance between the openings adjacent to each other was 10 μm in plan view. The plurality of openings were formed such that centers thereof made a square lattice in plan view.
DC magnetron sputtering was performed using, as a target material, an ITO including 10 weight % of SnO2 and argon and oxygen as process gasses to form an ITO film on the PET film. After that, annealing treatment of the ITO film was performed at a temperature of 150° C. for one hour to turn the ITO into a polycrystal and obtain a reflector-attached film. A reflector of the reflector-attached film had a sheet resistance of 20Ω/□. Next, an acrylic resin having a relative permittivity of 2.6 was shaped to a thickness of 615 μm to obtain an acrylic resin layer A. The alloy film-attached film according to Example 1 was placed over the acrylic resin layer A such that the alloy film of the alloy film-attached film according to Example 1 was in contact with the acrylic resin layer A. Next, the reflector-attached film was placed over the acrylic resin layer A such that a Cu film of the reflector-attached film was in contact with the acrylic resin layer A. A sample according to Example 1 was obtained in this manner.
An imperforate film according to Example 2 was formed on a PET film and an alloy film-attached film according to Example 2 was obtained in the same manner as in Example 1, except for the following. A ratio of discharge power in the discharging involving the Si (silicon) target material to discharge power in the discharging involving the Al (aluminum) target material was adjusted in the DC magnetron sputtering so that the material of the imperforate film according to Example 2 would have a specific resistance of 1.4×10−3 Ω·cm. DC magnetron sputtering conditions were also adjusted so that the alloy film of the alloy film-attached film according to Example 2 would have a thickness of 350 nm. A plurality of square openings were formed in the imperforate film according to Example 2 using a laser pattern metal processing machine to obtain the alloy film-attached film according to Example 2. The maximum size of the opening was 127 μm and the minimum of a distance between the openings adjacent to each other was 10 μm in plan view. The plurality of openings were formed such that centers thereof made a square lattice in plan view.
, A sample according to Example 2 was obtained in the same manner as in Example 1, except that the alloy film-attached film according to Example 2 was used instead of the alloy film-attached film according to Example 1.
An imperforate film according to Example 3 was formed on a PET film and an alloy film-attached film according to Example 3 was obtained in the same manner as in Example 1, except for the following. A ratio of discharge power in the discharging involving the Si (silicon) target material to discharge power in the discharging involving the Al (aluminum) target material was adjusted in the DC magnetron sputtering so that the material of the imperforate film according to Example 3 would have a specific resistance of 1.0×10−5 Ω·cm. DC magnetron sputtering conditions were also adjusted so that the alloy film of the alloy film-attached film according to Example 3 would have a thickness of 5 nm. A plurality of square openings were formed in the imperforate film according to Example 3 using a laser pattern metal processing machine to obtain the alloy film-attached film according to Example 3. The maximum size of the opening was 269 μm and the minimum of a distance between the openings adjacent to each other was 10 μm in plan view. The plurality of openings were formed such that centers thereof made a square lattice in plan view.
A sample according to Example 3 was obtained in the same manner as in Example 1, except that the alloy film-attached film according to Example 3 was used instead of the alloy film-attached film according to Example 1 and an acrylic resin layer B obtained by shaping an acrylic resin having a relative permittivity of 2.6 to a thickness of 630 μm was used instead of the acrylic resin layer A.
An imperforate film according to Example 4 was formed on a PET film and an alloy film-attached film according to Example 4 was obtained in the same manner as in Example 1, except for the following. A ratio of discharge power in the discharging involving the Si (silicon) target material to discharge power in the discharging involving the Al (aluminum) target material was adjusted in the DC magnetron sputtering so that the material of the imperforate film according to Example 4 would have a specific resistance of 5.0×10−4 Ω·cm. DC magnetron sputtering conditions were also adjusted so that the alloy film of the alloy film-attached film according to Example 4 would have a thickness of 25 nm. A plurality of square openings were formed in the imperforate film according to Example 4 using a laser pattern metal processing machine to obtain the alloy film-attached film according to Example 4. The maximum size of the opening was 35 μm and the minimum of a distance between the openings adjacent to each other was 10 μm in plan view. The plurality of openings were formed such that centers thereof made a square lattice in plan view.
, A sample according to Example 4 was obtained in the same manner as in Example 1, except that the alloy film-attached film according to Example 4 was used instead of the alloy film-attached film according to Example 1 and an acrylic resin layer C obtained by shaping an acrylic resin having a relative permittivity of 2.6 to a thickness of 605 μm was used instead of the acrylic resin layer A.
An imperforate film according to Example 5 was formed on a PET film in the same manner as in Example 1. A plurality of square openings were formed in the imperforate film according to Example 5 using a laser pattern metal processing machine to obtain the alloy film-attached film according to Example 5. The maximum size of the opening was 14 μm and the minimum of a distance between the openings adjacent to each other was 1 μm in plan view. The plurality of openings were formed such that centers thereof made a square lattice in plan view.
A sample according to Example 5 was obtained in the same manner as in Example 1, except that the alloy film-attached film according to Example 5 was used instead of the alloy film-attached film according to Example 1 and an acrylic resin layer C was used instead of the acrylic resin layer A.
An imperforate film according to Example 6 was formed on a PET film and an alloy film-attached film according to Example 6 was obtained in the same manner as in Example 1, except for the following. A ratio of discharge power in the discharging involving the Si (silicon) target material to discharge power in the discharging involving the Al (aluminum) target material was adjusted in the DC magnetron sputtering so that the material of the imperforate film according to Example 6 would have a specific resistance of 7.8×10−5 Ω·cm. DC magnetron sputtering conditions were also adjusted so that the alloy film of the alloy film-attached film according to Example 4 would have a thickness of 25 nm. A plurality of square openings were formed in the imperforate film according to Example 6 using a laser pattern metal processing machine to obtain the alloy film-attached film according to Example 6. The maximum size of the opening was 707 μm and the minimum of a distance between the openings adjacent to each other was 50 μm in plan view. The plurality of openings were formed such that centers thereof made a square lattice in plan view.
A sample according to Example 6 was obtained in the same manner as in Example 1, except that the alloy film-attached film according to Example 6 was used instead of the alloy film-attached film according to Example 1 and an acrylic resin layer D obtained by shaping an acrylic resin having a relative permittivity of 2.6 to a thickness of 650 μm was used instead of the acrylic resin layer A.
An imperforate film according to Example 7 was formed on a PET film in the same manner as in Example 1. A plurality of square openings were formed in the imperforate film according to Example 7 using a laser pattern metal processing machine to obtain the alloy film-attached film according to Example 7. The maximum size of the opening was 3536 μm and the minimum of a distance between the openings adjacent to each other was 250 μm in plan view. The plurality of openings were formed such that centers thereof made a square lattice in plan view.
An acrylic resin having a relative permittivity of 2.6 was shaped to a thickness of 18500 μm to obtain an acrylic resin layer E. A sample according to Example 7 was obtained in the same manner as in Example 1, except that the alloy film-attached film according to Example 7 was used instead of the alloy film-attached film according to Example 1 and the acrylic resin layer E was used instead of the acrylic resin layer A.
An imperforate film according to Example 10 was formed on a PET film and an alloy film-attached film according to Example 10 was obtained in the same manner as in Example 1, except for the following. A ratio of discharge power in the discharging involving the Si (silicon) target material to discharge power in the discharging involving the Ai (aluminum) target material was adjusted in the DC magnetron sputtering so that the material of the imperforate film according to Example 10 would have a specific resistance of 1.0×10−5 Ω·cm. DC magnetron sputtering conditions were also adjusted so that the alloy film of the alloy film-attached film according to Example 10 would have a thickness of 25 nm. A plurality of square openings were formed in the imperforate film according to Example 10 using a laser pattern metal processing machine to obtain the alloy film-attached film according to Example 10. The maximum size of the opening was 47192 μm and the minimum of a distance between the openings adjacent to each other was 640 μm in plan view. The plurality of openings were formed such that centers thereof made a square lattice in plan view.
An acrylic resin having a relative permittivity of 2.6 was shaped to a thickness of 51300 μm to obtain art acrylic resin layer F. A sample according to Example 8 was obtained in the same manner as in Example 1, except that the alloy film-attached film according to Example 8 was used instead of the alloy film-attached film according to Example 1 and the acrylic resin layer F was used instead of the acrylic resin layer A.
An imperforate film according to Comparative Example 1 was formed on a PET film and an alloy film-attached film according to Comparative Example 1 was obtained in the same manner as in Example 1, except for the following. A ratio of discharge power in the discharging involving the Si (silicon) target material to discharge power in the discharging involving the Al (aluminum) target material was adjusted in the DC magnetron sputtering so that the material of the imperforate film according to Comparative Example 1 would have a specific resistance of 1.0×10−3 Ω·cm. DC magnetron sputtering conditions were also adjusted so that the alloy film of the alloy film-attached film according to Comparative Example 1 would have a thickness of 25 nm. A plurality of square openings were formed in the imperforate film according to Comparative Example 1 using a laser pattern metal processing machine to obtain the alloy film-attached film according to Comparative Example 1. The maximum size of the opening was 1.4 μm and the minimum of a distance between the openings adjacent to each other was 10 μm in plan view. The plurality of openings were formed such that centers thereof made a square lattice in plan view.
A sample according to Comparative Example 1 was obtained in the same manner as in Example 1, except that the alloy film-attached film according to Comparative Example 1 was used instead of the alloy film-attached film according to Example 1.
An imperforate film according to Comparative Example 1 was formed on a PET film and an alloy film-attached film according to Comparative Example 1 was obtained in the same manner as in Example 1, except for the following. A ratio of discharge power in the discharging involving the Si (silicon) target material to discharge power in the discharging involving the Al (aluminum) target material was adjusted in the DC magnetron sputtering so that the material of the imperforate film according to Comparative Example 1 would have a specific resistance of 1.0×10−6 Ω·cm. DC magnetron sputtering conditions were also adjusted so that the alloy film of the alloy film-attached film according to Comparative Example 1 would have a thickness of 25 nm. A plurality of square openings were formed in the imperforate film according to Comparative Example 1 using a laser pattern metal processing machine to obtain the alloy film-attached film according to Comparative Example 1. The maximum size of the opening was 707 μm and the minimum of a distance between the openings adjacent to each other was 10 μm in plan view. The plurality of openings were formed such that centers thereof made a square lattice in plan view.
A sample according to Comparative Example 2 was obtained in the same manner as in Example 1, except that the alloy film-attached film according to Comparative Example 2 was used instead of the alloy film-attached film according to Example 1.
As shown in Table 1, the samples according to Examples 1 to 8 exhibited high absorption performance for the radio waves having the given frequencies, which reveals that desirable impedance matching is performed by means of the alloy films of the alloy film-attached films according to Examples. On the other hand, it is hard to say that the samples according to Comparative Examples 1 and 2 exhibited high absorption performance for the radio waves having the given frequencies, which indicates that it is hard to perform impedance matching by means of the alloy films of the alloy film-attached films according to Comparative Examples. These indicate that the pit value of the alloy film within the predetermined value range is advantageous in terms of impedance matching. The alloy films of the alloy film-attached films according to Examples had high opening proportion and transparency.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2019-167057 | Sep 2019 | JP | national |
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2020/031879 | 8/24/2020 | WO |
