Generally, the invention relates to electrical connectors. More particularly, the invention relates to improved impedance interfaces for electrical connectors.
Electrical connectors can experience an impedance drop near the mating interface area of the connector. A side view of an example embodiment of an electrical connector is shown in
As shown, the differential impedance is about 100 ohms throughout most of the signal path. At the interface between the header connector and receptacle connector, however, there is a drop from the nominal standard of approximately 100 Ω, to an impedance of about 93/94 Ω. Though the data shown in the plot of
Additionally, there may be times when matching the impedance in a connector with the impedance of a device is necessary to prevent signal reflection, a problem generally magnified at higher data rates. Such matching may benefit from a slight reduction or increase in the impedance of a connector. Such fine-tuning of impedance in a conductor is a difficult task, usually requiring a change in the form or amount of dielectric material of the connector housing. Therefore, there is also a need for an electrical connector that provides for fine-tuning of connector impedance.
The invention provides for improved performance by adjusting impedance in the mating interface area. Such an improvement may be realized by moving and/or rotating the contacts in or out of alignment. Impedance may be minimized (and capacitance maximized) by aligning the edges of the contacts. Lowering capacitance, by moving the contacts out of alignment, for example, may increase impedance. The invention provides an approach for adjusting impedance, in a controlled manner, to a target impedance level. Thus, the invention provides for improved data flow through high-speed (e.g., >10 Gb/s) connectors.
As shown, the IMLAs are arranged such that contact sets 206 form contact columns, though it should be understood that the IMLAs could be arranged such that the contact sets are contact rows. Also, though the header connector 200 is depicted with 150 contacts (i.e., 10 IMLAs with 15 contacts per IMLA), it should be understood that an IMLA may include any desired number of contacts and a connector may include any number of IMLAs. For example, IMLAs having 12 or 9 electrical contacts are also contemplated. A connector according to the invention, therefore, may include any number of contacts.
The header connector 200 includes an electrically insulating IMLA frame 208 through which the contacts extend. Preferably, each IMLA frame 208 is made of a dielectric material such as a plastic. According to an aspect of the invention, the IMLA frame 208 is constructed from as little material as possible. Otherwise, the connector is air-filled. That is, the contacts may be insulated from one another using air as a second dielectric. The use of air provides for a decrease in crosstalk and for a low-weight connector (as compared to a connector that uses a heavier dielectric material throughout).
The contacts 204 include terminal ends 210 for engagement with a circuit board. Preferably, the terminal ends are compliant terminal ends, though it should be understood that the terminals ends could be press-fit or any surface-mount or through-mount terminal ends. The contacts also include mating ends 212 for engagement with complementary receptacle contacts (described below in connection with
As shown in
The header connector may be devoid of any internal shielding. That is, the header connector may be devoid of any shield plates, for example, between adjacent contact sets. A connector according to the invention may be devoid of such internal shielding even for high-speed, high-frequency, fast rise-time signaling.
Though the header connector 200 depicted in
Each receptacle contact 224 has a mating end 230, for receiving a mating end 212 of a complementary header contact 204, and a terminal end 232 for engagement with a circuit board. Preferably, the terminal ends 232 are compliant terminal ends, though it should be understood that the terminals ends could be press-fit, balls, or any surface-mount or through-mount terminal ends. A housing 234 is also preferably provided to position and retain the IMLAs relative to one another.
According to an aspect of the invention, the receptacle connector may also be devoid of any internal shielding. That is, the receptacle connector may be devoid of any shield plates, for example, between adjacent contact sets.
Each blade contact 504 extends through a respective IMLA 506. Contacts 504 in adjacent IMLAs may be separated from one another by a distance D′. Blade contacts 504 may be received in respective receptacle contacts 524 to provide electrical connection between the blade contacts 504 and respective receptacle contacts 524. As shown, a terminal portion 836 of blade contact 504 may be received by a pair of beam portions 839 of a receptacle contact 524. Each beam portion 839 may include a contact interface portion 841 that makes electrical contact with the terminal portion 836 of the blade contact 504. Preferably, the beam portions 839 are sized and shaped to provide contact between the blades 836 and the contact interfaces 841 over a combined surface area that is sufficient to maintain the electrical characteristics of the connector during mating and unmating of the connector.
As shown in
Though a connector having a contact arrangement such as shown in
Impedance drop may be minimized by moving edges of contacts out of alignment; that is, offsetting the contacts by an offset equal to the contact thickness t. In an example embodiment, t may be approximately 0.2-0.5 mm. Though the contacts depicted in
Preferably, the contacts are arranged such that each contact column is disposed in a respective IMLA. Accordingly, the contacts may be made to jog away from a contact column centerline a (which may or may not be collinear with the centerline of the IMLA). Preferably, the contacts are “misaligned,”as shown in
The ground contact G1 may be aligned with the signal contact S1 in the first direction. The ground contact G1 and the signal contact S1 may be offset in a second direction relative to a centerline a of the contact set. That is, the ground contact G1 and the signal contact S1 may be offset in a direction orthogonal to the first direction along which the contact set extends. Likewise, the ground contact G2 and the signal contact S2 may be aligned with each other and may be offset in a third direction relative to the centerline a of the contact set. The third direction may be orthogonal to the direction in which the contact column extends (i.e., the first direction) and opposite the second direction in which the ground contact G1 and the signal contact S1 may be offset relative to the centerline a. Thus as shown in
Impedance may be adjusted by offsetting contacts relative to each other such that, for example, a corner C1 of the signal contact S1 is aligned with a corner C2 of the signal contact S2. Thus the signal contact S1 (and its adjacent ground contact G1) is offset from the signal contact S2 (and its adjacent ground contact G2) in the second direction by the contact thickness t. In an example embodiment, t may be approximately 2.1 mm. Though the contacts in
The contacts may be arranged such that each contact column is disposed in a respective IMLA. Accordingly, the contacts may be made to jog away from a contact column centerline a (which may or may not be collinear with the centerline of the IMLA). The contacts offset in the mating interface region may extend through the connector such that the terminal ends that mate with a substrate, such as a PCB, or another connector are aligned, that is, not offset.
The ground contact G1 and the signal contact S1 may be aligned with each other and may be offset a distance O2 in a second direction relative to a centerline a of the contact column. The second direction may be orthogonal to the first direction along which the contact column extends. The ground contact G2 and the signal contact S2 may be aligned with each other and may be offset a distance O3 relative to the centerline a. The ground contact G2 and the signal contact S2 may be offset in a third direction that may be orthogonal to the first direction along which the contact column extends and may also be opposite the second direction. The distance O2 may be less than, equal to, or greater than the distance O3. Thus as shown in
The ground contact G1 and the signal contact S1 may be spaced apart in the first direction by a distance d1. The ground contact G2 and the signal contact S2 may be spaced apart by a distance d3 in the first direction. Portions of the signal contacts S1, S2 may “overlap” a distance d2 in the first direction in which the contact column extends. That is, a portion having a length of d2 of the signal contact S1 may be adjacent, in the second direction (i.e., orthogonal to the first direction of the contact column), to a corresponding portion of the signal contact S2. The distance d1 may be less than, equal to, or greater than the distance d3. The distance d2 may be less than, equal to, or greater than the distance d1 and the distance d3 All distances d1, d2, d3 may be chosen to achieve a desired impedance. Additionally, impedance may be adjusted by altering the offset distances O2, O3 that the contacts are offset relative to each other in a direction orthogonal to the direction in which the contact column extends (i.e., the first direction).
The contacts of
The ground contact G1 and the signal contact S1 may be offset a distance O4 in a second direction relative to a centerline a of the contact (e.g., in a direction perpendicular to the direction along which the contact set extends). The ground contact G2 and the signal contact S2 may be offset the distance O5 in a third direction relative to the centerline a of the contact set (e.g., in a direction opposite the second direction). Thus, for example, the ground contact G1 and the signal contact S1 may be offset the distance O4 to the right of the centerline a, and the ground contact G2 and the signal contact S2 may be offset the distance O5 to the left of the centerline a. The distance O4 may be less than, equal to, or greater than the distance O5. Thus as shown in
The ground contact G1 and the signal contact S1 may be spaced apart in the first direction (i.e., in the direction in which the contact column extends) by a distance d3. The ground contact G2 and the signal contact S2 may be spaced apart by the distance d5 in the first direction. The distance d3 may be less than, equal to, or greater than the distance d5. Portions of the signal contacts S1, S2 may “overlap” a distance d4 in the first direction. That is, a portion of the signal contact S1 may be adjacent to a portion of the signal contact S2 in the second direction (i.e., in a direction orthogonal to the first direction). Likewise, a portion of the signal contact S1 may be adjacent to a portion of the ground contact G2 in the second direction. The signal contact S1 may “overlap” the ground contact G2 a distance d6 or any other distance. That is, a portion of the signal contact S1 having a length of d6 may be adjacent to a corresponding portion of the ground contact G2. The distance d6 may be less than, equal to, or greater than the distance d4, and distances d3, d4, d5, d6 may be chosen to achieve a desired impedance. Impedance also may be adjusted by altering the offset distances O4, O5 that contacts are offset relative to each other in a direction orthogonal to the direction in which the contact column extends.
The contacts of
Preferably, the contacts are arranged such that each contact column is disposed in a respective IMLA. Preferably, the contacts are rotated or twisted only in the mating interface region. That is, the contacts preferably extend through the connector such that the terminal ends that mate with a board or another connector are not rotated.
As shown, each contact set extends generally along a first direction (e.g., along centerline a, as shown), thus forming a contact column, for example, as shown, or a contact row. Each contact may be rotated or twisted such that it forms a respective angle θ with the contact column centerline a in the mating interface region. In an example embodiment, the angle θ may be approximately 10°. The differential impedance in a connector with such a configuration may be approximately 104.2 Ω, or 4.8 Ω less than in a connector in which the contacts are not rotated, as shown in
It should be understood that the angle to which the contacts are rotated may be chosen to achieve a desired impedance level. Further, though the angles depicted in
Additionally, each contact may be rotated or twisted in the mating interface region such that it forms a respective angle θ with the contact column centerline. Adjacent contacts may be rotated in opposing directions, and all contacts form the same (absolute) angle with the centerline, which may be 10°, for example. The differential impedance in a connector with such a configuration may be approximately 114.8 Ω.
In the embodiment shown in
Also, it is known that decreasing impedance (by rotating contacts as shown in
It should be understood that even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, the disclosure is illustrative only and changes may be made in detail within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which appended claims are expressed. For example, the dimensions of the contacts and contact configurations in
The subject matter disclosed herein is a continuation-in-part of U.S. patent application Ser. No. 10/946,874, entitled “Improved Impedance Mating Interface For Electrical Connectors,” which claims benefit under 35 U.S.C. § 119(e) of provisional U.S. patent application No. 60/506,427, filed Sep. 26, 2003, entitled “Improved Impedance Mating Interface For Electrical Connectors.” The subject matter disclosed herein is related to the subject matter disclosed and claimed in U.S. patent application Ser. No. 10/634,547, filed Aug. 5, 2003, entitled “Electrical connectors having contacts that may be selectively designated as either signal or ground contacts,” and in U.S. patent application Ser. No. 10/294,966, filed Nov. 14, 2002, which is a continuation-in-part of U.S. patent application Ser. No. 09/990,794, filed Nov. 14, 2001, now U.S. Pat. No. 6,692,272, and Ser. No. 10/155,786, filed May 24, 2002, now U.S. Pat. No. 6,652,318. The disclosure of each of the above-referenced U.S. patents and patent applications is herein incorporated by reference in its entirety.
Number | Name | Date | Kind |
---|---|---|---|
3286220 | Marley et al. | Nov 1966 | A |
3538486 | Shlesinger, Jr. | Nov 1970 | A |
3669054 | Desso et al. | Jun 1972 | A |
3748633 | Lundergan | Jul 1973 | A |
4076362 | Ichimura | Feb 1978 | A |
4159861 | Anhalt | Jul 1979 | A |
4260212 | Ritchie et al. | Apr 1981 | A |
4288139 | Cobaugh et al. | Sep 1981 | A |
4383724 | Verhoevan | May 1983 | A |
4402563 | Sinclair | Sep 1983 | A |
4560222 | Dambach | Dec 1985 | A |
4717360 | Czaja | Jan 1988 | A |
4776803 | Pretchel et al. | Oct 1988 | A |
4815987 | Kawano et al. | Mar 1989 | A |
4867713 | Ozu et al. | Sep 1989 | A |
4907990 | Bertho et al. | Mar 1990 | A |
4913664 | Dixon et al. | Apr 1990 | A |
4973271 | Ishizuka et al. | Nov 1990 | A |
5066236 | Broeksteeg | Nov 1991 | A |
5077893 | Mosquera et al. | Jan 1992 | A |
5163849 | Fogg et al. | Nov 1992 | A |
5167528 | Nishiyama et al. | Dec 1992 | A |
5174770 | Sasaki et al. | Dec 1992 | A |
5238414 | Yaegashi et al. | Aug 1993 | A |
5254012 | Wang | Oct 1993 | A |
5274918 | Reed | Jan 1994 | A |
5277624 | Champion et al. | Jan 1994 | A |
5286212 | Broekstagg | Feb 1994 | A |
5302135 | Lee | Apr 1994 | A |
5342211 | Broekstagg | Aug 1994 | A |
5356300 | Costello et al. | Oct 1994 | A |
5356301 | Champion et al. | Oct 1994 | A |
5357050 | Baran et al. | Oct 1994 | A |
5431578 | Wayne | Jul 1995 | A |
5475922 | Tamura et al. | Dec 1995 | A |
5558542 | O'Sullivan et al. | Sep 1996 | A |
5586914 | Foster, Jr. et al. | Dec 1996 | A |
5590463 | Feldman et al. | Jan 1997 | A |
5609502 | Thumma | Mar 1997 | A |
5713746 | Olson et al. | Feb 1998 | A |
5730609 | Harwath | Mar 1998 | A |
5741144 | Elco et al. | Apr 1998 | A |
5741161 | Cahaly et al. | Apr 1998 | A |
5795191 | Preputnick et al. | Aug 1998 | A |
5817973 | Elco et al. | Oct 1998 | A |
5853797 | Fuchs et al. | Dec 1998 | A |
5908333 | Perino et al. | Jun 1999 | A |
5961355 | Morlion et al. | Oct 1999 | A |
5967844 | Doutrich et al. | Oct 1999 | A |
5971817 | Longueville | Oct 1999 | A |
5980321 | Cohen et al. | Nov 1999 | A |
5993259 | Stokoe et al. | Nov 1999 | A |
6050862 | Ishii | Apr 2000 | A |
6068520 | Winings et al. | May 2000 | A |
6116926 | Ortega et al. | Sep 2000 | A |
6116965 | Arnett et al. | Sep 2000 | A |
6123554 | Ortega et al. | Sep 2000 | A |
6125535 | Chiou et al. | Oct 2000 | A |
6129592 | Mickievicz et al. | Oct 2000 | A |
6139336 | Olson | Oct 2000 | A |
6146157 | Lenoir et al. | Nov 2000 | A |
6146203 | Elco et al. | Nov 2000 | A |
6171115 | Mickievicz et al. | Jan 2001 | B1 |
6171149 | Van Zanten | Jan 2001 | B1 |
6190213 | Reichart et al. | Feb 2001 | B1 |
6212755 | Shimada et al. | Apr 2001 | B1 |
6219913 | Uchiyama | Apr 2001 | B1 |
6220896 | Bertoncini et al. | Apr 2001 | B1 |
6227882 | Ortega et al. | May 2001 | B1 |
6267604 | Mickievicz et al. | Jul 2001 | B1 |
6269539 | Takahashi et al. | Aug 2001 | B1 |
6280209 | Bassler et al. | Aug 2001 | B1 |
6293827 | Stokoe et al. | Sep 2001 | B1 |
6319075 | Clark et al. | Nov 2001 | B1 |
6322379 | Ortega et al. | Nov 2001 | B1 |
6322393 | Doutrich et al. | Nov 2001 | B1 |
6328602 | Yamasaki et al. | Dec 2001 | B1 |
6343955 | Billman et al. | Feb 2002 | B2 |
6347952 | Hasegawa et al. | Feb 2002 | B1 |
6350134 | Fogg et al. | Feb 2002 | B1 |
6354877 | Shuey et al. | Mar 2002 | B1 |
6358061 | Regnier | Mar 2002 | B1 |
6361366 | Shuey et al. | Mar 2002 | B1 |
6363607 | Chen et al. | Apr 2002 | B1 |
6364710 | Billman et al. | Apr 2002 | B1 |
6371773 | Crofoot et al. | Apr 2002 | B1 |
6375478 | Kikuchi | Apr 2002 | B1 |
6379188 | Cohen et al. | Apr 2002 | B1 |
6386914 | Collins et al. | May 2002 | B1 |
6409543 | Astbury, Jr. et al. | Jun 2002 | B1 |
6431914 | Billman | Aug 2002 | B1 |
6435914 | Billman | Aug 2002 | B1 |
6461202 | Kline | Oct 2002 | B2 |
6471548 | Bertoncini et al. | Oct 2002 | B2 |
6482038 | Olson | Nov 2002 | B2 |
6485330 | Doutrich | Nov 2002 | B1 |
6494734 | Shuey | Dec 2002 | B1 |
6506081 | Blanchfield et al. | Jan 2003 | B2 |
6520803 | Dunn | Feb 2003 | B1 |
6527587 | Ortega et al. | Mar 2003 | B1 |
6537111 | Brammer et al. | Mar 2003 | B2 |
6540559 | Kemmick et al. | Apr 2003 | B1 |
6547066 | Koch | Apr 2003 | B2 |
6554647 | Cohen et al. | Apr 2003 | B1 |
6572410 | Volstorf et al. | Jun 2003 | B1 |
6652318 | Winings et al. | Nov 2003 | B1 |
6692272 | Lemke et al. | Feb 2004 | B2 |
6695627 | Ortega et al. | Feb 2004 | B2 |
6764341 | Lappoehn | Jul 2004 | B2 |
6776649 | Pape et al. | Aug 2004 | B2 |
6805278 | Olson et al. | Oct 2004 | B1 |
6808399 | Rothermel et al. | Oct 2004 | B2 |
6824391 | Mickievicz et al. | Nov 2004 | B2 |
6843686 | Ohnishi et al. | Jan 2005 | B2 |
6848944 | Evans | Feb 2005 | B2 |
6851974 | Doutrich | Feb 2005 | B2 |
6869292 | Johnescu et al. | Mar 2005 | B2 |
6890214 | Brown et al. | May 2005 | B2 |
6913490 | Whiteman, Jr. et al. | Jul 2005 | B2 |
6932649 | Rothermel et al. | Aug 2005 | B1 |
6945796 | Bassler et al. | Sep 2005 | B2 |
6953351 | Fromm et al. | Oct 2005 | B2 |
6969280 | Chien et al. | Nov 2005 | B2 |
6976886 | Winings et al. | Dec 2005 | B2 |
6981883 | Raistrick et al. | Jan 2006 | B2 |
6994569 | Minich et al. | Feb 2006 | B2 |
7097506 | Nakada | Aug 2006 | B2 |
7131870 | Whiteman, Jr. et al. | Nov 2006 | B2 |
20020098727 | McNamara et al. | Jul 2002 | A1 |
20020106930 | Pape et al. | Aug 2002 | A1 |
20030143894 | Kline et al. | Jul 2003 | A1 |
20030171010 | Wining et al. | Sep 2003 | A1 |
20030203665 | Ohnishi et al. | Oct 2003 | A1 |
20030220021 | Whiteman, Jr. et al. | Nov 2003 | A1 |
20050009402 | Chien et al. | Jan 2005 | A1 |
20050118869 | Evans | Jun 2005 | A1 |
20060014433 | Consoli et al. | Jan 2006 | A1 |
20060046526 | Minich | Mar 2006 | A1 |
Number | Date | Country |
---|---|---|
0 273 683 | Jul 1988 | EP |
0 891 016 | Oct 2002 | EP |
1 148 587 | Apr 2005 | EP |
06-236788 | Aug 1994 | JP |
07-114958 | May 1995 | JP |
11-185 886 | Jul 1999 | JP |
2000-003743 | Jan 2000 | JP |
2000-003744 | Jan 2000 | JP |
2000-003745 | Jan 2000 | JP |
2000-003746 | Jan 2000 | JP |
WO 9016093 | Dec 1990 | WO |
WO 0129931 | Apr 2001 | WO |
WO 0139332 | May 2001 | WO |
WO 02101882 | Dec 2002 | WO |
Number | Date | Country | |
---|---|---|---|
20060068641 A1 | Mar 2006 | US |
Number | Date | Country | |
---|---|---|---|
60506427 | Sep 2003 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 10946874 | Sep 2004 | US |
Child | 11229778 | US |