Patent Application
20080255647
Pacing leads implanted in vessels in the body are, for many applications, flexible cylindrical devices. They are cylindrical due to three main reasons: most anatomical are cylindrical, medical sealing and access devices seal on cylindrical shapes and cylindrical leads have uniform bending moments of inertia around the long axis of the device. The cylindrical nature of the device necessitates the cylindrical design of pacing electrodes on the body of the device.
Due to the tortuous nature of the vessels in the body, following implantation the rotational orientation of one electrode can not be predetermined in many currently employed devices. As such, many currently employed lead devices employ cylindrical electrode designs that are conductive to tissue around the entirety of the diameter of the lead. This insures that some portion of the cylindrical electrode contacts excitable tissue when they are implanted. Despite the multiple devices in which cylindrical continuous ring electrodes are employed, there are disadvantages to such structures, including but not limited to: undesirable excitation of non-target tissue, e.g., which can cause unwanted side effects, increased power use, etc.
Implantable addressable segmented electrode devices, as well as methods for making and using the same, are provided. The subject devices include segmented electrode structures made up of an integrated circuit electrically coupled to two or more electrodes, where each electrode can be individually activated. Also provided are implantable devices and systems, as well as kits containing such devices and systems or components thereof, which include the segmented electrode structures.
Aspects of the invention include electrodes that are segmented, e.g., to provide better current distribution in the tissue/organ to be stimulated. In such embodiments, the segmented electrodes are able to pace and sense independently with the use of a integrated circuit (IC) in the lead, such as a multiplexing circuit, e.g., as disclosed in PCT Application No. PCT/US2005/______ titled “Methods and Apparatus for Tissue Activation and Monitoring” and filed on Sep. 1, 2005; the disclosure of which is herein incorporated by reference. The IC allows each electrode to be addressed individually, such that each may be activated individually, or in combinations with other electrodes on the medical device. In addition, they can be used to pace in new and novel combinations with the aid of the multiplexing circuits on the IC.
Aspects of the invention include embodiments in which the components are configured in a manner that minimizes mechanical stress between the components, e.g., the integrated circuit, electrodes and/or elongated conductive members. Stress minimization may be achieved in a number of different ways, e.g., by providing flexible connectors, flexible electrode designs, shaped integrated circuits, coiled conductive connectors, etc., as developed in greater detail below. Embodiments of the IC chip configurations support fatigue resistant designs for biomedical electrodes, as may be found in cardiac pacing leads or other permanently implantable or acute use devices.
In certain embodiments of the present invention, the IC chip is connected to a pacemaker with one or more, e.g., two, conductive members. The advantage of this design configuration is the reduction in the number of conductors that are required in the medical device. Prior to this invention multiple electrodes in permanently implantable leads required multiple conductors. Size and reliability have limited the number of possible discrete conductors to 2-3 max in about 9 French diameter leads with smaller diameter medical devices (e.g., 4-5 French) limited to 2 conductors.
Aspects of the invention include implantable addressable segmented electrode structures that include: an integrated circuit; and two or more electrodes coupled to the integrated circuit, wherein each of the electrodes is individually addressable. In certain embodiments, the integrated circuit is electrically coupled to at least one elongated conductive member, e.g., present in a medical carrier, where the integrated circuit may be electrically coupled to a single elongated conductive member or to two or more elongated conductive members. In certain embodiments, the integrated circuit is less than about 20 mm, such as less than about 1 mm from the electrodes. In certain embodiments, the integrated circuit comprises the electrodes. In certain embodiments, the electrodes are circumferentially arranged around the integrated circuit. In certain embodiments, the electrodes are substantially aligned. In certain embodiments, the electrodes are staggered. In certain embodiments, the structure includes electrodes that are interdigitated. In certain embodiments, the structure includes electrodes of at least two different sizes. In certain embodiments, the structure includes electrodes of about the same size. In certain embodiments, the structure includes four electrodes. In certain embodiments, the structure includes three electrodes. In certain embodiments, the structure is dimensioned to fit within an implant. In certain embodiments, the structure includes is dimensioned to fit within a lead. In certain embodiments, each electrode has a surface area ranging from about 0.1 mm2 to about 15 mm2, e.g., from about 0.5 mm2 to about 10 mm2, such as about 1.3 mm2. In certain embodiments, integrated circuit, electrodes and at least one elongated conductive member are electrically coupled to each other in a manner that imparts fatigue resistance to said lead assembly, where in certain embodiments at least two of the integrated circuit, electrodes and elongated conductive member are electrically coupled to each other in a manner that minimizes mechanical stress on the structure. In certain embodiments, at least two of the integrated circuit, electrodes and elongated conductive member are conductively connected to each other by a flexible conductive member. In certain embodiments, at least two of the integrated circuit, electrodes and elongated conductive member are conductively connected to each other by a liquid member. In certain embodiments, at least two of the integrated circuit, electrodes and elongated conductive member are conductively connected to each other by a coil conductive member. In certain embodiments, at least two of the integrated circuit, electrodes and elongated conductive member are conductively connected to each other by a spherical conductive member. In certain embodiments, the electrodes have a curved configuration. In certain embodiments, electrodes are flexible. In certain embodiments, electrodes comprises one or more hairpin turns. In certain embodiments, electrodes have a helical configuration. In certain embodiments, the integrated circuit comprises at least one through hole. In certain embodiments, the integrated circuit includes at least two through holes. In certain embodiments, the integrated circuit has a non-rectangular configuration, e.g., a curvilinear configuration, such as a disc-shaped. In certain embodiments, the integrated circuit is a hermetically sealed integrated circuit, e.g., that includes: an in vivo corrosion resistant integrated circuit holder having at least one feedthrough; at least one integrated circuit present in said holder; and a sealing layer; wherein the sealing layer and holder are configured to define a hermetically sealed volume in which the at least one integrated circuit is present. In certain embodiments, the structure is present in an implant or a lead, e.g., that has a circular, oval, flattened, or other shaped cross-section. In certain embodiments, the lead is a cardiac pacing lead. In certain embodiments, elongated conductive member is electrically coupled to at least one control unit, e.g., that is present in a pacemaker can.
Aspects of the invention further include implantable medical devices that include at least one implantable addressable segmented electrode structure of the invention, e.g., present in an implant or a lead, such as a cardiovascular lead, a left ventricular lead or an epicardial lead. In certain embodiments, the device is a neurological device, a muscular device, a gastrointestinal device, a skeletal device, a pulmonary device, an opthalmic device or an auditory device. In certain embodiments, the structure is electrically coupled to at least one elongated conductive member, e.g., that is electrically coupled to a control unit, e.g., that is present in a pacemaker can. In certain embodiments, the device is a cardiovascular pacing device.
Aspects of the invention further include methods of implanting an implantable medical device according to the invention into a subject; and using the addressable segmented electrode structure of the implanted medical device, e.g., to deliver electrical energy to the subject. In certain embodiments, at least a first of the electrodes is connected to a first conductive member and a second of said electrodes is connected to a second conductive member. In certain embodiments, the method includes not activating at least one of the electrodes, such as activating only one of said electrodes. In certain embodiments, the method further includes determining which of the electrodes to activate. In certain embodiments, the method further includes sequentially activating the electrodes. In certain embodiments, the method includes minimizing power consumption. In certain embodiments, the method includes activating the electrodes in manner sufficient to not stimulate the phrenic nerve. In certain embodiments, the method includes activating at least one of the electrodes of the structure to sense electrical potential in said subject. In certain embodiments, the method includes sensing conduction velocity.
Aspects of the invention further includes systems and kits that include an implantable addressable segmented electrode structure according to the invention.
As summarized above, aspects of the invention include implantable addressable segmented electrode devices, as well as methods for making and using the same, are provided. Embodiments of the devices include segmented electrode structures made up of an integrated circuit electrically coupled to two or more electrodes, where each electrode can be individually activated. Also provided are implantable devices and systems, as well as kits containing such devices and systems or components thereof, which include the segmented electrode structures. Embodiments of the invention are particularly suited for use in multiplex lead devices, as these embodiments can have appropriate dimensional variety of IC chips and their accompanying electrodes with internal connections, and conductive connections with structures are robust to impart fatigue resistance to the structures.
Before the present invention is described in greater detail, it is to be understood that this invention is not limited to particular embodiments described, as such may vary. It is also to be understood that the terminology used herein is for the purpose of describing particular embodiments only, and is not intended to be limiting, since the scope of the present invention will be limited only by the appended claims.
Where a range of values is provided, it is understood that each intervening value, to the tenth of the unit of the lower limit unless the context clearly dictates otherwise, between the upper and lower limit of that range and any other stated or intervening value in that stated range, is encompassed within the invention. The upper and lower limits of these smaller ranges may independently be included in the smaller ranges and are also encompassed within the invention, subject to any specifically excluded limit in the stated range. Where the stated range includes one or both of the limits, ranges excluding either or both of those included limits are also included in the invention.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Although any methods and materials similar or equivalent to those described herein can also be used in the practice or testing of the present invention, representative illustrative methods and materials are now described.
All publications and patents cited in this specification are herein incorporated by reference as if each individual publication or patent were specifically and individually indicated to be incorporated by reference and are incorporated herein by reference to disclose and describe the methods and/or materials in connection with which the publications are cited. The citation of any publication is for its disclosure prior to the filing date and should not be construed as an admission that the present invention is not entitled to antedate such publication by virtue of prior invention. Further, the dates of publication provided may be different from the actual publication dates which may need to be independently confirmed.
It is noted that, as used herein and in the appended claims, the singular forms “a”, “an”, and “the” include plural referents unless the context clearly dictates otherwise. It is further noted that the claims may be drafted to exclude any optional element. As such, this statement is intended to serve as antecedent basis for use of such exclusive terminology as “solely,” “only” and the like in connection with the recitation of claim elements, or use of a “negative” limitation.
As will be apparent to those of skill in the art upon reading this disclosure, each of the individual embodiments described and illustrated herein has discrete components and features which may be readily separated from or combined with the features of any of the other several embodiments without departing from the scope or spirit of the present invention. Any recited method can be carried out in the order of events recited or in any other order which is logically possible.
In further describing aspects of the invention, aspects of implantable addressable segmented electrodes are reviewed first in greater detail, both generally and in terms of figures of certain embodiments of the invention. Next, embodiments of devices and systems, such as implantable medical devices and systems, that include the segmented electrode structures of the invention are described, as well as methods of using such devices and systems in different applications. Also provided is a description of kits that incorporate aspects of the invention.
As summarized above, aspects of the invention include implantable addressable segmented electrode structures. Embodiments of the structures include an integrated circuit (IC) electrically coupled (so as to provide an electrical connection) to two or more electrodes. The term “integrated circuit” (IC) is used herein to refer to a tiny complex of electronic components and their connections that is produced in or on a small slice of material, i.e., chip, such as a silicon chip. In certain embodiments, the IC is a multiplexing circuit, e.g., as disclosed in PCT Application No. PCT/US2005/______ titled “Methods and Apparatus for Tissue Activation and Monitoring” and filed on Sep. 1, 2005; the disclosure of which is herein incorporated by reference. In the segmented electrode structures, the number of electrodes that is electrically coupled to the IC may vary, where in certain embodiments the number of 2 or more, e.g., 3 or more, 4 or more, etc., and in certain embodiments ranged from 2 to about 20, such as from about 3 to about 8, e.g., from about 4 to about 6. While being electrically coupled to the IC, the different electrodes of the structures are electrically isolated from each other, such that current cannot flow directly from one electrode to the other. As the structures are implantable, that may be placed into a physiological site and maintained for a period of time without substantial, if any, impairment of function. As such, once implanted in or on a body, the structures do not deteriorate in terms of function, e.g., as determined by ability to activate the electrodes of the structure, for a period of at least about 2 or more days, such as at least about 1 week, at least about 4 weeks, at least about 6 months, at least about 1 year or longer, e.g., at least about 5 years or longer. As the electrodes of the subject segmented electrode structures are addressable, they can be individually activated. As such, one can activate certain of the electrodes of the structure while not activating others, e.g., in manner such that electrical stimulation can be delivered from one or more of the electrodes of the structure, but not all of the electrodes in the structure, where in certain embodiments only a single electrode of the structure is activated at any given time. As another example, one can activate one electrode in such a way that it conducts electric potentials from nearby tissue to the electric circuitry. In some embodiments, activate may further comprise electrically connecting an electrode to a conductor, such as a bus conductor, for stimulation, voltage sampling, or other purposes. In certain embodiments, the elongated conductive member is part of a multiplex lead, e.g., as described in Published PCT Application No. WO 2004/052182 and U.S. patent application Ser. No. 10/734,490, the disclosure of which is herein incorporated by reference.
In certain embodiments, the electrodes of the segmented electrode structures are electrically isolated from each other, and may be circumferentially arranged around an IC to which they are conductively coupled. An example of such an embodiment is shown in
In embodiments of the invention, the structures are dimensioned to be placed inside a lead, e.g., cardiovascular lead, epicardial lead, left ventricular lead, etc., or implant. By “dimensioned to be placed inside of a lead or implant” is meant that the structures have a sufficiently small size (i.e., form factor) such that they can be positioned inside of a lead or implant. In certain embodiments, the hermetically sealed structures have a longest dimension, e.g., length, width or height, ranging from about 0.05 mm to about 20 mm, such as from about 0.2 mm to about 5 mm, including from about 0.5 mm to about 2 mm. Accordingly, embodiments of the structures allow the practical development of miniaturized, implantable medical devices for days, months, and even years of practical, reliable use.
In certain embodiments, the segmented electrode structures are electrically coupled to at least one elongated conductor, which elongated conductor may or may not be present in a lead, and may or may not in turn be electrically coupled to a control unit, e.g., that is present in a pacemaker can. In such embodiments, the combination of segmented electrode structure and elongated conductor may be referred to as a lead assembly.
Embodiments of the invention include implantable fatigue resistant structures. In such embodiments, at least the IC and electrode components of the segmented structure, for example, the IC, electrode and conductor components of a lead assembly, are electrically coupled to each other in a manner that imparts fatigue resistance to structure and/or lead assembly that contains the structure. This fatigue resistance ensures that the structures can survive intact (i.e., without substantial, if any, breakage of the connections between the integrated circuit and electrode(s) components of the structure) in an in vivo environment, such as in a physiological environment in which they are in contact with blood, and/or tissue. Because the structures are implantable, the implantable structures are structures that may be positioned in or on a body and function without significant, if any, deterioration (e.g., in the form of breakage of connections, such as determined by function of the segmented electrode structure) for extended periods of time. As such, once implanted, the structures do not deteriorate in terms of function, e.g., as determined by function of an integrated circuit and electrodes coupled thereto of the structure, for a period of at least about 2 or more days, such as at least about 1 week, at least about 4 weeks, at least about 6 months, at least about 1 year or longer, e.g., at least about 5 years or longer.
Aspects of the invention include one or more features that impart fatigue resistance to the subject segmented electrode structures. Fatigue resistance imparting features include, but are not limited to: electrical connections between components, e.g., electrodes, IC, elongated conductive members, that minimize mechanical stress between the connected components. For example, flexible conductive connectors of a variety of different materials and/or configurations are employed in certain embodiments of the invention, as described in greater detail below. In yet other embodiments, liquid conductive connectors of a variety of different materials and/or configurations are employed which provide for a high degree of freedom of movement between connected components, as described in greater detail below. In yet other embodiments, non-bound conductive connectors of a variety of different materials and/or configurations, e.g., rigid spheres, coils/springs, etc., are employed which provide for a high degree of freedom of movement between connected components, as described in greater detail below. In these embodiments, “non-bound” means that the connector is not physically immobilized on a region of the connected component, but is instead capable of moving across a surface of the connected component, at least in some plane, while still maintaining the conductive connection.
In certain embodiments, the IC component of the structures is hermetically sealed, e.g., it is present in a hermetically sealed structure that includes a hermetically sealed volume which houses one or more ICs. Aspects of the invention include hermetically sealed ICs that include: an in vivo corrosion resistant holder having at least one conductive feedthrough; and a sealing layer; where the sealing layer and the holder are configured to define a hermetically sealed volume, e.g., in which one or more ICs is present. Such hermetically sealed structures are further described in copending PCT patent application serial no. PCT/US2005/______ titled “Implantable Hermetically Sealed Structures,” and filed on even date herewith, the disclosure of which is herein incorporated by reference.
The advantages of the present innovation of separately addressable segmented, e.g., quadrant electrodes, are many fold. Because the distribution of electrical potential (e.g., cardiac pacing pulse) can be directed, a great flexibility is provided in clinical applications. For example, by selectively activating one or more of the electrodes of the segmented structure, electrical current can be directed to only that tissue that needs to be excited, thereby avoiding excitation of tissue that is not desired to be excited. This feature provides multiple benefits. For example, in prior art methods, a left ventricular pacing electrode would typically have to be disabled, and the cardiac resynchronization therapy (CRT) intervention terminated, if phrenic nerve capture by the electrode caused the patient to suffer a diaphragmatic spasm with each discharge. By the careful electrode selection to control the directionality of electric current provided by the present invention, capture of the phrenic nerve can often be avoided, while appropriate levels of cardiac stimulation are maintained.
In addition, any given electrode can have a small surface area and still adequately excite the tissue that needs to be excited. For example, electrodes having a surface areas ranging from about 0.1 mm2 to about 4.0 mm2, such as from about 0.5 mm2 to about 3.0 mm2 may be employed. Despite their small surface area, excitation of that tissue that needs to be excited is achieved. When the segments are distributed around the circumference of a pacing lead, excitable tissue will be contacted regardless of the rotational orientation of the device in the vessel. With the reduced surface area of the electrode segments, the impedance is larger than that of a ring electrode of equal axial length thereby reducing the current drain on the pacemaker, which can lead to improved longevity of the device. Experimental data from epicardial left ventricular pacing with a four segment electrode structure have demonstrated an eight-fold difference in capture threshold between those segments that are in contact with cardiac tissue and those which are not. As such, with appropriate segmented electrode configuration, capture threshold differences of ten-fold or more may be achieved. The capture threshold, as defined as the minimum voltage that initiates excitation of the heart tissue, is directly proportional to power consumption of a pacemaker.
The inventive use of separately addressable quadrants on a multiple electrode leads allows a number of other clinical advantages. In many cases, the present invention allows patients who would be non-responsive using prior art devices to become responsive to treatment. For example, multiple potential excitation positions along the lead allows for selection in real time of the most advantageous pacing, without requiring repositioning of the lead. Synergistic use of multiple points of stimulation are also available (simultaneously or sequentially), again without any further lead positioning. Currently available techniques require difficult and often unsuccessful repositioning of the lead when an effective excitation position is not achieved. Because of difficulties in variations of anatomical features, and limitations in time available for repositioning, often results are sub-optimal or poor. Additional advantages include the ability to achieve fine measurement of conduction velocity in different axes.
In addition, in electrical tomography embodiments such as those described in U.S. Provisional Patent Application No. 60/705,900 titled “Electrical Tomography” filed Aug. 5, 2005, the subject structures permit calibration of local electric field gradients to improve accuracy in synchrony quantification and possibly enable absolute measurements (e.g., stroke volume, ejection fraction, etc.). In electrical tomography applications, applied electric fields are distributed in a curvilinear fashion within the body. Knowing the local field gradient in the region of interest (e.g., a cardiac vein overlying the LV) permits absolute determination of the local relationship between electrical distance (gradient) and physical distance.
Embodiments of the segmented electrode structures may include one or more of the above features, or others. In further describing the invention, embodiments of the structures are now reviewed in greater detail in terms of the figures.
As mentioned above,
A configuration of electrodes around the IC according to an embodiment of the invention, which is referred to herein as a quadrant electrode embodiment, is shown in
The materials of construction of the conductive members, e.g., electrodes, for use with the presently described ICs may be primarily platinum, or platinum alloy, including platinum 5% iridium, platinum 10% iridium, or platinum 20% iridium. Additional appropriate platinum alloys include, but are not limited to: platinum 8% tungsten, platinum nickel, and platinum rhodium. The alloy could also be gold tin with gold 20% tin alloy. An additional material for the electrode of the present invention can be titanium. The titanium could be plated with platinum or platinum alloys previously described. Corrosion resistant alloys can also be deposited by RF Sputtering, electron beam vapor deposition, cathodic arc deposition, or chemical vapor deposition, among other methods. In addition to titanium, base electrode materials can include stainless steel, e.g., 316SS, or cobalt based super alloys, e.g., MP35N, or tantalum. The electrode can also be electroformed.
The electrodes may be fabricated from bulk cold-worked alloys. In addition the electrodes can be formed wholly from thin film deposition processes. The electrodes formed from bulk metal or alloys can take advantage of a fine microstructure formed by cold working to the final thickness. Refined microstructures typically increase the yield point of the material and the fatigue life of the material.
Electrodes formed by thin film processes can be made with the same class of materials described previously. The electrodes can also be fabricated as layered structures that exploit different material characteristics for optimum performance. High strength metals or alloys can be deposited for optimum strength as base layer. Additional corrosion resistant layers could be formed above the base layers. The final coatings could be materials that enhance the electrodes ability to transfer charge to tissue or to sense electrical signals. In addition other coatings on the electrode could enable chemical sensing, pH measurements, pressure measurement, or ultrasound detection.
The fabrication process from bulk metals or alloys can be done by any convenient method, such as methods employed for fabrication of cardiovascular stents and other passive mechanical devices. The electrode can be manufactured by laser cutting, Electric Discharge Machining (EDM), photochemical etching, or by stamping and forming or a combinations of those fabrication processes. In addition, that electrode can be chemical etched, or electropolished to produce a smooth surface. Smooth surfaces are desirable for fatigue resistant devices to reduce the number of potential crack initiation sites.
Additionally the electrode can be formed by vacuum deposition of a suitable metal or alloy on a fabric or a polymeric film that would cover the outside surface of the medical device. The sputtered area can then be plated to additional thickness if required. This allows the fabric to perform two functions—first to reinforce the lead from applied mechanical effects and second to provide a flexible substrate for a conductive electrode. This configuration reduces the abrupt change in bending stiffness that results from a change in materials along the length. This conductive area is then connected to the IC chip with a flexible conductive member.
In the present invention, the surface of the conductive member(s), e.g., electrodes, may be different than the bulk material. The surface that is exposed to the blood stream should survive corrosion and electrolytic corrosion that occurs in that environment. In addition the surface should maximize the charge transfer to the tissue for pacing. The surface, in certain embodiment, will optimize sensing of electrical signals. The surface can also provide the ability to sense chemical species or pH changes.
The surface coating may include elements of in the noble metal family including the alloys, oxides and nitrides (platinum, platinum iridium, titanium nitride, and iridium oxide). In addition these materials can increase the micro roughness of the electrode, increasing the microscopic surface area. This improves the capacitive charge transfer ability of the electrode.
Additionally coatings can be applied to the inventive structures to reduce electrolytic corrosion of electrodes when paced outside of the water window. Electrodes in saline solutions can experience various degradation mechanisms when electrically driven at voltages about below −0.6 V or about above 0.8V. These voltages define the water window where outside these ranges water decomposes to H+ or OH−. When these ions are produced they raise or lower the pH. pH changes can cause degradation of the electrode material or material that is in close proximity to the electrode.
pH changes can also cause degradation of tissue when used for electrical pacing. At sufficiently high voltages, Cl− ions can be produced in saline solutions. These ions can form corrosive chemical species. Another degradation mechanism is caused by the production of H+ in alternating current applications. The H+ can be driven back and forth through thin film electrodes causing mechanical destruction of the electrode. This has been observed on thin film Pt electrodes. For electrodes made from Pt and Pt group metals the production of destructive ionic species is increased due to the catalytic nature of Pt. This reduces the usefulness of a material that is very stable in saline solutions due to its nobility.
It is known that S, Ca and select other elements and compounds can “dope” the Pt group metals used in catalytic converters. This is normally considered a detrimental effect. For the use of Pt group materials as electrodes doping to produce a change in the function of the Pt group can be innovatively useful. A doped electrode would continue to retain its noble metal properties of chemical resistance but with the small additions of S or select other element the catalytic nature of the Pt can be reduced.
The innovation of providing doping of the surface or body of the electrode in this manner reduces the generation of H+, OH− and Cl− ions in saline solutions. The reduction of these ionic species reduce the changes in pH in saline solutions near the electrode and the destructive effects of those pH excursions.
The S, Ca or other doping elements can be introduced at the ppm level during the deposition of thin film Pt electrodes. They can also be incorporated into the base alloy during melting for the fabrication of thicker electrodes. They can also be deposited onto the surface by emersion into a fluid.
Embodiments of the invention include the use of flexible conductive connectors between different components. The conductive connectors of these embodiments are flexible in that allow a degree of movement of in least one axis of rotation without breaking. As such, one of the components may move relative to another without the stress being transmitted to the other component, such that the other component does not move. Furthermore, movement of one component does not result in breakage of the conductive connection with the other component. Flexible conductive connections may be provided with a number of different connection configurations, including but not limited to: bonded solid connections, e.g., made of flexible materials; non-bonded solid connections, e.g., ball bearing connections, spring connections; fluid connections, etc.
As reviewed above, embodiments of the invention further include the use of electrode configurations, e.g., that impart flexibility to the electrodes minimize mechanical stress between the electrode and the integrated circuit. Electrode design configurations of interest include, but are not limited to: curved electrodes, bent electrodes, segmented electrodes, helical electrodes, and the like.
Embodiments of the invention further include the use of shaped ICs, where these shaped-chips have a non-rectangular configuration, e.g., a curvilinear configuration, such as a disc configuration. Aspects of these embodiments include the presence of one or more holes in the middle of the chips, e.g., which provide through ways for conductive members. Aspects of these embodiments further include electrodes that are directly bonded to the edges of the chips.
One representation of the flexible shape for the electrodes is shown in
An additional advantage of this inventive design over previous designs is that the flexible electrode can provide paths through the electrode so that pharmacological agents (i.e., drugs) which may be positioned, e.g., in a delivery vehicle, such as a depot, under the electrodes, e.g., so that the pharmacological agent can leach out.
Agents that may be present in a drug delivery vehicle, e.g., depot, associated with the electrode include, but are not limited to: Therapeutic agents may be, for example, nonionic or they may be anionic and/or cationic in nature. Exemplary non-genetic therapeutic agents for use in connection with the present invention include: (a) anti-thrombotic agents such as heparin, heparin derivatives, urokinase, and PPack (dextrophenylalanine proline arginine chloromethylketone); (b) anti-inflammatory agents such as dexamethasone, prednisolone, corticosterone, budesonide, estrogen, sulfasalazine and mesalamine; (c) anti-neoplastic/antiproliferative/anti-miotic agents such as paclitaxel, 5-fluorouracil, cisplatin, vinblastine, vincristine, epothilones, endostatin, angiostatin, angiopeptin, monoclonal antibodies capable of blocking smooth muscle cell proliferation, and thymidine kinase inhibitors; (d) anesthetic agents such as lidocaine, bupivacaine and ropivacaine; (e) anti-coagulants such as D-Phe-Pro-Arg chloromethyl ketone, an RGD peptide-containing compound, heparin, hirudin, antithrombin compounds, platelet receptor antagonists, anti-thrombin antibodies, anti-platelet receptor antibodies, aspirin, prostaglandin inhibitors, platelet inhibitors and tick antiplatelet peptides; (f) vascular cell growth promoters such as growth factors, transcriptional activators, and translational promotors; (g) vascular cell growth inhibitors such as growth factor inhibitors, growth factor receptor antagonists, transcriptional repressors, translational repressors, replication inhibitors, inhibitory antibodies, antibodies directed against growth factors, bifunctional molecules consisting of a growth factor and a cytotoxin, bifunctional molecules consisting of an antibody and a cytotoxin; (h) protein kinase and tyrosine kinase inhibitors (e.g., tyrphostins, genistein, quinoxalines); (i) prostacyclin analogs; (j) cholesterol-lowering agents; (k) angiopoietins; (l) antimicrobial agents such as triclosan, cephalosporins, aminoglycosides and nitrofurantoin; (m) cytotoxic agents, cytostatic agents and cell proliferation affectors; (n) vasodilating agents; (o) agents that interfere with endogenous vasoactive mechanisms; (p) inhibitors of leukocyte recruitment, such as monoclonal antibodies; (q) cytokines, and (r) hormones. Of interest in certain embodiments are anti-inflammatory agents, e.g., glucocorticosteroids, such as dexamethasone, etc.
In certain embodiments, a pharmacological agent is present in a polymeric matrix that is proximal with the electrodes, e.g., positioned under the electrodes in a polymer matrix; or over the electrodes in a polymer matrix. In certain of these embodiments, pharmacological agents of interest are anti-thrombotic agents such as heparin, heparin derivatives, urokinase, and PPack (dextrophenylalanine proline arginine chloromethylketone). In certain embodiments, pharmacological agents of interest are anti-inflammatory agents such as dexamethasone, prednisolone, corticosterone, budesonide, estrogen, sulfasalazine and mesalamine. In certain embodiments, pharmacological agents of interest are anti-neoplastic/antiproliferative/anti-miotic agents such as paclitaxel, 5-fluorouracil, cisplatin, vinblastine, vincristine, epothilones, endostatin, angiostatin, angiopeptin, monoclonal antibodies capable of blocking smooth muscle cell proliferation, and thymidine kinase inhibitors. In certain embodiments, pharmacological agents of interest anesthetic agents such as lidocaine, bupivacaine and ropivacaine. In certain embodiments, pharmacological agents of interest are anti-coagulants such as D-Phe-Pro-Arg chloromethyl ketone, an RGD peptide-containing compound, heparin, hirudin, antithrombin compounds, platelet receptor antagonists, anti-thrombin antibodies, anti-platelet receptor antibodies, aspirin, prostaglandin inhibitors, platelet inhibitors and tick antiplatelet peptides. In certain embodiments, pharmacological agents of interest are vascular cell growth promoters such as growth factors, transcriptional activators, and translational promotors. In certain embodiments, pharmacological agents of interest are vascular cell growth inhibitors such as growth factor inhibitors, growth factor receptor antagonists, transcriptional repressors, translational repressors, replication inhibitors, inhibitory antibodies, antibodies directed against growth factors, bifunctional molecules consisting of a growth factor and a cytotoxin, bifunctional molecules consisting of an antibody and a cytotoxin. In certain embodiments, pharmacological agents of interest are protein kinase and tyrosine kinase inhibitors (e.g., tyrphostins, genistein, quinoxalines). In certain embodiments, pharmacological agents of interest prostacyclin analogs. In certain embodiments, pharmacological agents of interest cholesterol-lowering agents. In certain embodiments, pharmacological agents of interest angiopoietins. In certain embodiments, pharmacological agents of interest are antimicrobial agents such as triclosan, cephalosporins, aminoglycosides and nitrofurantoin. In certain embodiments, pharmacological agents of interest are cytotoxic agents, cytostatic agents and cell proliferation affectors. In certain embodiments, pharmacological agents of interest are vasodilating agents. In certain embodiments, pharmacological agents of interest are agents that interfere with endogenous vasoactive mechanisms. In certain embodiments, pharmacological agents of interest are inhibitors of leukocyte recruitment, such as monoclonal antibodies. In certain embodiments, pharmacological agents of interest are cytokines. In certain embodiments, pharmacological agents of interest are hormones. In certain embodiments, pharmacological agents of interest are anti-inflammatory agents, e.g., glucocorticosteroids, such as dexamethasone, etc.
The agent may be present in any convenient delivery vehicle, e.g., one that can be positioned in the structure, e.g., proximal to one or more of the electrodes thereof. Structures of interest include, but are not limited to: the drug delivery structures disclosed in U.S. Pat. No. 4,506,680, the disclosure of which delivery structures is herein incorporated by reference.
Steroids are used to reduce pacing thresholds. The electrode configuration provided in
The flexible connection members may have a multiplicity of configurations into which they can be formed as they extend off the IC chip. These designs can be both for a bulk electrode design with an electrode that has a material thickness of about 75 μm or a thin film electrode with a conductor thickness of about 10 μm to about 300 μm. The electrodes may also have a polymeric support of polyimide (thin film process) or PEEK (thermoformed). The polymeric material may also have openings cut or formed into it to increase the medical devices flexibility. The two main inventive designs for the electrodes are either a bulk material or a thin film material. The bulk material version would typically have a material thickness of about 75 μm but that thickness could range from about 10 μm to about 300 μm depending on the particular requirements. The thin film version of the electrode could have a thickness of about 0.1 μm to about 100 μm depending on the particular production methods and the design requirements.
The connection between the inventive electrode and the IC can be made with conductive polymeric materials, where a polymeric material is loaded with a material that would be conductive, where the conductive filler or doping agent may have a variety of different configurations, e.g., spheres, rods, ingots, or irregular shapes, and made from a variety of different materials, e.g., metals, both pure and alloys, carbon, etc., where specific conductive materials of interest include, but are not limited to: nickel spheres, e.g., having a size range of about 5 μm that are coated with gold, silver, or platinum, carbon fibers or carbon nanotubes, etc.
The inventive electrodes can be connected to the IC with a suitable solder, such as a noble metal solder, Pt—Sn, Pt—Ge, or Au—Sn where gold 20% tin and gold silicon are two examples of a suitable solder that would provide a conductive connection between the electrodes and the chip. This joining method covers a wide surface area of the IC chip. Advantages of this design include a large surface area helps distribute stresses throughout the chip and additional hermetic sealing for the electronics under the area of connection. In certain embodiments, the solder and electrodes that are connected in the area of connection have similar electrochemical characteristics to reduce corrosion, e.g., galvanically induced corrosion. In addition, attachment methods of the present invention can include wire bonding and riveting and chip bonding where the electrodes and chips are encapsulated to an assembly. These attachment methods can be performed both on the thin film design version and the bulk electrode design version. In certain embodiments, the connections of the chip interface are wide, e.g., at least about 0.25 mm wide, such as at least about 1.25 mm wide, to distribute stresses over a larger area. There can be a multiplicity of conductors to each electrode to provide redundancy.
An additional configuration of flexible members 44 connecting curved planar electrodes 41 to an IC 42 is shown in
An additional connection method between the electrodes employed is certain embodiments is stranded flexible high strength wire or cable. For connections between the satellite and chip to the conductors, one or more conductors can be performed with stranded wires that would be soldered to the chip in the manner described with the electrodes. These would then be formed so they would relieve stresses, and are then wrapped around the conductors and soldered and or metallurgically joined with a process similar to laser welding.
Additional embodiments of the invention that provide certain advantages are depicted in
The fatigue resistant IC chip connections of these embodiments enjoy many unique advantages. The entire device is simply and predictably assembled, allowing mass production with limited wastage and lower cost of production. It is unusually suited to robotic automation, rather than the painstaking hand assembly typically required for such devices. Time to assembly is decreased both in robotic and hand assembly embodiments of the present invention. Also, as the final construct is “of a piece,” potential material fatigue failures are minimized or eliminated.
Curved, somewhat flexible, robust attachment of the chip to the electrodes allows for long-term permanent device implantation, features shared with other embodiments of the invention. In one embodiment of the present invention, the attaching “wires” are beveled to provide ease in bending, and a robust final assemblage results, as reviewed in greater detail below. In one embodiment shown in these figures, a highly miniaturized IC chip is soldered together from small pieces. This assemblage is then processed in an oven to flow the solder. After this processing, the device undergoes welding to attach a lead frame to the electrodes and the power is connected to the other side of the chip. This assembly, which is comprised of the lead frame, the IC chip and the power wires, has inserted into its interior the electrodes which have been previously molded to a PEEK ring. The resulting intermediate assembly is then welded to it at the ends. The outer ring falls away, resulting in the finished assembly. See
The bending operations in this more advanced embodiment are easier and more reliable than joining operations from the standpoint of electrical conductivity and alignment. The result is better consistency and reliability in the final assemblages. Lower resistances for better current transfer, and basically better communication from the chip to the body are also advantages to this embodiment. An aspect of the present inventive fatigue resistant IC chip connection assembly methods of these embodiments is that the connection very quickly accesses or connects to the IC chip. The methods also provide very quick accesses or connects to the output of the chip to the body, or the chip to a package, or to a circuit or other device before it goes to the body. The invention allows a means to get to the body with a short a path and a minimum of assembly steps from the chip.
The assembly process for the inventive embodiment in
The IC chip 241 is placed into rectangular notch 247. For an ultrasonic welding approach, a raised floss is provided. The sacrificial material 242 provides a good, fluid-tight seal when the two halves are aligned and welded together. This approach is useful to speed the assembly process, because the subassembly will be molded to have the vias and leads 249.
The IC chip is placed into the in rectangular notch 247 in the cylinder sub-structure half that will be place over the top of the full assembly. The two aligned halves are held in a clamshell type fixture, clamping the two halves together. Ultrasonic energy is applied, which melts the plastic together.
Sacrificial material 242 is engineered to be sacrificial, that is these pieces are designed to melt. Alternately, sacrificial material 242 can be placed to fully encircle or be placed inside rectangular notch 247. As a result, the whole construct is a sealed end, providing maximum hermeticity protection.
Alternately, an opening can be provided. The advantage to having an opening, at some point in the structure, is a place to pass through the power leads to the chip as may be desired. To provide stronger hermeticity protection in this case, it is possible to encapsulate the entire final structure. In the final stages of assembly, the wires have been passed through these vias 248 in
The fatigue resistant IC chip connections and assembly methods of the these and other embodiments described herein allow the practicable reproducible production of an IC chip package and attachment design which is uniquely scalable to the necessary dimensions for many medical device applications, such as, but not limited to, intracardiac and intraocular devices, e.g., as reviewed below. The present invention provides for an entire medical device which has the capacity to be scaled to the size of currently available chip-packages alone. This unique miniaturization of a device with robust qualities provides the clinician medical devices of unprecedented applications in their diagnostic and therapeutic armamentarium.
The inventive constructs and assembly methods provide means to get to the body with as short a path as possible from the chip. An important aspect of the present inventive fatigue resistant IC chip connection assembly methods provides very quick accesses or connects to the IC chip. It also provides very quick accesses or connects to the output of the chip to the body, or the chip to a package, or to a circuit or other device before it goes to the body. Though these multiply improved segments of the overall device, the invention allows a means to get to the body with a short as path as possible from the chip.
In certain embodiments, the flexible conductive connection is provided by a liquid conductive connector that provides a liquid electrical connection between the IC and electrode components, e.g., as shown in
In certain embodiments, a compliant and electrically conductive adhesive is employed that includes a high-aspect ratio conductive member, e.g., carbon nanotube, present in a suitable flexible carrier material, e.g., silicone rubber. Both components are biocompatible and the carbon nanotubes can be functionalized to promote or hinder the absorption of proteins onto the carbon structure to alter the human body's reaction to the carbon nanotube. The importance of using carbon nanotubes is that the high-aspect ratio structure ensures electrical conductivity during elastic deformation of the material. The carbon nanotube “threads” can distort but still provide electrical connection. Additionally, the silicone can be mixed with a much lower weight percentage of carbon nanotubes.
As summarized above, certain embodiments of the subject structures are characterized by having shaped IC chips which impart fatigue resistance properties to the structure. Embodiments of such structures are now reviewed in more detail in terms of the figures.
In one embodiment of the present invention, a flexible spring is used to provide stress reduction on electrical connections. The spring can be made from many appropriate materials, including but not limited to: platinum, platinum iridium, platinum nickel, platinum tungsten, MP35N, Elgiloy, L605, 316 stainless steel, titanium, nickel titanium, Nitinol, cobalt chromium, cobalt, NiTi, tantalum, among other appropriate material choices.
The flexible spring of the present invention is provided at a length most appropriate to the particular miniaturized device and its application. This can potentially be as long as the device of which it is a part. By example, the length of the spring can be about 0.080 to about 0.200 inches, such as from about 0.030 to about 0.100 inches, and including from about 0.015 to about 0.250 inches. The wire diameter of the spring will be selected as appropriate to the material and as to the particular application. Wire diameter ranges for some embodiments of the present invention are about 0.0005 to about 0.020 inches, such as from about 0.002 to about 0.010 inches, and including about 0.003 inches.
Pressures on the device may also occur as the elongated conductive members curve away from or curve towards the electrode, e.g., quadrant electrode, assembly in either a sideways or up and down directions. These compression and extension forces again can be relieved by the use of the inventive flexible attachment structure, and other stress relief features working synergistically to more rigid structures of the device.
IC 403 is attached to quadrant electrodes 409A, 409B, 409C and 409D by junctures 411. Quadrant electrodes 409A, 409B, 409C and 409D are joined together with PEEK material 413. Guide wire lumen 415 runs beneath IC 403 and beneath and/or between elongated conductive members 405 and 407, all running through or contained with quadrant electrodes 409A, 409B, 409C and 409D.
In certain embodiments of the present invention, the area from the beginning of the coil of flexible connections 401, the closely wrapped section is tapered. This design feature facilitates the assembly process. It also provides a portion of the spring that can expand and contract in the axial direction. The physical challenge of axial expansion and contraction can occur if there is motion between the elongated conductive members 405 and 407 and IC 403. Additional, axial expansion and contraction can occur with more universal stresses upon the device as a whole.
The final resulting assembled device shown in
Working synergistically with the more fatigue resistant members of the construct, joined areas, such as junctures 411 which can include welding, providing a basic, strong architectural integrity to the device. Such features as attachment tabs 417 assure that these joined portions of the device are well aligned, and also provide additional structural stability, decreasing strain on the weld junctures.
Aspects of the invention include devices and systems, including implantable medical devices and systems, that include the hermetically sealed structures according to embodiments of the invention. The devices and systems may perform a number of different functions, including but not limited to electrical stimulation applications, e.g., for medical purposes, analyte, e.g., glucose detection, etc.
The implantable medical devices and system may have a number of different components or elements in addition to the electrodes, where such elements may include, but are not limited to: sensors (e.g., cardiac wall movement sensors, such as wall movement timing sensors); processing elements, e.g., for controlling timing of cardiac stimulation, e.g., in response to a signal from one or more sensors; telemetric transmitters, e.g., for telemetrically exchanging information between the implantable medical device and a location outside the body; drug delivery elements, etc. As such, the subject hermetically sealed structures may be operably coupled, e.g., in electrical communication with, components of a number of different types of implantable medical devices and system, where such devices and systems include, but are not limited to: physiological parameter sensing devices; electrical (e.g., cardiac) stimulation devices, etc.
In certain embodiments of the subject systems and devices, one or more segmented electrode structures of the invention are electrically coupled to at least one elongated conductive member, e.g., an elongated conductive member present in a lead, such as a cardiovascular lead. In certain embodiments, the elongated conductive member is part of a multiplex lead, e.g., as described in Published PCT Application No. WO 2004/052182 and U.S. patent application Ser. No. 10/734,490, the disclosure of which is herein incorporated by reference. In some embodiments of the invention, the devices and systems may include onboard logic circuitry or a processor, e.g., present in a central control unit, such as a pacemaker can. In these embodiments, the central control unit may be electrically coupled to one or more hermetically sealed structures via one or more conductive members.
Devices and systems in which the subject segmented electrode structures find use include, but are not limited to, those described in: WO 2004/066817 titled “Methods And Systems For Measuring Cardiac Parameters”; WO 2004/066814 titled “Method And System For Remote Hemodynamic Monitoring”; WO 2005/058133 titled “Implantable Pressure Sensors”; WO 2004/052182 titled “Monitoring And Treating Hemodynamic Parameters”; WO 2004/067081 titled “Methods And Apparatus For Enhancing Cardiac Pacing”; U.S. Provisional Patent Application 60/638,928 entitled “Methods and Systems for Programming and Controlling a Cardiac Pacing Device” filed Dec. 23, 2004; U.S. Provisional Patent Application No. 60/658,445 titled “Fiberoptic Cardiac Wall Motion Timer” filed Mar. 3, 2005; U.S. Provisional Patent Application No. 60,667,759 titled “Cardiac Motion Detection Using Fiberoptic Strain Gauges,” filed Mar. 31, 2005; U.S. Provisional Patent Application No. 60/679,625 titled “de Minimus Control Circuit for Cardiac pacing and Signal Collection,” filed May 9, 2005; U.S. Provisional Patent Application No. 60/706,641 titled “Deployable Epicardial Electrode and Sensor Array,” filed Aug. 8, 2005; U.S. Provisional Patent Application No. 60/705,900 titled “Electrical Tomography” filed Aug. 5, 2005; U.S. Provisional Patent Application No. 60/______ (attorney docket no. PRO-P37) titled “Methods and Apparatus for Tissue Activation and Monitoring” filed Aug. 12, 2005; U.S. Provisional Patent Application No. 60/707,913 titled “Measuring Conduction Velocity Using One or More Satellite Devices,” filed Aug. 12, 2005. These applications are herein incorporated into the present application by reference in their entirety.
Some of the present inventors have developed Doppler, pressure sensors, additional wall motion, and other cardiac parameter sensing devices, which devices or at least components thereof can be present in medical devices according to embodiments of the invention, as desired. Some of these are embodied in currently filed provisional applications; “One Wire Medical Monitoring and Treating Devices”, U.S. Provisional Patent Application No. 60/607,280 filed Sep. 2, 2004, U.S. patent application Ser. No. 11/025,876 titled “Pressure Sensors having Stable Gauge Transducers”; U.S. patent application Ser. No. 11/025,366 “Pressure Sensor Circuits”; U.S. patent application Ser. No. 11/025,879 titled “Pressure Sensors Having Transducers Positioned to Provide for Low Drift”; U.S. patent application Ser. No. 11/025,795 titled “Pressure Sensors Having Neutral Plane Positioned Transducers”; U.S. patent application Ser. No. 11/025,657 titled “Implantable Pressure Sensors”; U.S. patent application Ser. No. 11/025,793 titled “Pressure Sensors Having Spacer Mounted Transducers”; “Stable Micromachined Sensors” U.S. Provisional Patent Application 60/615,117 filed Sep. 30, 2004, “Amplified Complaint Force Pressure Sensors” U.S. Provisional Patent Application No. 60/616,706 filed Oct. 6, 2004, “Cardiac Motion Characterization by Strain Measurement” U.S. Provisional Patent Application filed Dec. 20, 2004, and PCT Patent Application entitled “Implantable Pressure Sensors” filed Dec. 10, 2004, “Shaped Computer Chips with Electrodes for Medical Devices” U.S. Provisional Patent Application filed Feb. 22, 2005; “Fiberoptic Cardiac Wall Motion Timer” U.S. Provisional Patent Application 60/658,445 filed Mar. 3, 2005; “Cardiac Motion Detection Using Fiberoptic Strain Gauges” U.S. Provisional Patent Application 60/667,749 filed Mar. 31, 2005. These applications are incorporated in their entirety by reference herein.
In certain embodiments, the implantable medical devices and systems which include the subject segmented electrode structures are ones that are employed for cardiovascular applications, e.g., pacing applications, cardiac resynchronization therapy applications, etc.
A representative system in which the hermetically sealed integrated structures find use is depicted in
The left ventricle electrode lead 107 is comprised of a lead body and one or more electrode assemblies 110,111, and 112. Each of the electrodes includes a hermetically sealed integrated circuit. Having multiple distal electrode assemblies allows a choice of optimal electrode location for CRT. In a representative embodiment, electrode lead 107 is constructed with the standard materials for a cardiac lead such as silicone or polyurethane for the lead body, and MP35N for the coiled or stranded conductors connected to Pt—Ir (90% platinum, 10% iridium) electrode assemblies 110,111 and 112. Alternatively, these device components can be connected by a multiplex system (e.g., as described in published United States Patent Application publication nos.: 20040254483 titled “Methods and systems for measuring cardiac parameters”; 20040220637 titled “Method and apparatus for enhancing cardiac pacing”; 20040215049 titled “Method and system for remote hemodynamic monitoring”; and 20040193021 titled “Method and system for monitoring and treating hemodynamic parameters; the disclosures of which are herein incorporated by reference), to the proximal end of electrode lead 107. The proximal end of electrode lead 107 connects to a pacemaker 106.
The electrode lead 107 is placed in the heart using standard cardiac lead placement devices which include introducers, guide catheters, guidewires, and/or stylets. Briefly, an introducer is placed into the clavicle vein. A guide catheter is placed through the introducer and used to locate the coronary sinus in the right atrium. A guidewire is then used to locate a left ventricle cardiac vein. The electrode lead 107 is slid over the guidewire into the left ventricle cardiac vein 104 and tested until an optimal location for CRT is found. Once implanted a multi-electrode lead 107 still allows for continuous readjustments of the optimal electrode location.
The electrode lead 109 is placed in the right ventricle of the heart with an active fixation helix at the end 116 which is embedded into the cardiac septum. In this view, the electrode lead 109 is provided with one or multiple electrodes 113,114,115.
Electrode lead 109 is placed in the heart in a procedure similar to the typical placement procedures for cardiac right ventricle leads. Electrode lead 109 is placed in the heart using the standard cardiac lead devices which include introducers, guide catheters, guidewires, and/or stylets. Electrode lead 109 is inserted into the clavicle vein, through the superior vena cava, through the right atrium and down into the right ventricle. Electrode lead 109 is positioned under fluoroscopy into the location the clinician has determined is clinically optimal and logistically practical for fixating the electrode lead 109. Under fluoroscopy, the active fixation helix 116 is advanced and screwed into the cardiac tissue to secure electrode lead 109 onto the septum. The electrode lead 108 is placed in the right atrium using an active fixation helix 118. The distal tip electrode 118 is used to both provide pacing and motion sensing of the right atrium.
Yet another type of medical device and system in which the subject segmented electrode structures find use is vision restoration devices and systems, e.g., devices and systems that include implantable photodetector elements that convert detected light to electrical signals, e.g., for stimulating the optic nerve. For example, integrated circuits and photosensors, e.g., photovoltaic cells, can be coupled to segmented electrode structures of embodiments of the invention. Representative implantable vision restoration devices and systems in which the segmented electrode structures may be incorporated include, but are not limited to those devices and systems described in: U.S. Pat. Nos. 4,628,933; 5,042,223; 5,397,350; and 6,230,057; as well as in Published PCT Application Publication Nos. WO 01/74444 titled “Multi-Phasic Microphotodetector Retinal Implant With Variable Voltage And Current Capability And Apparatus For Insertion”; WO 01/83026 titled “Artificial Retina Device With Stimulating And Ground Return Electrodes Disposed On Opposite Sides Of The Neuroretina And Method Of Attachment”; WO 03/002190 titled “Methods For Improving Damaged Retinal Cell Function; WO 03/002070 titled “Methods For Improving Damaged Retinal Cell Function Using Physical And/Or Mechanical Stimulation”; WO 2004/071338 titled “Implantable Device Using Diamond-Like Carbon Coating”; WO 2004/112893 titled “Implant Instrument”; WO 2005/004985 titled “Treatment Of Degenerative Retinal Disease Via Electrical Stimulation Of Surface Structures”; WO 2005/004985 titled “Device For Treatment Of Degenerative Retinal Disease Via Electrical Stimulation Of Surface Structures Of The Eyeball”; and WO 2005/110326 titled “Mechanically Activated Objects For Treatment Of Degenerative Retinal Disease.”
Also provided are kits that include the subject segmented electrode structures, as part of one or more components of an implantable device or system, such as the devices and systems reviewed above. In certain embodiments, the kits further include at least a control unit, e.g., in the form of a pacemaker can. In certain of these embodiments, the structure and control unit may be electrically coupled by an elongated conductive member. In certain embodiments, the segmented electrode sealed structure may be present in a lead, such as a cardiovascular lead.
In certain embodiments of the subject kits, the kits will further include instructions for using the subject devices or elements for obtaining the same (e.g., a website URL directing the user to a webpage which provides the instructions), where these instructions are typically printed on a substrate, which substrate may be one or more of: a package insert, the packaging, reagent containers and the like. In the subject kits, the one or more components are present in the same or different containers, as may be convenient or desirable.
Although the foregoing invention has been described in some detail by way of illustration and example for purposes of clarity of understanding, it is readily apparent to those of ordinary skill in the art in light of the teachings of this invention that certain changes and modifications may be made thereto without departing from the spirit or scope of the appended claims.
Accordingly, the preceding merely illustrates the principles of the invention. It will be appreciated that those skilled in the art will be able to devise various arrangements which, although not explicitly described or shown herein, embody the principles of the invention and are included within its spirit and scope. Furthermore, all examples and conditional language recited herein are principally intended to aid the reader in understanding the principles of the invention and the concepts contributed by the inventors to furthering the art, and are to be construed as being without limitation to such specifically recited examples and conditions. Moreover, all statements herein reciting principles, aspects, and embodiments of the invention as well as specific examples thereof, are intended to encompass both structural and functional equivalents thereof. Additionally, it is intended that such equivalents include both currently known equivalents and equivalents developed in the future, i.e., any elements developed that perform the same function, regardless of structure. The scope of the present invention, therefore, is not intended to be limited to the exemplary embodiments shown and described herein. Rather, the scope and spirit of present invention is embodied by the appended claims.
Pursuant to 35 U.S.C. § 119 (e), this application claims priority to the filing dates of: U.S. Provisional Patent Application Ser. No. 60/638,692 filed Dec. 22, 2004; U.S. Provisional Patent Application Ser. No. 60/655,609 filed Feb. 22, 2005; U.S. Provisional patent application Ser. No. 60/______ filed Dec. 15, 2005 and titled “Fatigue Resistant IC Chip Connection”; and U.S. Provisional patent application Ser. No. 60/______ filed Dec. 20, 2005 and titled “Fatigue Resistant Coiled IC Chip Connection”; the disclosures of which are herein incorporated by reference.
| Filing Document | Filing Date | Country | Kind | 371c Date |
|---|---|---|---|---|
| PCT/US05/46811 | 12/22/2005 | WO | 00 | 3/21/2008 |
| Number | Date | Country | |
|---|---|---|---|
| 60638692 | Dec 2004 | US | |
| 60655609 | Feb 2005 | US | |
| 60751111 | Dec 2005 | US | |
| 60752733 | Dec 2005 | US |
