The present invention relates generally to implantable medical device leads for delivering therapy, in the form of electrical stimulation, and in particular, the present invention relates to conductor coil insulation in implantable medical device leads.
Implantable medical electrical leads are well known in the fields of cardiac stimulation and monitoring, including neurological stimulation and cardiac pacing and cardioversion/defibrillation. In the field of cardiac stimulation and monitoring, endocardial leads are placed through a transvenous route to position one or more sensing and/or stimulation electrodes in a desired location within a heart chamber or interconnecting vasculature. During this type of procedure, a lead is passed through the subclavian, jugular, or cephalic vein, into the superior vena cava, and finally into a chamber of the heart or the associated vascular system. An active or passive fixation mechanism at the distal end of the endocardial lead may be deployed to maintain the distal end of the lead at a desired location.
It is highly desirable that implantable leads have the lowest possible profile while the insulation maintain sufficient integrity to electrically isolate one or more conductors of the leads over the life of the implanted lead.
The following drawings are illustrative of particular embodiments of the invention and therefore do not limit its scope, but are presented to assist in providing a proper understanding of the invention. The drawings are not to scale (unless so stated) and are intended for use in conjunction with the explanations in the following detailed description. Embodiments of the present invention will hereinafter be described in conjunction with the appended drawings, wherein like numerals denote like elements, and:
Lead 102 includes an elongated lead body 122 that extends between proximal end 101 and a distal end 121 of lead 102. An outer insulative sheath 124 surrounds lead body 122 and is preferably fabricated of polyurethane, silicone rubber, a fluoropolymer or a combination thereof. Coiled wire conductors in accordance with one embodiment of the present invention are positioned within lead body 122, as will be described in detail below. Distal end 121 of lead 102 includes a proximal ring electrode 128 and a distal tip electrode 126, separated by an insulative sleeve 130. Proximal ring electrode 128 and distal tip electrode 126 are electrically coupled to connector assembly 106 by one or more coil conductors, or filars extending between distal end 121 and proximal end 101 of lead 102 in a manner shown, for example, in U.S. Pat. Nos. 4,922,607 and 5,007,435, incorporated herein by reference in their entireties.
Alternately, lumen 204 may house an insulative fiber, such as ultrahigh molecular weight polyethylene (UHMWPE), liquid crystal polymer (LCP), polyester and so forth, or an insulated cable (i.e. cable 630 illustrated in
According to one embodiment of the present invention, the insulative layer 212 is applied onto the conductor wire 210 in multiple coats, that is, layer 212 is comprised of multiple layers of a hydrolytically stable polyimide resulting in a desired wall thickness W. The coating is applied in such a way to provide a ductile, robust insulative layer that enables a single filar, i.e., coiled wire conductor, or multiple filar, i.e., coiled wire conductors, to be wound into a single wound conductor coil 200 of sizes ranging from an outer diameter D (
The use of the hydrolytically stable polyimide insulative layer 212 according to embodiments of the present invention offers an exceptional dielectric strength for electrical insulation. Through flex studies on conductor coils coated with the SI polyimide, the inventors have found that the insulative layer 212 also has high flex properties in regards to stimulating lead conductor coil flex testing. The SI coating in various wall thicknesses will remain intact on the coil filar until the coil filar fractures as seen in conventional conductor coil flex studies (reference 10 million to 400 million flex cycles at various 90 degree radius bends).
Conductor coils 200 (
Hydrolytically stable polyimides do not show a notable decrease in mechanical performance over time when immersed in an aqueous environment, such as an implant environment. Examples of polyimides considered to be hydrolytically stable may have the following general recurring structure:
Wherein AR is either AR1 or AR2 that represent different dianhydrides and wherein either AR1 or AR2 is represented by the following general formula including isomeric variations thereof:
Wherein X can be represented by CH2, CH3—C—CH3, O (Oxygen), C═O (carbonyl), S (sulfide), SO2 (sulfonyl), CF3—C—CF3 (hexafluoropropane derivative), or no element (e.g., 3,4,3′4′-biphenyltetracarboxylic dianhydride (BPDA)) and wherein AR3 is a diamine and can be represented by the following formula:
including, as shown below, isomeric variations thereof:
Wherein Y and Z can be represented by CH2, CH3—C—CH3, O, C═O, S, SO2, or CF3—C—CF3. Similar to the dianhydride (e.g., AR1, AR2), the polyimide may be composed of one or more diamines (AR3) or combinations of the above structures. The resultant polyimides may be endcapped by a number of chemicals know to the industry (e.g., phthalic anhydride) and the polyimide or the polyamic acid precursor may be supplied in a variety of solvents known to those in the industry (e.g., N,N dimethylacetamide (DMAc), dimethyl foramide (DMF), N-methylpyrrolidinone (NMP)). The hydrolytically stable polyimide may utilize mole ratios of the dianhydrides and may possess offsets (excess of diamine to dianhydride) similar to those known to the industry. The polyimides may also be further modified by incorporating specialized constituents such as crosslinking agents (e.g., nadic groups), fluorine containing groups (e.g., CF3, SF5, hexafluoropropane), or processing aids commonly known to those in the industry. Examples of hydrolytically stable polyimides suitable for embodiments of the present invention are:
By utilizing the insulative layer 212 of the present invention, the stimulating lead is reduced in diameter, and is more robust in regards to mechanical flex and electrical insulation. The insulative layer 212 provides an extremely long-term flex-life performance associated with the ductility of the hydrolytically stable polyimide coating over conductor wires such as MP35N, used on conductor coils. These improved properties are related to the unique process of the multiple pass application of the hydrolytically stable polyimide. The resulting insulative layer 212 provides a highly reliable insulating and mechanically robust coating over implantable stimulating leads.
While an insulative layer formed only of ETFE tends to be susceptible to creep, insulative layer 212 of the present invention, which is formed of hydrolytically stable polyimide, is mechanically more robust, hydrolytically stable and possesses exceptionally dielectric properties, making the hydrolytically stable polyimide desirable for long-term implant applications. The use of a thin layer of hydrolytically stable polyimide coating on conventional MP35N alloy coil filars may also act as a protective barrier to reduce the incidence of metal induced oxidation seen on some polyurethane medical device insulations.
According to one embodiment, layer 639 may be applied to the bundled wire strands 632-638 by passing them through a polyamic acid solution and then heating the strands to a temperature sufficient to fully imidize the polyimide; likewise layer 212 may be applied to conductor 210 in a similar manner. As previously described, multiple coating passes may form layers 630 and 212. According to an alternate embodiment an extrusion process may be used to apply layer 639 or layer 212; the type of polyimide described by Example 4, above, may be particularly suitable for extrusion. According to yet another embodiment a second layer of another, insulative material is formed over layer 639, for example a layer of ETFE as described in conjunction with
While a particular embodiment of the present invention has been shown and described, modifications may be made. It is therefore intended in the appended claims to cover all such changes and modifications, which fall within the true spirit and scope of the invention.
This application is a continuation of U.S. patent application Ser. No. 10/909,518 filed on Aug. 2, 2004 and entitled “IMPLANTABLE MEDICAL DEVICE CONDUCTOR INSULATION AND PROCESS FOR FORMING”, which is a continuation-in-part of U.S. patent application Ser. No. 10/407,653 filed on Apr. 4, 2003 and entitled “IMPLANTABLE MEDICAL DEVICE CONDUCTOR INSULATION AND PROCESS FOR FORMING”, which claims priority and other benefits from U.S. Provisional Patent Application Ser. No. 60/371,995, filed Apr. 11, 2002, entitled “BIO-STABLE IMPLANTABLE MEDICAL DEVICE LEAD CONDUCTOR INSULATION AND PROCESS FOR FORMING”, all of which are incorporated herein by reference in their entireties.
Number | Name | Date | Kind |
---|---|---|---|
3035583 | Stoltz et al. | May 1962 | A |
3168417 | Smith, Jr. et al. | Feb 1965 | A |
3179614 | Edwards | Apr 1965 | A |
3179630 | Endrey | Apr 1965 | A |
3179631 | Endrey | Apr 1965 | A |
3179632 | Hendrix | Apr 1965 | A |
3179633 | Endrey | Apr 1965 | A |
3179634 | Edwards | Apr 1965 | A |
3287311 | Edwards | Nov 1966 | A |
3608054 | Alvino et al. | Sep 1971 | A |
3708459 | Lubowitz | Jan 1973 | A |
4056651 | Scola | Nov 1977 | A |
4277534 | Flowers | Jul 1981 | A |
4627439 | Harris | Dec 1986 | A |
4789589 | Baxter | Dec 1988 | A |
4922607 | Doan et al. | May 1990 | A |
4925445 | Sakamoto et al. | May 1990 | A |
4939317 | Hostler | Jul 1990 | A |
5007435 | Doan et al. | Apr 1991 | A |
5069226 | Yamauchi et al. | Dec 1991 | A |
5089304 | Kuder | Feb 1992 | A |
5147966 | St. Clair et al. | Sep 1992 | A |
5171828 | Meterko et al. | Dec 1992 | A |
5184627 | de Toledo | Feb 1993 | A |
5201903 | Corbett, III et al. | Apr 1993 | A |
5210174 | Tamai et al. | May 1993 | A |
5282841 | Szyszkowski | Feb 1994 | A |
5298331 | Kanakarajan et al. | Mar 1994 | A |
5411765 | Kanakarajan et al. | May 1995 | A |
5433200 | Fleischhacker | Jul 1995 | A |
5445859 | Lindegren et al. | Aug 1995 | A |
5464928 | Chang et al. | Nov 1995 | A |
5478916 | Chang et al. | Dec 1995 | A |
5487757 | Truckai et al. | Jan 1996 | A |
5502157 | Chang et al. | Mar 1996 | A |
5573533 | Strul | Nov 1996 | A |
5639850 | Bryant | Jun 1997 | A |
5669383 | Johnson | Sep 1997 | A |
5741883 | Bryant | Apr 1998 | A |
5760341 | Laske et al. | Jun 1998 | A |
5775327 | Randolph et al. | Jul 1998 | A |
5837377 | Sheu et al. | Nov 1998 | A |
5845396 | Altman et al. | Dec 1998 | A |
5851227 | Spehr | Dec 1998 | A |
5897583 | Meyer et al. | Apr 1999 | A |
5935159 | Cross et al. | Aug 1999 | A |
6022346 | Panescu et al. | Feb 2000 | A |
6048959 | Bryant | Apr 2000 | A |
6133408 | Chiu et al. | Oct 2000 | A |
6141576 | Littman et al. | Oct 2000 | A |
6289250 | Tsuboi et al. | Sep 2001 | B1 |
6366819 | Stokes | Apr 2002 | B1 |
6370434 | Zhang et al. | Apr 2002 | B1 |
6374141 | Sass | Apr 2002 | B1 |
6379369 | Abrams et al. | Apr 2002 | B1 |
6402689 | Scarantino et al. | Jun 2002 | B1 |
6434430 | Borgersen et al. | Aug 2002 | B2 |
6489562 | Hess et al. | Dec 2002 | B1 |
6493591 | Stokes | Dec 2002 | B1 |
6553265 | Fischer, Sr. | Apr 2003 | B1 |
6564107 | Bodner et al. | May 2003 | B1 |
6606521 | Paspa et al. | Aug 2003 | B2 |
6686437 | Buchman et al. | Feb 2004 | B2 |
6919422 | Gallucci et al. | Jul 2005 | B2 |
6979319 | Manning et al. | Dec 2005 | B2 |
7627382 | Minar et al. | Dec 2009 | B2 |
20030216800 | Ebert et al. | Nov 2003 | A1 |
20040215299 | Zhao et al. | Oct 2004 | A1 |
20050004643 | Ebert et al. | Jan 2005 | A1 |
20060229693 | Bauer et al. | Oct 2006 | A1 |
20060271135 | Minar et al. | Nov 2006 | A1 |
20070185556 | Williams et al. | Aug 2007 | A1 |
20070208383 | Williams | Sep 2007 | A1 |
20070233215 | Sommer et al. | Oct 2007 | A1 |
20070250144 | Falk et al. | Oct 2007 | A1 |
20070255377 | Marshall et al. | Nov 2007 | A1 |
20080161898 | Bauer et al. | Jul 2008 | A1 |
20080178449 | Huotari et al. | Jul 2008 | A1 |
20080242964 | Horrigan et al. | Oct 2008 | A1 |
20080243195 | Sommer et al. | Oct 2008 | A1 |
20080243215 | Sommer et al. | Oct 2008 | A1 |
20090248127 | Clemens et al. | Oct 2009 | A1 |
20090306752 | Ebert et al. | Dec 2009 | A1 |
Number | Date | Country |
---|---|---|
0539148 | Apr 1993 | EP |
0539148 | Sep 1993 | EP |
1192957 | Apr 2002 | EP |
2670677 | Jun 1992 | FR |
1990-159247 | Jun 1990 | JP |
WO 8804940 | Jul 1988 | WO |
WO 0228476 | Apr 2002 | WO |
WO 02066539 | Aug 2002 | WO |
WO 03089045 | Oct 2003 | WO |
WO 03089045 | Feb 2005 | WO |
WO 2006017421 | Feb 2006 | WO |
WO 2006105066 | Oct 2006 | WO |
WO 2006105066 | May 2007 | WO |
WO 2007127620 | Nov 2007 | WO |
WO 2008094879 | Aug 2008 | WO |
WO 2008095059 | Aug 2008 | WO |
Number | Date | Country | |
---|---|---|---|
20100114282 A1 | May 2010 | US |
Number | Date | Country | |
---|---|---|---|
60371995 | Apr 2002 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 10909518 | Aug 2004 | US |
Child | 12683561 | US |
Number | Date | Country | |
---|---|---|---|
Parent | 10407653 | Apr 2003 | US |
Child | 10909518 | US |