The present invention relates to circuitry that can be used to perform in-memory compression for machine learning.
Convolutional neural networks (CNN) are used in machine learning with applications in fields such as speech recognition, computer vision and text processing. CNN operations can be implemented using a system that includes graphics processing units (GPU) and dynamic random access memory (DRAM) coupled to the GPU. In such a system, data is frequently moved between multiple GPUs and DRAMs for convolution and pooling operations, through components on printed circuit boards such as conductive traces and pads. However, such data movement can consume a significant amount of power and slow down the performance.
It is desirable to provide a device for pooling operations that can improve the performance and reduce power consumption.
The present invention provides a device comprising a first block of memory cells to store an input array and a second block of memory cells. Pooling circuitry operatively is coupled to the first block of memory cells to execute in-place pooling according to a function over the input array to generate an array of output values. Writing circuitry operatively is coupled to the second block to store the array of output values in the second block of memory cells. Analog sensing circuitry is coupled to the first block of memory cells to generate analog values for the input array; and wherein the pooling circuitry receives the analog values as inputs to the function. The writing circuitry operatively coupled to the second block is configured to store an analog level in each cell of the second block for the array of output values.
As used herein, an analog level can be stored without verify cycles to verify that the cell has been changed to the target resistance or threshold range corresponding to a particular digital value. Storing output values in the second block of memory cells as analog levels instead of digital values can improve the performance for storing the output values in the array of output values, because the verify cycles are not needed.
As used herein, “in-place pooling” refers to pooling according to a function over an input array to generate an array of output values, where the input array is stored in an addressable memory before the pooling, the pooling is executed while the input array remains stored in the same addressable memory, and is not moved to another addressable memory before or during the execution of the pooling.
For a set of frames of cells in the input array, in one embodiment, the function can determine a maximum analog value among cells in each frame in the set of frames to generate the array of output values, where each output value in the array of output values corresponds to a frame in the set of frames, and indicates the maximum analog value among the cells in the frame in the set of frames. In an alternative embodiment, the function can determine an average analog value among cells in each frame in the set of frames to generate the array of output values. In yet another alternative embodiment, the function can determine a minimum analog value among cells in each frame in the set of frames to generate the array of output values. In yet another alternative embodiment, the function can determine a sum of analog values among cells in each frame in the set of frames to generate the array of output values. Pooling can reduce the dimensionality of an input array and reduce the number of computations involving the input array in convolutional neural networks, while retaining the most important information in the input array.
The device includes address generation circuits that apply addresses for a set of frames to the first block in coordination with the pooling circuitry.
The writing circuitry can apply a sequence of write pulses for each cell in the second block having a number of write pulses determined according to a corresponding output value in the array of output values. The writing circuitry can apply a sequence of write pulses for each cell in the second block having a pulse duration determined according to a corresponding output value in the array of output values. The writing circuitry can apply a sequence of write pulses for each cell in the second block having a tail length of a write pulse determined according to a corresponding output value in the array of output values.
The second block of memory cells can comprise programmable resistance memory cells. The second block of memory cells can comprise charge storage memory cells. The first and second blocks of memory cells can be implemented on a single integrated circuit or multichip module under one package.
A method is also provided for operating a device that comprises a first block of memory cells to store an input array, and a second block of memory cells. The method comprises executing in-place pooling according to a function over the input array to generate an array of output values, and storing the array of output values in the second block of memory cells.
Other aspects and advantages of the present invention can be seen on review of the drawings, the detailed description and the claims, which follow.
The following description will typically be with reference to specific structural embodiments and methods. It is to be understood that there is no intention to limit the technology to the specifically disclosed embodiments and methods but that the technology may be practiced using other features, elements, methods and embodiments. Preferred embodiments are described to illustrate the present technology, not to limit its scope, which is defined by the claims. Those of ordinary skill in the art will recognize a variety of equivalent variations on the description that follows.
The first block of memory cells 110 to store the input array can have a number M of rows of cells and a number N of columns of cells. Analog values shown for a cell in the first block of memory cells can represent resistance values, such as 0.8 MΩ, 0.4 MΩ, 0.5 MΩ, etc. (Mega Ohm), or threshold voltage values, such as 8V, 4V, 5V, etc.
A frame of cells (e.g. 111) in the first block of memory cells can have a number Z of rows and a number W of columns. The first block of memory cells can include a set of frame of cells. A second frame of cells in the set of frame of cells can be sequenced from a first frame of cells in the set of frame of cells by a first stride Sx including at least one column in a row direction (X-direction) or by a second stride Sy including at least one row in a column direction (Y-direction).
The second block of memory cells 130 can have a number Y of rows and a number X of columns. The number Y is a function of the number M of rows of cells in the first block of memory cells, the number Z of rows of cells in a frame of memory cells in the first block of memory cells, and the second stride Sy, i.e., Y=F (M, Z, Sy). The number X is a function of the number N of columns of cells in the first block of memory cells, the number W of columns of cells in a frame of memory cells in the first block of memory cells, and the first stride Sx, i.e., X=f (N, W, Sx). For instance, if W=Sx and Z=Sy, then X=N/W and Y=M/Z, where X and Y are rounded up to the nearest integer. As shown in the example of
In one embodiment, the analog levels in the second block of memory cells include programmable resistance memory cells having resistance levels. Programmable resistance memories can include phase change memory (PCM), resistive random access memory (RRAM), and magnetoresistive random access memory (MRAM). A number ‘1’, ‘0.5’, ‘0.6’, ‘0.7’, ‘0.8’, etc. for a cell in the second block of memory cells 130 can represent 1 MΩ, 0.5 MΩ, 0.6 MΩ, 0.7 MΩ, 0.8 MΩ, etc. respectively.
Before a process starts to execute in-place pooling according to a function over the input array to generate an array of output values, the second block of memory cells can be set to an upper limit for resistance levels (e.g. 1 MΩ), representing the case when the maximum analog value among cells in a frame in the set of frames in the input array is at or above the upper limit for resistance levels.
In an alternative embodiment, the analog levels in the second block of memory cells include charge storage memory cells having threshold voltage levels. Charge storage memories can include floating gate and nitride trapping memories. In this embodiment, a number ‘1’, ‘0.9’, ‘0.8’, ‘0.7’, ‘0.6’, etc. for a cell in the second block of memory cells 130 can represent 10V, 9V, 8V, 7V, 6V, etc. respectively.
Before a process starts to execute in-place pooling according to a function over the input array to generate an array of output values, the second block of memory cells can be erased to a lower limit for threshold voltage levels (e.g. 1V), representing the case when the maximum analog value among cells in a frame in the set of frames in the input array is at or below the lower limit for threshold voltage levels.
Analog sensing circuitry (1139,
Pooling circuitry (1140,
Writing circuitry (1150,
Storing the output value in the particular cell in the second block of memory cells can include addressing a particular cell in the second block of memory cells, and applying a sequence of write pulses for the particular cell in the second block having a pulse duration determined according to a corresponding output value in the array of output values. A pulse duration can refer to a set time of a set pulse for a sequence of set pulses for memory cells having resistance levels, or a program time of a program pulse for a sequence of program pulses for memory cells having threshold voltage levels. The set time can be applied to a sequence of set pulses so the set pulses in the sequence have the same set time. The program time can be applied to a sequence of program pulses so the program pulses in the sequence can have the same program time.
Furthermore, the output values can be converted into a combination of varying set times and numbers of set pulses for memory cells in the second block having resistance levels, or a combination of varying program times and numbers of program pulses for memory cells in the second block having threshold voltage levels.
Storing the output value in the particular cell in the second block of memory cells can include addressing a particular cell in the second block of memory cells, and applying a sequence of write pulses for the particular cell in the second block having a tail length of a write pulse determined according to a corresponding output value in the array of output values, for memory cells in the second block having resistance levels. The output values can be converted into a combination of varying set times, numbers of set pulses, and tail lengths of a write pulse for memory cells in the second block having resistance levels,
The output values in the array of output values are stored as analog levels in the second block of memory cells, and no verify cycles are needed to verify that a cell in the second block of memory cells has been changed to a target resistance or threshold range. In comparison, to write a digital value to a cell, verify cycles are needed to verify whether the cell is within a target resistance or threshold range, and to determine whether more set pulses or program pulses are needed. Storing output values as analog levels instead of digital values can improve the performance of storing the output values in the array of output values, because the verify cycles are not needed.
The input array 110 includes rows of cells from an upper row R1 to a lower row R7, and columns of cells from a left column C1 to a right column C7. In the example, the set of frames of cells is sequenced from a first frame including a memory cell in the upper row R1 and the left column C1 (R1C1) of the input array, to a last frame including a memory cell including a memory cell in the lower row R7 and the right column C7 (R7C7) of the input array.
Writing circuitry (1150,
Writing circuitry (1150,
The third frame 115 includes analog values 0.7 MΩ, 0.4 MΩ, 0.4 MΩ and 0.5 MΩ in cells at respective row/column addresses R1C5, R1C6, R2C5 and R2C6, so a maximum analog value among cells in the third frame 115 is 0.7 MΩ. The output value 0.7 MΩ in the array of output values corresponds to the third frame 115, and indicates the maximum analog value among the cells in the third frame 115.
Writing circuitry (1150,
The fourth frame 117 includes analog values 0.6 MΩ and 0.4 MΩ in cells at respective row/column addresses R1C7 and R2C7, so a maximum analog value among cells in the fourth frame 117 is 0.6 MΩ. The output value 0.6 MΩ in the array of output values corresponds to the fourth frame 117, and indicates the maximum analog value among the cells in the fourth frame 117.
Writing circuitry (1150,
The fifth frame 131 includes analog values 0.5 MΩ, 0.3 MΩ, 0.6 MΩ and 0.6 MΩ in cells at respective row/column addresses R3C1, R3C2, R4C1 and R4C2, so a maximum analog value among cells in the fifth frame 131 is 0.6 MΩ. The output value 0.6 MΩ in the array of output values corresponds to the fifth frame 131, and indicates the maximum analog value among the cells in the fifth frame 131.
Writing circuitry (1150,
The last frame 177 includes an analog value 0.8 MΩ in a cell at a row/column address R7C7, so a maximum analog value among cells in the sixth frame 177 is 0.6 MΩ. The output value 0.6 MΩ in the array of output values corresponds to the last frame 177, and indicates the maximum analog value among the cells in the last frame 177.
Writing circuitry (1150,
In this example, a function can determine an average analog value among cells in a last frame 177 in the set of frames in the first block of memory cells 110 to generate a last output value in the array of output values. The last frame 177 is sequenced from the first frame 111 (
The last frame 177 includes an analog value 0.8 MΩ in a cell at a row/column address R7C7, so an average analog value among cells in the sixth frame 177 is 0.8 MΩ. The output value 0.6 MΩ in the array of output values corresponds to the last frame 177, and indicates the average analog value among the cells in the last frame 177.
Writing circuitry (1150,
In this example, a function can determine a minimum analog value among cells in a last frame 177 in the set of frames in the first block of memory cells 110 to generate a last output value in the array of output values. The last frame 177 is sequenced from the first frame 111 (
The last frame 177 includes an analog value 0.8 MΩ in a cell at a row/column address R7C7, so a minimum analog value among cells in the sixth frame 177 is 0.8 MΩ. The output value 0.8 MΩ in the array of output values corresponds to the last frame 177, and indicates the minimum analog value among the cells in the last frame 177.
Writing circuitry (1150,
The writing circuitry (e.g. 1150,
Before a process starts to execute in-place pooling according to a function over the input array to generate an array of output values, the second block of memory cells can be set to an upper limit for resistance levels (e.g. 1 MΩ), representing the case when the maximum analog value among cells in a frame in the set of frames in the input array is at or above the upper limit for resistance levels. During the process to execute in-place pooling, if the maximum analog value among cells in a frame in the set of frames in the input array is at or above the upper limit for resistance levels, then no set pulse is applied to a cell in the second block of memory cells.
The writing circuitry (e.g. 1150,
Before a process starts to execute in-place pooling according to a function over the input array to generate an array of output values, the second block of memory cells can be erased to a lower limit for threshold voltage levels (e.g. 1V), representing the case when the maximum analog value among cells in a frame in the set of frames in the input array is at or below the lower limit for threshold voltage levels. During the process to execute in-place pooling, if the maximum analog value among cells in a frame in the set of frames in the input array is at or below the lower limit for threshold voltage levels, then no program pulse is applied to a cell in the second block of memory cells.
The writing circuitry (e.g. 1150,
For a set of frames of cells in the input array, the function can determine a maximum analog value among cells in each frame in the set of frames to generate the array of output values, where each output value in the array of output values corresponds to a frame in the set of frames, and indicates the maximum analog value among the cells in the frame in the set of frames.
In-place pooling according to a different function can be executed over a set of frames of cells in the input array 1110. For instance, in an alternative embodiment, the function can determine an average analog value among cells in each frame in the set of frames to generate the array of output values. In yet another alternative embodiment, the function can determine a sum of analog values among cells in each frame in the set of frames to generate the array of output values.
Pooling circuitry 1140 is operatively coupled to the first block of memory cells 1110 to execute in-place pooling according to a function over the input array to generate an array of output values, via analog sensing circuitry 1139. For instance, pooling circuitry 1140 can determine a maximum analog value among cells in each frame in the set of frames in the input array 1110. Cells in a frame of cells in the input array 1110 can be coupled to pooling circuitry 1140 via lines 1115.
Writing circuitry 1150 is operatively coupled to the second block of memory cells 1130 to store the array of output values in the second block of memory cells 1130. Writing circuitry 1150 operatively coupled to the second block is configured to store an analog level in each cell of the second block for the array of output values, for instance, according to a maximum analog value among cells in each frame in the set of frames in the input array 1110. Writing circuitry 1150 can be coupled to pooling circuitry 1140 via lines 1145, and coupled to the second block of memory cells 1130 via lines 1155.
Writing circuitry 1150 can apply a sequence of write pulses for each cell in the second block having a number of write pulses determined according to a corresponding output value in the array of output values, where the analog levels in the second block of memory cells can include resistance levels or threshold voltage levels. An output value in the array of output values can correspond to a maximum analog value among cells in a frame in the set of frames. For instance, a higher maximum analog value among cells in a frame can correspond to a greater number of write pulses than a lower maximum analog value among cells in a frame, or vice versa.
Writing circuitry 1150 can apply a sequence of write pulses for each cell in the second block having a pulse duration determined according to a corresponding output value in the array of output values, where the analog levels in the second block of memory cells can include resistance levels or threshold voltage levels. An output value in the array of output values can correspond to a maximum analog value among cells in a frame in the set of frames. For instance, a higher maximum analog value among cells in a frame can correspond to a longer pulse duration than a lower maximum analog value among cells in a frame, or vice versa.
Writing circuitry 1150 can apply a sequence of write pulses for each cell in the second block having a tail length of a write pulse determined according to a corresponding output value in the array of output values, where the analog levels in the second block of memory cells can include resistance levels. An output value in the array of output values can correspond to a maximum analog value among cells in a frame in the set of frames. For instance, a higher maximum analog value among cells in a frame can correspond to a longer tail length of a write pulse than a lower maximum analog value among cells in a frame, or vice versa.
At Step 1220, the second block of memory cells can be configured. As described in reference to
At Step 1220, the second block of memory cells can be initialized. The second block of memory cells can comprise programmable resistance memory cells having resistance levels, or charge storage memory cells having threshold voltage levels. Where the analog levels in the second block of memory cells include resistance levels, Step 1220 can include setting the second block of memory cells to an upper limit for resistance levels (e.g. 1 MΩ). For example, the upper limit for resistance levels can represent the case when the maximum analog value among cells in a frame in the set of frames in the input array is at or above the upper limit for resistance levels. Where the analog levels in the second block of memory cells include threshold voltage levels, Step 1220 can include erasing the second block of memory cells to a lower limit for threshold voltage levels (e.g. 1V). For example, the lower limit for threshold voltage levels can represent the case when the maximum analog value among cells in a frame in the set of frames in the input array is at or below the lower limit for threshold voltage levels. The order of Steps 1210 and 1220 as shown in the flowchart does not indicate the order in which Steps 1210 and 1220 can be executed. For instance, Step 1220 can be executed before or after Step 1210.
At Step 1230, in-place pooling can be executed according to a function over the input array to generate an array of output values. Analog sensing circuitry (1139,
At Step 1240, the writing circuitry operatively coupled to the second block can store an analog level in each cell of the second block for the array of output values. The writing circuitry can apply a sequence of write pulses for each cell in the second block having a number of write pulses determined according to a corresponding output value in the array of output values, where cells in the second block of memory cells can include resistance levels or threshold voltage levels. The writing circuitry can apply a sequence of write pulses for each cell in the second block having a pulse duration determined according to a corresponding output value in the array of output values, where cells in the second block of memory cells can include resistance levels or threshold voltage levels. The writing circuitry can apply a sequence of write pulses for each cell in the second block having a tail length of a write pulse determined according to a corresponding output value in the array of output values, where the analog levels in the second block of memory cells can include resistance levels.
The integrated circuit 1300 includes address generation circuits 1350 that apply addresses for a set of frames of cells in the input array to the first block of memory cells in coordination with the pooling circuitry. Address generation circuits 1350 can include an input array address generator 1351, and an output array address generator 1353. The input array address generator 1351 is coupled to address lines 1361 which in turn are coupled to the first block of memory cells 110. The output array address generator 1353 is coupled to address lines 1363 which in turn are coupled to the second block of memory cells 130. The first block of memory cells 110 is coupled to analog sensing circuitry 1380 via lines 1371, for executing in-place pooling according to a function over the input array to generate an array of output values. The second block of memory cells 130 is coupled to the analog sensing circuitry 1380 via lines 1373, for storing the array of output values in the second block of memory cells. Addresses are supplied on bus 1340 to the input array address generator 1351, and the output array address generator 1353.
In one embodiment, the first block of memory cells 110, and the second block of memory cells 130 can be configured in separate blocks of cells, and the input array address generator 1351, and the output array address generator 1353 can be separate address generators, including respective row decoders for word lines and column decoders for bit lines. In an alternative embodiment, the first block of memory cells 110, and the second block of memory cells 130 can be configured in a common block of cells. In this embodiment, the first and second arrays of cells can share word lines coupled to a common row decoder, and have respective column decoders for bit lines coupled to respective arrays of cells. In one alternative embodiment, the first block of memory cells 110 and the second block of memory cells 130 can be configured in different blocks of cells in the same plane.
Data is supplied via the data-in line 1395 from input/output ports on the integrated circuit 1300 or from other data sources internal or external to the integrated circuit 1300, to the first block of memory cells 110. Data supplied via the data-in line 1395 can include an input array to be stored in the first block of memory cells 110. In the illustrated embodiment, other circuitry 1390 is included on the integrated circuit, such as a general purpose processor or special purpose application circuitry, or a combination of modules providing system-on-a-chip functionality supported by the memory array. Data is supplied via the data-out line 1385 from the analog sensing circuitry 1380 to input/output ports on the integrated circuit 1300, or to other data destinations internal or external to the integrated circuit 1300. Data supplied via the data-out line 1385 can include the array of output values stored in the second block of memory cells 130.
Pooling circuitry 1310 can execute in-place pooling according to a function over the input array to generate an array of output values. Writing circuitry 1315 operatively coupled to the second block can change an analog level of a cell in the output array. Pooling circuitry 1310 and writing circuitry 1315 implemented in this example using bias arrangement state machine control the application of bias arrangement supply voltages 1320 generated or provided through the voltage supply or supplies in block 1320, such as read, program and erase voltages.
Pooling circuitry 1310 and writing circuitry 1315 can be implemented using special-purpose logic circuitry as known in the art. In alternative embodiments, pooling circuitry 1310 and writing circuitry 1315 can comprise a general-purpose processor, which can be implemented on the same integrated circuit to control the operations of the device. In yet other embodiments, a combination of special-purpose logic circuitry and a general-purpose processor can be utilized for implementation of pooling circuitry 1310 and writing circuitry 1315.
While the present invention is disclosed by reference to the preferred embodiments and examples detailed above, it is to be understood that these examples are intended in an illustrative rather than in a limiting sense. It is contemplated that modifications and combinations will readily occur to those skilled in the art, which modifications and combinations will be within the spirit of the invention and the scope of the following claims.
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