Emblem 11, substrate base 22, and formed foundation 26 have first and second oppositely facing surfaces, the first surface facing the user (upwardly in FIGS. 3, 7), the second surface facing oppositely from the first surface. First surface 28 of substrate base 22 supports second surface 30 of emblem 11. Second surface 32 of substrate base 22 is in-mold bonded to first surface 34 of formed foundation 26. In the preferred embodiment, a bonding layer 36, provided by the above noted adhesive layer, bonds emblem 11 to substrate base 22 to provide the noted subcomponent 24. In one embodiment, bonding layer 36 is a pressure-sensitive adhesive layer adhesively bonding emblem 11 to substrate base 22. In another embodiment, bonding layer 36 is a heat-seal adhesive bonding emblem 11 to substrate base 22. In another embodiment, adhesive layer 36 may or may not be eliminated, and emblem 11 is sonically welded to substrate base 22. A removable heat-resistive carrier film 10 is preferably provided on first surface 38 of emblem 11, as in the '022 patent. Carrier film is between first surface 38 of emblem 11 and a mold surface 40 during in-molding of formed foundation 26, to be described.
It is preferred that subcomponent 24 is compressible, to provide a soft look and feel. In one embodiment, emblem 11 is compressible and substrate base 22 is incompressible, to be described. In such embodiment, substrate base 22 may be rigid or may be formable and bendable around emblem 11 so that the emblem is at least partially embedded in the substrate base, to be described. In another embodiment, both emblem 11 and substrate base 22 are compressible. In a yet further embodiment, each of emblem 11 and substrate base 22 are incompressible. Formed foundation 26 is preferably rigid. In some embodiments, at least of one emblem 11 and substrate base 22 includes a layer of vinyl. In other embodiments, at least one of emblem 11 and substrate base 22 includes a layer of foam plastic, leather, or simulated leather. In some embodiments, emblem 11 includes a layer 2 as in the noted '022 patent providing a bright metallic appearance, preferably a metallized layer. In some embodiments, substrate base 22 is provided by a flexible textured vinyl or cloth. In further embodiments, emblem 11 is radio frequency formed and/or cut, as in the '022 patent, prior to in-molding of formed foundation 26. In further embodiments, emblem 11 is at least partially embedded in substrate base 22, and the substrate base is a plastic sheet and is at least one of: a) formable and bendable around emblem 11; and b) compressible beneath emblem 11.
In
In
In each of the embodiments of
In further embodiments, the substrate base may have a limited lateral extent. Rather than spanning the entire mold cavity as in
The substrate base and mold surfaces need not be flat and rectilinear, but may have various contours and curves, for example as shown at mold halves 48a and 42b in
The present system provides a method of making an in-mold decorated component. The method includes providing a three-dimensional elevational emblem 11, supporting the emblem on a substrate base 22 to provide a subcomponent 24, placing the subcomponent in an injection mold, injecting molten plastic against the subcomponent to fuse therewith and form an injection molded part including a formed foundation 26 in-molded to and supporting subcomponent 24, and removing the part from the injection mold to provide the in-mold decorated component. Each of the emblem 11, the substrate base 22, and the formed foundation 26 has first and second oppositely facing surfaces, the first surface facing the user, and the second surface facing oppositely from the first surface. The method includes supporting emblem 11 at the second surface 30 thereof on the first surface 28 of the substrate base 22, and injecting molten plastic against the second surface 32 of the substrate base 22 to fuse therewith such that the first surface 34 of the formed foundation 26 is in-molded to the second surface 32 of the substrate base 22. The method includes bonding the emblem 11 at the second surface 30 thereof to the first surface 28 of the substrate base 22, e.g. by adhesive film 36 or various alternatives such as noted above, prior to the noted step of injecting molten plastic. The method includes in the preferred embodiment at least partially embedding emblem 11 in substrate base 22 during the step of forming the injection molded part, by at least one of: a) compressing the emblem 11; b) forming and bending the substrate base 22 around the emblem 11; and c) compressing the substrate base 22 beneath the emblem 11. In one embodiment, the method involves compressing the emblem 11 during the step of injecting molten plastic. In other embodiment, the method includes additionally or alternatively forming and bending substrate base 22 around emblem 11 during the step of injecting molten plastic. In another embodiment, the method involves additionally or alternatively compressing substrate base 22 beneath emblem 11 during the step of injecting molten plastic. In another embodiment, the method involves both compressing emblem 11 during the step of injecting molten plastic and simultaneously forming and bending substrate base 22 around emblem 11 during the step of injecting molten plastic. In another embodiment, the method involves both compressing emblem 11 during the step of injecting molten plastic and simultaneously compressing substrate base 22 beneath emblem 11 during the step of injecting molten plastic. In another embodiment, the method includes all of: compressing emblem 11 during the step of injecting molten plastic; and simultaneously forming and bending substrate base 22 around emblem 11 during the step of injecting molten plastic; and simultaneously compressing substrate base 22 beneath emblem 11 during the step of injecting molten plastic. The component has a first surface facing the user, and an oppositely facing second surface, and preferably an embedded profile is provided on the first surface of the component, and the method includes forming an embedded profile on the first surface of the component against a mold surface 50 which is non-conforming to the profile such that the profile is independent of mold geometry at mold surface 50, whereby the same mold may be used for differing emblems 11 without having to change molds 48, 42a or use custom molds.
In the foregoing description, certain terms have been used for brevity, clearness, and understanding. No unnecessary limitations are to be implied therefrom beyond the requirement of the prior art because such terms are used for descriptive purposes and are intended to be broadly construed. The different configurations, systems, and method steps described herein may be used alone or in combination with other configurations, systems and method steps. It is to be expected that various equivalents, alternatives and modifications are possible within the scope of the appended claims.
This application claims the benefit of and priority from provisional U.S. Patent Application No. 60/786,344, filed Mar. 27, 2006.
Number | Date | Country | |
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60786344 | Mar 2006 | US |