In situ thermal treatment for PBF systems

Information

  • Patent Grant
  • 11885000
  • Patent Number
    11,885,000
  • Date Filed
    Thursday, December 19, 2019
    4 years ago
  • Date Issued
    Tuesday, January 30, 2024
    3 months ago
Abstract
Apparatuses and methods for in situ thermal treatment for PBF systems are provided. An apparatus for a PBF-based 3-D printer can include a heating element for heating a gas, wherein the heated gas is delivered via at least one port of the 3-D printer to conduct heat treatment on a build piece during printing. A method for thermal treatment in a PBF-based 3-D printer can include heating a gas and delivering it via at least one port of the 3-D printer arranged proximate a build piece to conduct heat treatment during printing. An apparatus for a PBF-based 3-D printer can include a temperature-regulating element for changing a temperature of a gas, at least one channel for delivering the gas to a plurality of ports, and a controller for determining gas temperatures and durations of application of the gas via different ones of the plurality of the ports.
Description
BACKGROUND
Field

The present disclosure relates generally to powder-bed fusion (PBF) systems, and more particularly, to in situ thermal treatment for PBF systems.


Background

PBF systems can produce structures (referred to as build pieces) with geometrically complex shapes, including some shapes that are difficult or impossible to create with conventional manufacturing processes. PBF systems create build pieces layer-by-layer, i.e., slice-by-slice. Each slice can be formed by a process of depositing a layer of powder and applying an energy beam to melt areas of the powder layer that coincide with the cross-section of the build piece in the layer. The melted powder cools and fuses to form a slice of the build piece. The process can be repeated to form the next slice of the build piece, and so on, until the build piece is complete. Because each layer is deposited on top of the previous layer, it can be useful to think of PBF as forming a build piece slice-by-slice from the ground up.


A persisting challenge with PBF systems relates to the residual cracking or distortion that may occur in build pieces as a result of high temperature gradients in the powder bed where the layers are deposited. Practitioners have often implemented additional post-processing heat treatment steps to ameliorate the adverse effects of these temperature gradients. These steps are often marginally successful while resulting in longer overall build times.


SUMMARY

Several aspects of apparatuses and methods for in situ thermal treatment for PBF systems will be described more fully hereinafter.


In various aspects, a thermal treatment apparatus for a PBF-based three-dimensional (3-D) printer can include a heating element for heating a gas, wherein the heated gas is delivered via at least one port of the 3-D printer, the port being positioned to conduct heat treatment on a build piece during printing.


In various aspects, a method for thermal treatment in a PBF-based 3-D printer can include heating a gas and delivering the heated gas via at least one port of the 3-D printer arranged proximate a build piece to conduct heat treatment on the build piece during printing.


In various aspects, a thermal treatment apparatus for a PBF-based 3-D printer can include a temperature-regulating element for changing a temperature of a gas, at least one channel for delivering the gas to a plurality of ports distributed at different vertical regions of the build piece, and a controller for determining gas temperatures and durations of application of the gas via different ones of the plurality of the ports, wherein the temperature-regulating element is directed to variably deliver, during the 3-D print, the gas to different ones of the plurality of ports at different ones of the determined gas temperatures and durations of application to stabilize the thermal properties of the build piece.


Other aspects will become readily apparent to those skilled in the art from the following detailed description, wherein is shown and described only several embodiments by way of illustration. As will be realized by those skilled in the art, concepts herein are capable of other and different embodiments, and several details are capable of modification in various other respects, all without departing from the present disclosure. Accordingly, the drawings and detailed description are to be regarded as illustrative in nature and not as restrictive.





BRIEF DESCRIPTION OF THE DRAWINGS

Various aspects of apparatuses and methods for in situ thermal treatment for PBF systems will now be presented in the detailed description by way of example, and not by way of limitation, in the accompanying drawings, wherein:



FIG. 1A-D illustrate an example PBF system during different stages of operation.



FIG. 2 illustrates an exemplary energy beam source and deflector system.



FIGS. 3A-B illustrate a perspective view of an exemplary powder bed before and after a layer of powder is deposited.



FIG. 4 illustrates an exemplary thermal treatment apparatus system working in conjunction with a PBF-based printer.



FIG. 5 illustrates an exemplary method for thermal treatment in a PBF-based 3-D printer.





DETAILED DESCRIPTION

The detailed description set forth below in connection with the appended drawings is intended to provide a description of various exemplary embodiments of the concepts disclosed herein and is not intended to represent the only embodiments in which the disclosure may be practiced. The term “exemplary” used in this disclosure means “serving as an example, instance, or illustration,” and should not necessarily be construed as preferred or advantageous over other embodiments presented in this disclosure. The detailed description includes specific details for the purpose of providing a thorough and complete disclosure that fully conveys the scope of the concepts to those skilled in the art. However, the disclosure may be practiced without these specific details. In some instances, well-known structures and components may be shown in block diagram form, or omitted entirely, in order to avoid obscuring the various concepts presented throughout this disclosure.


This disclosure is directed to techniques for managing residual stresses, microstructure, and other processing artifacts that occur in build pieces produced via PBF additive manufacturing (AM)-based systems. PBF AM processes are used in the manufacture of metallic structures and components in an increasing number of industries. PBF AM processes cause development of residual stresses in the printed build piece. The extent of these residual stresses may vary depending on factors like the material used and build piece geometry. Generally, these residual stresses originate as a result of a high cooling rate dictated by the temperature differences between the melt pool and the build plate.


While applicable to all PBF systems in general, particularly in laser-based PBF (L-PBF) systems, the temperature gradient between the melt pool and the previous layers deposited in the powder bed continues to increase as additional layers are added onto the build piece. As a result, build pieces in L-PBF systems often require additional post-AM treatment steps including stress relief measures to avoid part distortion upon removal of the build piece from the build plate. Materials that have high thermal conductivity and a low specific heat are generally more prone to such distortion, and may require more significant post-AM attention.


For example, one conventional measure to address this issue is for the manufacturer to pre-calculate the expected stress and anticipated distortion. After 3-D printing, the manufacturer removes the build plate with the build piece from the 3-D printer and places the collective structure into a dedicated oven for applying the pre-calculated heat and for addressing other variables to reduce stress. One disadvantage of this approach is that the parameters of the predicted solution often are difficult to precisely match with the actual results after heat treatment is conducted, and a certain amount of distortion still occurs. This mismatch is often proportional to the complexity of the build piece, with greater mismatches more evident in complex parts.


In addition to residual stress generation and distortion problems, certain materials used in PBF systems require the resulting build piece to undergo post-AM heat treatment operations to obtain the required microstructure and properties. Heat treatment operations are conducted on the build piece as a series of post-processing steps. These steps can add significant additional time to the overall manufacturing process beyond just the AM production of the build piece. The additional time necessary for thermal post-processing can be appreciably longer, for example, than the comparatively short period of time associated with manufacturing the structure using a non-AM technique such as casting, forging, or welding. In PBF AM processes, the 3-D printing time can in many cases be more comparable to the subsequent heat-treatment durations. These post-AM operations may undesirably add a significant amount of time to the overall product build.


The present disclosure addresses the above problems associated with conventional post-processing techniques. An in situ thermal treatment apparatus (“TTA”) for PBF-based systems includes a gas delivery structure that can deliver heated gas used for clearing the plume generated during L-PBF fusion. In various embodiments, TTA is partially or fully integrated with the PBF 3-D printer. In another embodiment, TTA is a separate apparatus that can be retrofitted to or otherwise operably coupled to the 3-D printer. TTA may utilize any suitable heat source. TTA may deliver heated gas not only to the top layer of the print bed, but also to the printed material below the melt pool, e.g., via TTA's internal ports or channels, and above the build plate. Channels that carry heated gas to port(s) used for the thermal treatment processes may be built into the print bed or other portion of the 3-D printer, or may be subsequently added to the 3-D printer by substituting parts, retrofitting structures, and/or by modifying the 3-D printer itself.


In an embodiment, TTA includes a controller, a gas source, a heating element, a plurality of sensors, and a plurality of ports, each acting in concert to perform in situ operations on a 3-D printed part. In an embodiment, TTA includes at least one channel leading to a port arranged on or proximate the build layer of the 3-D printer and one or more channels leading to ports arranged in the lower chamber of the 3-D printer, such as where the manufactured portion of the build piece is lowered as the printing process progresses. Each port may be connected via a channel to a heating apparatus. The heated gas may flow from the heating element via a single channel for efficiency, and thereafter branch off to a plurality of channels, each channel of the plurality leading to a port arranged at a strategic location for conducting heat treatment operations.


The heating element may receive a gas, which may be, for example, an inert gas, from a gas source. The heating element may heat the gas to a desired temperature based on the determined residual stress relief or further heat treatment of the part, and may deliver the gas. The TTA ports may be integrated within existing PBF-based printers.


In an embodiment, the remaining structure of the TTA may constitute an add-on. That is to say, the TTA may itself comprise an additional, self-contained apparatus that is (optionally) separately provided and then connectable to a PBF-based 3-D printer. The TTA ports may include deflector flaps or other structures to direct the heated gas flow and to ensure that the flow is laminar in nature in the PBF apparatus. TTA may include one or more sensors to obtain or otherwise monitor the temperature. The monitored temperature may be sent to the TTA controller. The TTA controller may, as necessary, instruct the TTA to change the temperature. For example, the TTA controller may communicate with and coordinate operation of the one or more sensors to change the temperature at one or more corresponding locations on or within the TTA.


In an embodiment, the temperature of the top layer is increased during the 3-D printing, e.g., by 100 degrees K, in order to reduce the overall temperature gradient between the top layer and the melt pool, which can minimize the amount of additional heat treatment necessary for a part. While 100 degrees K is used for exemplary purposes, other values may be equally suitable based on system parameters.


Additive Manufacturing (AM). AM involves the use of a stored geometrical model for accumulating layered materials on a build plate to produce a three-dimensional (3-D) build piece having features defined by the model. AM techniques are capable of printing complex components using a wide variety of materials. A 3-D object may be fabricated based on a computer aided design (CAD) model. The CAD model can be used to generate a set of instructions or commands that are compatible with a particular 3-D printer. The AM process can create a solid three-dimensional object using the CAD model and print instructions.


An exemplary AM technique is PBF. PBF systems use a controller that executes the appropriate print instructions to create build pieces layer-by-layer. Each layer is formed by depositing a layer of powder and exposing, per controller instructions, designated portions of the powder to an energy beam such as a laser. The energy beam is applied via a deflector to melt areas of the powder layer that coincide with the cross-section of the build piece in the layer. The melted powder cools and fuses to form a slice of the build piece. The process can be repeated to form the next slice of the build piece, and so on. Each layer is deposited on top of the previous layer. The resulting structure is a build piece assembled slice-by-slice from the ground up.


The present disclosure may use PBF-based 3-D printing in an exemplary implementation, but is not limited to this application. FIG. 1A-D illustrate an example PBF system 100 during different stages of operation. PBF system 100 can include a depositor 101 that can deposit each layer of metal powder, an energy beam source 103 that can generate an energy beam, a deflector 105 that can apply the energy beam to fuse the powder material, and a build plate 107 that can support one or more build pieces, such as a build piece 109. PBF system 100 can also include a build floor 111 positioned within a powder bed receptacle. The walls of the powder bed receptacle are shown as powder bed receptacle walls 112. Build floor 111 can lower build plate 107 so that depositor 101 can deposit a next layer and a chamber 113 that can enclose the other components. Depositor 101 can include a hopper 115 that contains a powder 117, such as a metal powder, and a leveler 119 that can level the top of each layer of powder.


Referring specifically to FIG. 1A, this figure shows PBF system 100 after a slice of build piece 109 has been fused, but before the next layer of powder has been deposited. In fact, FIG. 1A illustrates a time at which PBF system 100 has already deposited and fused slices in multiple layers, e.g., 50 layers, to form the current state of build piece 109, e.g., formed of 50 slices. The multiple layers already deposited have created a powder bed 121, which includes powder that was deposited but not fused. PBF system 100 can include a temperature sensor 122 that can sense the temperature in areas of the work area, such as the surface of powder bed, build piece 109, etc. For example, temperature sensor 122 can include a thermal camera directed toward the work area, thermocouples attached to areas near the powder bed, etc.



FIG. 1B shows PBF system 100 at stage in which build floor 111 can lower by a powder layer thickness 123. The lowering of build floor 111 causes build piece 109 and powder bed 121 to drop by powder layer thickness 123, so that the top of the build piece and powder bed are lower than the top of powder bed receptacle wall 112 by the powder layer thickness. In this way, for example, a space of with a consistent thickness equal to powder layer thickness 123 can be created over the tops of build piece 109 and powder bed 121.



FIG. 1C shows PBF system 100 at a stage in which depositor 101 can deposit powder 117 in the space created over the tops of build piece 109 and powder bed 121. In this example, depositor 101 can cross over the space while releasing powder 117 from hopper 115. Leveler 119 can level the released powder to form a powder layer 125 that has a thickness of powder layer thickness 123. It should be noted, that elements of FIGS. 1A-D and the other figures in this disclosure are not necessarily drawn to scale, but may be drawn larger or smaller for the purpose of better illustration of concepts described herein. For example, the illustrated thickness of powder layer 125 (i.e., powder layer thickness 123) is greater than an actual thickness used for the example 50 previously-deposited layers.



FIG. 1D shows PBF system 100 at a stage in which energy beam source 103 can generate an energy beam 127 and deflector 105 can apply the energy beam to fuse the next slice in build piece 109. In various embodiments, energy beam source 103 can be an electron beam source, energy beam 127 can be an electron beam, and deflector 105 can include deflection plates that can generate an electric field that deflects the electron beam to scan across areas to be fused. In various embodiments, energy beam source 103 can be a laser, energy beam 127 can be a laser beam, and deflector 105 can include an optical system that can reflect and/or refract the laser beam to scan across areas to be fused. In various embodiments, energy beam source 103 and/or deflector 105 can modulate the energy beam, e.g., turn the energy beam on and off as the deflector scans so that the energy beam is applied only in the appropriate areas of the powder layer. For example, in various embodiments, the energy beam can be modulated by a digital signal processor (DSP).



FIG. 2 illustrates an exemplary energy beam source and deflector system. In this example, the energy beam is an electron beam. The energy beam source can include an electron grid 201, an electron grid modulator 203, and a focus 205. A controller 206 can control electron grid 201 and electron grid modulator 203 to generate an electron beam 207 and can control focus 205 to focus electron beam 207 into a focused electron beam 209. To provide a clearer view in the figure, connections between controller 206 and other components are not shown. Focused electron beam 209 can be scanned across a powder layer 211 by a deflector 213. Deflector 213 can include two x-deflection plates 215 and two y-deflection plates 217. Controller 206 can control deflector 213 to generate an electric field between x-deflection plates 215 to deflect focused electron beam 209 along the x-direction and to generate an electric field between y-deflection plates 217 to deflect the focused electron beam along the y-direction. In various embodiments, a deflector can include one or more magnetic coils to deflect the electron beam.


A beam sensor 219 can sense the amount of deflection of focused electron beam 209 and can send this information to controller 206. Controller 206 can use this information to adjust the strength of the electric fields in order to achieve the desired amount of deflection. Focused electron beam 209 can be applied to powder layer 211 by scanning the focused electron beam to melt loose powder 221, thus forming fused powder 223.



FIGS. 3A-B illustrate a perspective view of an exemplary powder bed before and after a layer of powder is deposited. FIG. 3A shows a powder bed 301 after a scanning process has occurred. The figure shows a top surface of an nth build piece slice 303, which is a slice formed by an energy beam source/deflector 305 scanning an energy beam to fuse powder in an nth powder layer 307 (where n is the number of the powder layer). FIG. 3B shows a state of powder bed 301 after a next powder layer, i.e., nth+1 powder layer 309, has been deposited. The figure also shows an outline of the next slice to be fused, i.e., an outline of nth+1 slice 311.


TTA. FIG. 4 depicts a conceptual illustration of a TTA system working in conjunction with a PBF-based printer.


The controller 400 may include a processing system having one or more processors and a memory for storing and executing code that conducts the in situ operations. In some embodiments, the controller 400 may be integrated with or part of the central controller of the printer. In other embodiments, the controller 400 may be a dedicated controller, or a controller built within the TTA.


The heating apparatus/element 410 may generate heat to provide a temperature as controlled by the controller 400 via the controlling sensor 420. The monitoring sensor 430 can measure the temperature and report it back to the controller 400. During in situ operations, the heat input (gas) source 440 transfers a stored inert gas or other substance to the heating element 410. The heating element 410 heats the gas to a desired temperature as determined by the controller 400, and delivers the heated gas (or equivalently, a separate delivery structure coupled to the heating element 410 delivers the heated gas) via one or more channels 450, 451, and 452 to ports 460, 461, and 462.


Ports 460, 461, and 462 in this embodiment are strategically positioned at different locations to provide optimal heat treatment to different portions of the build piece. Thus, the port (460, 461, and 462) outlets may be located at different locations on or adjacent the current layer being deposited in the print bed, or above or beneath the build plate 470 of the PBF apparatus, including the lowering chamber, to optimally access the desired portions of the build piece that may necessitate stress relief or heat treatment. These locations may include both the top, side wall, or other surface of the print bed/print chamber as well as areas adjacent the printed material below the print bed surface.


In an embodiment, associated with each port is a deflector flap (e.g., flaps 480, 481, and 482) that steers the gas in a predetermined directional flow (e.g., gas flows 490, 491, and 492) as the gas exits one or more of ports. The above illustration, including the structure of the apparatus and the number of ports, is for exemplary purposes only, and any number and geometry of heating elements, delivery elements, controlling elements and/or ports may be used to enable in situ heat transfers to occur at desired points within the AM process to optimize 3-D print quality.



FIG. 5 is a flowchart of an exemplary method for thermal treatment in a PBF-based 3-D printer. The method includes heating (500) a gas and delivering (510) the heated gas. For example, the heated gas can be delivered via at least one port of the 3-D printer arranged proximate a build piece to conduct heat treatment on the build piece during printing.


Because the heat treatments are conducted in situ during the actual 3-D printing, they advantageously require substantially less, if any, additional thermal processing time after the 3-D printing process is complete. Thus, multiple operations can be conducted contemporaneously within a single 3-D rendering. Application of thermal treatment during the 3-D rendering maximizes manufacturing efficiency and minimizes overall processing time. Using the features of the present disclosure, the benefits of PBF-based 3-D printing can be realized without the corresponding addition of inefficient post-processing thermal management techniques.


Thus, for example, unlike conventional tooling and machining techniques which often require very expensive precision equipment to manufacture a single type of component, 3-D printing can replace (in part or in whole) these conventional subtractive manufacturing techniques, where desired, to create highly-customized and geometrically-sophisticated structures and components from the ground up. Alternatively, TTA can be used in conjunction with certain of these conventional techniques to augment these techniques and increase their efficiency.


Furthermore, because TTA as disclosed herein enables thermal post-processing operations to take place in situ during the printing, no additional time ordinarily need be delegated to conduct thermal operations later, after having finished build pieces. The total post-processing time associated with any given build piece (which may include, for example, removing 3-D print supports) is therefore reduced. A related advantage is that providing heat operations in situ enables the thermal operations to be selectively applied to the build piece prior to the build piece being complete. For example, stress relief operations can provide heat to a larger surface area of a potentially problematic structure, before additional material covers the structure and adds additional forces and or covers materials that otherwise could have been heat treated in an uncovered state (e.g., the top layer). By virtue of its multiple ports, TTA may also deliver heated gas to clear generated plume (in embodiments where desirable) over a greater area.


Thus, because the TTA may have ports that enable dynamic temperature control over different levels of the build piece at different stages in time during (and optionally, immediately after) the 3-D print, the thermal treatment can be more precise than compared with the conventional case of the build piece being removed and the entire heat treatment occurring solely after the print is complete. Using the TTA, overall quality of the finished structure may therefore be increased.


As noted above, in one embodiment the temperature gradient of the top layer is reduced substantially prior to being melted by applying heat to the top layer, e.g., by increasing the temperature of the top layer, during the 3-D print process. This act can substantially decrease the amount of stress placed on the build piece because the temperature gradient between the melt pool and remaining portions of the top layer of the build piece is lower.


Exemplary heat treatment techniques. In an embodiment, in situ stress reduction techniques can be applied to aluminum alloys. For example, aluminum alloys ordinarily have a coefficient of thermal expansion of about 20×10−6 m/(m K) and, as such, are susceptible to developing residual stresses that result in distortion of the build piece upon separation from the build plate. Based on the known thermal expansion, every 100-degree C. increase in part temperature results in a decrease of 0.002 elastic strain, which translates to an approximately 140 MPa residual stress reduction that can be applied via equalizing the thermal gradients experienced by the alloy using the techniques herein. While a variety of materials can benefit from this procedure, this stress reduction operation is significant in aluminum alloys as it can represent one third to one half of the fatigue strength of the material, in some cases.


In another embodiment, maraging steels are aged at a temperature such that the steel's microstructure includes one-hundred percent (100%) martensite. The martensite is formed upon transformation from austenite, which is hard to maintain during continuous cooling. An ageing operation at a temperature where the austenite is stable over a long period of time is required prior to transformation to martensite. The maraging heat treatment operations may involve sustained heat treatment at comparatively low temperatures (e.g., about 500° C., for example). TTA can be configured to apply in situ thermal treatment to age the material to obtain the martensite phase during 3-D printing. The controller may enable TTA to apply an in situ treatment capable of balancing the temperature and time in accordance with the ageing requirements of the print material.


Unlike in post-processing operations whose capabilities are circumscribed by the completed build piece, in the case with TTA the layers that are printed first can be exposed to the gas at a lower temperature for longer time. Conversely, the subsequently printed layers can be exposed for a shorter time to a higher temperature gas, each according to the Temperature-Time Transformation relation. The result is an optimally-aged material at the conclusion of the 3-D printing process.


For example, the cooling rate of a build chamber can be selectively regulated at different levels during the 3-D print operation by changing the temperature of the gas at different levels at different times. Therefore, the TTA can ensure that during an exemplary ten hour print, the lower layers are at a lower temperature for a longer time and the higher layers are at a higher temperature for a shorter time, thereby equalizing the microstructure changes. To equalize the temperatures and minimize the overall stress to the part, the temperatures and times for that application of temperature can be calculated in advance or on the fly. Equalizing temperatures can thereupon be applied via the gas delivered across the top, bottom and middle portions of the build piece such that lower portions are proportionately heated and higher portions are proportionately cooled.


This in situ selective equalization can enable the overall part to have the same properties. This technique is in contrast to prior approaches, wherein the quenching and ageing of the part take place in time-consuming operations after the print, conventionally resulting in both inefficiency of the overall build and an inherent uncertainty in the quenching and ageing operations to equalize the non-uniform thermal properties of the part. The in situ thermal treatment can be used to replace this conventional process, saving time and minimizing thermal stresses.


The present disclosure is provided to enable any person skilled in the art to practice the various aspects described herein. Various modifications to these exemplary embodiments presented throughout the present disclosure will be readily apparent to those skilled in the art, and the concepts disclosed herein may be applied to other techniques for in-situ thermal treatment for PBF systems. Thus, the claims are not intended to be limited to the exemplary embodiments presented throughout the disclosure, but are to be accorded the full scope consistent with the language claims. All structural and functional equivalents to the elements of the exemplary embodiments described throughout the present disclosure that are known or later come to be known to those of ordinary skill in the art are intended to be encompassed by the claims. Moreover, nothing disclosed herein is intended to be dedicated to the public regardless of whether such disclosure is explicitly recited in the claims. No claim element is to be construed under the provisions of 35 U.S.C. § 112(f), or analogous law in applicable jurisdictions, unless the element is expressly recited using the phrase “means for” or, in the case of a method claim, the element is recited using the phrase “step for.”

Claims
  • 1. A powder bed fusion (PBF)-based three-dimensional (3-D) printer, comprising: a depositor configured to deposit layers of print material in a chamber of the 3-D printer forming a print bed; anda gas source for delivering a gas,wherein the gas is delivered to at least one port of the 3-D printer, the port positioned below at least one layer of the layers of the print material of the print bed and configured to deliver the gas to the print material below the at least one layer, to conduct thermal treatment on a build piece in the print bed.
  • 2. The printer of claim 1, wherein the thermal treatment comprises residual stress reduction.
  • 3. The printer of claim 1, wherein the thermal treatment comprises ageing a material in the build piece based on a selected gas temperature and thermal treatment duration.
  • 4. The printer of claim 1, wherein the at least one port is coupled to a deflector flap to direct a flow of the delivered gas relative to the build piece.
  • 5. The printer of claim 1, wherein the delivered gas is operable to reduce a temperature difference between a lower portion and an upper portion of the build piece.
  • 6. The printer of claim 1, wherein the at least one port comprises a plurality of ports and at least one of the ports is positioned to deliver the gas to a top layer of the print material deposited in the print bed of the 3-D printer.
  • 7. The printer of claim 6, wherein one or more of the ports are configured to deliver the gas to printed portions of the build piece beneath a melt pool corresponding to the top layer, and above a build plate of the 3-D printer.
  • 8. The printer of claim 1, wherein the 3-D printer comprises a lower chamber into which the build piece is lowered during the printing, andthe at least one port is arranged in the lower chamber.
  • 9. The printer of claim 1, wherein the gas source is coupled to a plurality of channels to supply the gas.
  • 10. The printer of claim 1, further comprising a controller for determining one or more of a temperature, duration, and location, relative to the build piece, of the thermal treatment.
  • 11. The printer of claim 10, further comprising a monitoring sensor coupled to the controller for monitoring a temperature of the gas.
  • 12. The printer of claim 11, wherein the controller is further configured to receive the monitored temperature from the monitoring sensor and to modify the temperature to a new value.
  • 13. The printer of claim 10, further comprising one or more channels extending to the at least one port for transporting the gas.
  • 14. The printer of claim 1, wherein the at least one port comprises a plurality of ports, wherein the gas is delivered to the plurality of ports distributed at different vertical regions of the build piece.
  • 15. The printer apparatus of claim 14, wherein each port is associated with a deflector flap.
  • 16. The printer of claim 1, wherein the at least one port comprises a plurality of ports, wherein at least one of the ports is configured to deliver the gas to clear plume generated during PBF fusion.
  • 17. The printer of claim 1, further comprising a temperature sensor configured to sense a temperature of a work area.
  • 18. The printer of claim 1, wherein the at least one port comprises a plurality of ports, wherein the ports are configured to deliver the gas that enable dynamic temperature control over different levels of the build piece at different stages in time during the 3-D print.
  • 19. The printer of claim 18, wherein the dynamic temperature control includes changing the temperature of the gas at the different levels at different times during the 3-D print.
  • 20. The printer of claim 6, wherein delivery of the gas to the top layer of the print material is prior to the top layer being melted by an energy beam source.
  • 21. The printer of claim 1, wherein conducting the thermal treatment on the build piece includes regulating cooling of the build piece.
  • 22. The printer of claim 1, wherein the at least one port comprises a plurality of ports, wherein one port of the plurality of ports is positioned within the print bed.
  • 23. A powder bed fusion (PBF)-based three-dimensional (3-D) printer, comprising: a depositor configured to deposit print material in a chamber of the 3-D printer forming a print bed; anda gas source for delivering a gas,wherein the gas is delivered to a port, wherein the port is configured to deliver the gas to the print material below a melt pool, to conduct thermal treatment on a build piece in the print bed.
CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of U.S. Provisional Application Ser. No 62/784,282 titled “IN-SITU THERMAL TREATMENT FOR PBF SYSTEMS” and filed on Dec. 21, 2018; the disclosure of which is expressly incorporated herein by reference in its entirety.

US Referenced Citations (360)
Number Name Date Kind
5203226 Hongou et al. Apr 1993 A
5597589 Deckard Jan 1997 A
5742385 Champa Apr 1998 A
5990444 Costin Nov 1999 A
6010155 Rinehart Jan 2000 A
6096249 Yamaguchi Aug 2000 A
6140602 Costin Oct 2000 A
6250533 Otterbein et al. Jun 2001 B1
6252196 Costin et al. Jun 2001 B1
6318642 Goenka et al. Nov 2001 B1
6365057 Whitehurst et al. Apr 2002 B1
6391251 Keicher et al. May 2002 B1
6409930 Whitehurst et al. Jun 2002 B1
6468439 Whitehurst et al. Oct 2002 B1
6554345 Jonsson Apr 2003 B2
6585151 Ghosh Jul 2003 B1
6644721 Miskech et al. Nov 2003 B1
6811744 Keicher et al. Nov 2004 B2
6866497 Saiki Mar 2005 B2
6919035 Clough Jul 2005 B1
6926970 James et al. Aug 2005 B2
7152292 Hohmann et al. Dec 2006 B2
7344186 Hausler et al. Mar 2008 B1
7500373 Quell Mar 2009 B2
7586062 Heberer Sep 2009 B2
7637134 Burzlaff et al. Dec 2009 B2
7710347 Gentilman et al. May 2010 B2
7716802 Stern et al. May 2010 B2
7745293 Yamazaki et al. Jun 2010 B2
7766123 Sakurai et al. Aug 2010 B2
7852388 Shimizu et al. Dec 2010 B2
7908922 Zarabadi et al. Mar 2011 B2
7951324 Naruse et al. May 2011 B2
8094036 Heberer Jan 2012 B2
8163077 Eron et al. Apr 2012 B2
8286236 Jung et al. Oct 2012 B2
8289352 Vartanian et al. Oct 2012 B2
8297096 Mizumura et al. Oct 2012 B2
8354170 Henry et al. Jan 2013 B1
8383028 Lyons Feb 2013 B2
8408036 Reith et al. Apr 2013 B2
8429754 Jung et al. Apr 2013 B2
8437513 Derakhshani et al. May 2013 B1
8444903 Lyons et al. May 2013 B2
8452073 Taminger et al. May 2013 B2
8599301 Dowski, Jr. et al. Dec 2013 B2
8606540 Haisty et al. Dec 2013 B2
8610761 Haisty et al. Dec 2013 B2
8631996 Quell et al. Jan 2014 B2
8668859 Pettis Mar 2014 B2
8675925 Derakhshani et al. Mar 2014 B2
8678060 Dietz et al. Mar 2014 B2
8686314 Schneegans et al. Apr 2014 B2
8686997 Radet et al. Apr 2014 B2
8694284 Berard Apr 2014 B2
8720876 Reith et al. May 2014 B2
8752166 Jung et al. Jun 2014 B2
8755923 Farahani et al. Jun 2014 B2
8787628 Derakhshani et al. Jul 2014 B1
8818771 Gielis et al. Aug 2014 B2
8873238 Wilkins Oct 2014 B2
8978535 Ortiz et al. Mar 2015 B2
9006605 Schneegans et al. Apr 2015 B2
9071436 Jung et al. Jun 2015 B2
9101979 Hofmann et al. Aug 2015 B2
9104921 Derakhshani et al. Aug 2015 B2
9126365 Mark et al. Sep 2015 B1
9128476 Jung et al. Sep 2015 B2
9138924 Yen Sep 2015 B2
9149988 Mark et al. Oct 2015 B2
9156205 Mark et al. Oct 2015 B2
9186848 Mark et al. Nov 2015 B2
9244986 Karmarkar Jan 2016 B2
9248611 Divine et al. Feb 2016 B2
9254535 Buller et al. Feb 2016 B2
9266566 Kim Feb 2016 B2
9269022 Rhoads et al. Feb 2016 B2
9327452 Mark et al. May 2016 B2
9329020 Napoletano May 2016 B1
9332251 Haisty et al. May 2016 B2
9346127 Buller et al. May 2016 B2
9389315 Bruder et al. Jul 2016 B2
9399256 Buller et al. Jul 2016 B2
9403235 Buller et al. Aug 2016 B2
9418193 Dowski, Jr. et al. Aug 2016 B2
9457514 Schwärzler Oct 2016 B2
9469057 Johnson et al. Oct 2016 B2
9478063 Rhoads et al. Oct 2016 B2
9481402 Muto et al. Nov 2016 B1
9486878 Buller et al. Nov 2016 B2
9486960 Paschkewitz et al. Nov 2016 B2
9502993 Deng Nov 2016 B2
9525262 Stuart et al. Dec 2016 B2
9533526 Nevins Jan 2017 B1
9555315 Aders Jan 2017 B2
9555580 Dykstra et al. Jan 2017 B1
9557856 Send et al. Jan 2017 B2
9566742 Keating et al. Feb 2017 B2
9566758 Cheung et al. Feb 2017 B2
9573193 Buller et al. Feb 2017 B2
9573225 Buller et al. Feb 2017 B2
9586290 Buller et al. Mar 2017 B2
9595795 Lane et al. Mar 2017 B2
9597843 Stauffer et al. Mar 2017 B2
9600929 Young et al. Mar 2017 B1
9609755 Coull et al. Mar 2017 B2
9610737 Johnson et al. Apr 2017 B2
9611667 GangaRao et al. Apr 2017 B2
9616623 Johnson et al. Apr 2017 B2
9626487 Jung et al. Apr 2017 B2
9626489 Nilsson Apr 2017 B2
9643361 Liu May 2017 B2
9662840 Buller et al. May 2017 B1
9665182 Send et al. May 2017 B2
9672389 Mosterman et al. Jun 2017 B1
9672550 Apsley et al. Jun 2017 B2
9676145 Buller et al. Jun 2017 B2
9684919 Apsley et al. Jun 2017 B2
9688032 Kia et al. Jun 2017 B2
9690286 Hovsepian et al. Jun 2017 B2
9700966 Kraft et al. Jul 2017 B2
9703896 Zhang et al. Jul 2017 B2
9713903 Paschkewitz et al. Jul 2017 B2
9718302 Young et al. Aug 2017 B2
9718434 Hector, Jr. et al. Aug 2017 B2
9724877 Flitsch et al. Aug 2017 B2
9724881 Johnson et al. Aug 2017 B2
9725178 Wang Aug 2017 B2
9731730 Stiles Aug 2017 B2
9731773 Gami et al. Aug 2017 B2
9741954 Bruder et al. Aug 2017 B2
9747352 Karmarkar Aug 2017 B2
9764415 Seufzer et al. Sep 2017 B2
9764520 Johnson et al. Sep 2017 B2
9765226 Dain Sep 2017 B2
9770760 Liu Sep 2017 B2
9773393 Velez Sep 2017 B2
9776234 Schaafhausen et al. Oct 2017 B2
9782936 Glunz et al. Oct 2017 B2
9783324 Embler et al. Oct 2017 B2
9783977 Alqasimi et al. Oct 2017 B2
9789548 Golshany et al. Oct 2017 B2
9789922 Dosenbach et al. Oct 2017 B2
9796137 Zhang et al. Oct 2017 B2
9802108 Aders Oct 2017 B2
9809977 Carney et al. Nov 2017 B2
9817922 Glunz et al. Nov 2017 B2
9818071 Jung et al. Nov 2017 B2
9821339 Paschkewitz et al. Nov 2017 B2
9821411 Buller et al. Nov 2017 B2
9823143 Twelves, Jr. et al. Nov 2017 B2
9829564 Bruder et al. Nov 2017 B2
9846933 Yuksel Dec 2017 B2
9854828 Langeland Jan 2018 B2
9858604 Apsley et al. Jan 2018 B2
9862833 Hasegawa et al. Jan 2018 B2
9862834 Hasegawa et al. Jan 2018 B2
9863885 Zaretski et al. Jan 2018 B2
9870629 Cardno et al. Jan 2018 B2
9879981 Dehghan Niri et al. Jan 2018 B1
9884663 Czinger et al. Feb 2018 B2
9898776 Apsley et al. Feb 2018 B2
9914150 Pettersson et al. Mar 2018 B2
9919360 Buller et al. Mar 2018 B2
9931697 Levin et al. Apr 2018 B2
9933031 Bracamonte et al. Apr 2018 B2
9933092 Sindelar Apr 2018 B2
9957031 Golshany et al. May 2018 B2
9958535 Send et al. May 2018 B2
9962767 Buller et al. May 2018 B2
9963978 Johnson et al. May 2018 B2
9971920 Derakhshani et al. May 2018 B2
9976063 Childers et al. May 2018 B2
9987792 Flitsch et al. Jun 2018 B2
9988136 Tiryaki et al. Jun 2018 B2
9989623 Send et al. Jun 2018 B2
9990565 Rhoads et al. Jun 2018 B2
9994339 Colson et al. Jun 2018 B2
9996890 Cinnamon et al. Jun 2018 B1
9996945 Holzer et al. Jun 2018 B1
10002215 Dowski et al. Jun 2018 B2
10006156 Kirkpatrick Jun 2018 B2
10011089 Lyons et al. Jul 2018 B2
10011685 Childers et al. Jul 2018 B2
10012532 Send et al. Jul 2018 B2
10013777 Mariampillai et al. Jul 2018 B2
10015908 Williams et al. Jul 2018 B2
10016852 Broda Jul 2018 B2
10016942 Mark et al. Jul 2018 B2
10017384 Greer et al. Jul 2018 B1
10018576 Herbsommer et al. Jul 2018 B2
10022792 Srivas et al. Jul 2018 B2
10022912 Kia et al. Jul 2018 B2
10027376 Sankaran et al. Jul 2018 B2
10029415 Swanson et al. Jul 2018 B2
10040239 Brown, Jr. Aug 2018 B2
10046412 Blackmore Aug 2018 B2
10048769 Selker et al. Aug 2018 B2
10052712 Blackmore Aug 2018 B2
10052820 Kemmer et al. Aug 2018 B2
10055536 Maes et al. Aug 2018 B2
10058764 Aders Aug 2018 B2
10058920 Buller et al. Aug 2018 B2
10061906 Nilsson Aug 2018 B2
10065270 Buller et al. Sep 2018 B2
10065361 Susnjara et al. Sep 2018 B2
10065367 Brown, Jr. Sep 2018 B2
10068316 Holzer et al. Sep 2018 B1
10071422 Buller et al. Sep 2018 B2
10071525 Susnjara et al. Sep 2018 B2
10072179 Drijfhout Sep 2018 B2
10074128 Colson et al. Sep 2018 B2
10076875 Mark et al. Sep 2018 B2
10076876 Mark et al. Sep 2018 B2
10081140 Paesano et al. Sep 2018 B2
10081431 Seack et al. Sep 2018 B2
10086568 Snyder et al. Oct 2018 B2
10087320 Simmons et al. Oct 2018 B2
10087556 Gallucci et al. Oct 2018 B2
10099427 Mark et al. Oct 2018 B2
10100542 GangaRao et al. Oct 2018 B2
10100890 Bracamonte et al. Oct 2018 B2
10107344 Bracamonte et al. Oct 2018 B2
10108766 Druckman et al. Oct 2018 B2
10113600 Bracamonte et al. Oct 2018 B2
10118347 Stauffer et al. Nov 2018 B2
10118579 Lakic Nov 2018 B2
10120078 Bruder et al. Nov 2018 B2
10124408 Kenney et al. Nov 2018 B2
10124546 Johnson et al. Nov 2018 B2
10124570 Evans et al. Nov 2018 B2
10137500 Blackmore Nov 2018 B2
10138354 Groos et al. Nov 2018 B2
10144126 Krohne et al. Dec 2018 B2
10145110 Carney et al. Dec 2018 B2
10151363 Bracamonte et al. Dec 2018 B2
10152661 Kieser Dec 2018 B2
10160278 Coombs et al. Dec 2018 B2
10161021 Lin et al. Dec 2018 B2
10166752 Evans et al. Jan 2019 B2
10166753 Evans et al. Jan 2019 B2
10171578 Cook et al. Jan 2019 B1
10173255 TenHouten et al. Jan 2019 B2
10173327 Kraft et al. Jan 2019 B2
10178800 Mahalingam et al. Jan 2019 B2
10179640 Wilkerson Jan 2019 B2
10183330 Buller et al. Jan 2019 B2
10183478 Evans et al. Jan 2019 B2
10189187 Keating et al. Jan 2019 B2
10189240 Evans et al. Jan 2019 B2
10189241 Evans et al. Jan 2019 B2
10189242 Evans et al. Jan 2019 B2
10190424 Johnson et al. Jan 2019 B2
10195693 Buller et al. Feb 2019 B2
10196539 Boonen et al. Feb 2019 B2
10197338 Melsheimer Feb 2019 B2
10200677 Trevor et al. Feb 2019 B2
10201932 Flitsch et al. Feb 2019 B2
10201941 Evans et al. Feb 2019 B2
10202673 Lin et al. Feb 2019 B2
10204216 Nejati et al. Feb 2019 B2
10207454 Buller et al. Feb 2019 B2
10209065 Estevo, Jr. et al. Feb 2019 B2
10210662 Holzer et al. Feb 2019 B2
10213837 Kondoh Feb 2019 B2
10214248 Hall et al. Feb 2019 B2
10214252 Schellekens et al. Feb 2019 B2
10214275 Goehlich Feb 2019 B2
10220575 Reznar Mar 2019 B2
10220881 Tyan et al. Mar 2019 B2
10221530 Driskell et al. Mar 2019 B2
10226900 Nevins Mar 2019 B1
10232550 Evans et al. Mar 2019 B2
10234342 Moorlag et al. Mar 2019 B2
10237477 Trevor et al. Mar 2019 B2
10252335 Buller et al. Apr 2019 B2
10252336 Buller et al. Apr 2019 B2
10254499 Cohen et al. Apr 2019 B1
10257499 Hintz et al. Apr 2019 B2
10259044 Buller et al. Apr 2019 B2
10268181 Nevins Apr 2019 B1
10269225 Velez Apr 2019 B2
10272860 Mohapatra et al. Apr 2019 B2
10272862 Whitehead Apr 2019 B2
10275564 Ridgeway et al. Apr 2019 B2
10279580 Evans et al. May 2019 B2
10285219 Fetfatsidis et al. May 2019 B2
10286452 Buller et al. May 2019 B2
10286603 Buller et al. May 2019 B2
10286961 Hillebrecht et al. May 2019 B2
10289263 Troy et al. May 2019 B2
10289875 Singh et al. May 2019 B2
10291193 Dandu et al. May 2019 B2
10294552 Liu et al. May 2019 B2
10294982 Gabrys et al. May 2019 B2
10295989 Nevins May 2019 B1
10303159 Czinger et al. May 2019 B2
10307824 Kondoh Jun 2019 B2
10310197 Droz et al. Jun 2019 B1
10313651 Trevor et al. Jun 2019 B2
10315252 Mendelsberg et al. Jun 2019 B2
10336050 Susnjara Jul 2019 B2
10337542 Hesslewood et al. Jul 2019 B2
10337952 Bosetti et al. Jul 2019 B2
10339266 Urick et al. Jul 2019 B2
10343330 Evans et al. Jul 2019 B2
10343331 McCall et al. Jul 2019 B2
10343355 Evans et al. Jul 2019 B2
10343724 Polewarczyk et al. Jul 2019 B2
10343725 Martin et al. Jul 2019 B2
10350823 Rolland et al. Jul 2019 B2
10356341 Holzer et al. Jul 2019 B2
10356395 Holzer et al. Jul 2019 B2
10357829 Spink et al. Jul 2019 B2
10357957 Buller et al. Jul 2019 B2
10359756 Newell et al. Jul 2019 B2
10369629 Mendelsberg et al. Aug 2019 B2
10382739 Rusu et al. Aug 2019 B1
10384393 Xu et al. Aug 2019 B2
10384416 Cheung et al. Aug 2019 B2
10389410 Brooks et al. Aug 2019 B2
10391710 Mondesir Aug 2019 B2
10392097 Pham et al. Aug 2019 B2
10392131 Deck et al. Aug 2019 B2
10393315 Tyan Aug 2019 B2
10400080 Ramakrishnan et al. Sep 2019 B2
10401832 Snyder et al. Sep 2019 B2
10403009 Mariampillai et al. Sep 2019 B2
10406750 Barton et al. Sep 2019 B2
10412283 Send et al. Sep 2019 B2
10416095 Herbsommer et al. Sep 2019 B2
10421496 Swayne et al. Sep 2019 B2
10421863 Hasegawa et al. Sep 2019 B2
10422478 Leachman et al. Sep 2019 B2
10425793 Sankaran et al. Sep 2019 B2
10427364 Alves Oct 2019 B2
10429006 Tyan et al. Oct 2019 B2
10434573 Buller et al. Oct 2019 B2
10435185 Divine et al. Oct 2019 B2
10435773 Liu et al. Oct 2019 B2
10436038 Buhler et al. Oct 2019 B2
10438407 Pavanaskar et al. Oct 2019 B2
10440351 Holzer et al. Oct 2019 B2
10442002 Benthien et al. Oct 2019 B2
10442003 Symeonidis et al. Oct 2019 B2
10449696 Elgar et al. Oct 2019 B2
10449737 Johnson et al. Oct 2019 B2
10461810 Cook et al. Oct 2019 B2
20060108783 Ni et al. May 2006 A1
20130015609 Landau Jan 2013 A1
20130101728 Keremes Apr 2013 A1
20140044823 Pax et al. Feb 2014 A1
20140277669 Nardi et al. Sep 2014 A1
20150273631 Kenney Oct 2015 A1
20160096327 Fry et al. Apr 2016 A1
20160122541 Jaker et al. May 2016 A1
20170113344 Schönberg Apr 2017 A1
20170341309 Piepenbrock et al. Nov 2017 A1
20180043614 Greenfield Feb 2018 A1
20180311732 El Naga et al. Nov 2018 A1
Foreign Referenced Citations (47)
Number Date Country
105499569 Apr 2016 CN
108421976 Aug 2018 CN
108480638 Sep 2018 CN
108746613 Nov 2018 CN
111347041 Jun 2020 CN
212310848 Jan 2021 CN
9208592 May 1992 WO
1996036455 Nov 1996 WO
1996036525 Nov 1996 WO
1996038260 Dec 1996 WO
2003024641 Mar 2003 WO
2004108343 Dec 2004 WO
2005093773 Oct 2005 WO
2007003375 Jan 2007 WO
2007110235 Oct 2007 WO
2007110236 Oct 2007 WO
2008019847 Feb 2008 WO
2007128586 Jun 2008 WO
2008068314 Jun 2008 WO
2008086994 Jul 2008 WO
2008087024 Jul 2008 WO
2008107130 Sep 2008 WO
2008138503 Nov 2008 WO
2008145396 Dec 2008 WO
2009083609 Jul 2009 WO
2009098285 Aug 2009 WO
2009112520 Sep 2009 WO
2009135938 Nov 2009 WO
2009140977 Nov 2009 WO
2010125057 Nov 2010 WO
2010125058 Nov 2010 WO
2010142703 Dec 2010 WO
2011032533 Mar 2011 WO
2014016437 Jan 2014 WO
2014187720 Nov 2014 WO
2014195340 Dec 2014 WO
2015193331 Dec 2015 WO
2016116414 Jul 2016 WO
2017036461 Mar 2017 WO
2018013057 Jan 2018 WO
WO-2018013057 Jan 2018 WO
2019030248 Feb 2019 WO
2019042504 Mar 2019 WO
2019048010 Mar 2019 WO
2019048498 Mar 2019 WO
2019048680 Mar 2019 WO
2019048682 Mar 2019 WO
Non-Patent Literature Citations (6)
Entry
US 9,202,136 B2, 12/2015, Schmidt et al. (withdrawn)
US 9,809,265 B2, 11/2017, Kinjo (withdrawn)
US 10,449,880 B2, 10/2019, Mizobata et al. (withdrawn)
International Search Report & Written Opinion received in PCT/US2019/067774 dated Feb. 27, 2020.
Extended European Search Report in EP19897816.5, dated Jul. 20, 2022, 12 pages.
Office Action in CN201980092095.5, dated Sep. 9, 2022, 8 pages.
Related Publications (1)
Number Date Country
20200199723 A1 Jun 2020 US
Provisional Applications (1)
Number Date Country
62784282 Dec 2018 US