The present invention is directed to an incandescent lamp that emits infrared light and a method of making such a lamp.
Incandescent lamps with tungsten filaments are commonly used in general lighting. The outer envelope of such lamps is usually glass, which is a satisfactory transmitter of the visible light generated by the tungsten filament. There are uses, however, where the preferred light is infrared instead of visible light. Glass envelopes usually used in incandescent lamps do not transmit the longer infrared wavelengths and thus these common lamps are not useful in the particular applications where infrared radiation wavelengths longer than 4 microns are the desired output from the lamp.
An object of the present invention is to provide a novel lamp that emits infrared radiation.
It is a further object to provide a novel lamp that has a filament assembly inside a polycrystalline aluminum oxide (PCA) envelope, where the filament assembly preferably has a coiled tungsten filament (single coil or coiled coil), solid metal ends of tungsten or molybdenum attached to the coiled tungsten filament and leads at respective distal ends of the solid metal ends. The lamp desirably has end caps attached to ends of the envelope, where the end caps each have an opening through which a respective one of the leads extends and where the leads are each made of an electrically conductive material having a coefficient of thermal expansion compatible with the end caps. The lamp desirably also has glass-ceramic sealing frits that attach each of the leads to a respective one of the end caps, where the end caps and sealing frits seal a gas inside the envelope.
A yet further object of the present invention is to provide a novel method of making a lamp that emits infrared radiation.
Another object of the present invention is to provide a novel method of making a lamp in which a filament assembly is inserted into a PCA envelope, where the filament assembly has a coiled tungsten filament and solid metal ends of tungsten or molybdenum attached to the coiled tungsten filament and leads at respective distal ends of the solid metal ends. End caps are attached to ends of the envelope and have openings through which respective ones of the leads extends, where the leads are each made of an electrically conductive material having a coefficient of thermal expansion compatible with the end caps. The leads are attached to the respective end caps with glass-ceramic sealing frits and the end caps and the sealing frits seal a gas inside the envelope.
These and other objects and advantages of the invention will be apparent to those of skill in the art of the present invention after consideration of the following drawings and description of preferred embodiments.
a-b are cross sections of alternative embodiments of the end caps.
A tungsten filament is an excellent emitter of infrared light and is therefore a suitable source of infrared emissions for the lamp of the present invention. The glass envelope used in a conventional incandescent lamp however is not a suitable transmitter of infrared radiation and is replaced in the present invention with a material that has a high transmission at 5 micron wavelengths and below, such as an aluminum oxide ceramic envelope. Single crystal aluminum oxide (sapphire) and polycrystalline aluminum oxide (PCA) are both suitable materials for the envelope. PCA has a much lower cost than sapphire and is therefore preferred.
With reference now to
Preferably, the solid metal ends 22 are comprised of tungsten as shown in
End caps 30 are attached to ends of envelope 14 and each has an opening 34 through which a respective one of first and second leads 26 extends. First and second leads 26 are each made of a metal (such as niobium) having a coefficient of thermal expansion compatible with end caps 30. Preferably, first and second leads 26 are attached to end caps 30 with glass-ceramic sealing frits 38. End caps 30 and sealing frits 38 seal a suitable gas 42 inside envelope 14. It may also be possible to seal the leads directly to the end caps without an intermediate frit material by using leads comprised of a tungsten or molybdenum alloy having suitable thermal expansion properties. Such an alloy is described in U.S. Pat. No. 4,366,410.
As shown in
As shown in
The method of making the lamp generally includes attaching end caps 30 and sintering envelope 14, inserting filament assembly 10 into envelope 14, and attaching first and second leads 26 to the respective end caps 30 with glass-ceramic sealing frits 38, thereby sealing gas 42 in envelope 14. The order of these steps may vary.
One approach is to insert the filament assembly into the envelope after sintering and after attaching the end caps and spacers by sliding the filament through the respective openings. Another approach is to put the filament assembly in the envelope prior to sintering. In the latter instance, the filament assembly would go through the sintering process that typically reaches a temperature of about 1850° C. It should be noted that mechanical properties of the niobium (if this material is used for the leads) will degrade when exposed to this sintering process. Further, the PCA envelope will shrink in length and diameter as it sinters to full density.
When an embodiment with spacers attached to the filament (the spacers being too large to fit through the end cap openings) and with niobium leads is being manufactured, first and second leads 26 preferably are attached to the respective distal ends of solid metal ends 22 after inserting filament assembly 10 (with the spacers attached but without the niobium leads) into the envelope and after sintering the envelope and attaching the end caps to envelope. This exposes the tungsten/molybdenum parts of the filament assembly to the sintering, but the tungsten/molybdenum parts are not as affected by this process as is the niobium.
This procedure may be accomplished by initially providing solid metal ends 22 that are longer than needed in the assembled lamp and inserting the filament assembly with longer ends 22 and no leads 26 into envelope 14. Then, after sintering the envelope, moving (e.g., sliding) the filament assembly longitudinally in envelope 14 to expose an end portion of one of the solid metal ends outside envelope 14 through a respective end cap opening 34, removing this end portion, and attaching the first of the niobium leads to a remnant of this solid metal end that remains exposed outside envelope 14. The second lead may then be attached to the other solid metal end by moving the filament assembly longitudinally in the opposite direction in envelope 14 to expose an end portion of the other solid metal end outside envelope 14 through the other end cap opening 34, removing this end portion, and attaching the second of the niobium leads to a remnant of the other solid metal end that remains exposed outside the envelope.
The step of attaching first and second leads 26 to respective ones of end caps 30 with glass-ceramic sealing frits 38 may include stretching coiled tungsten filament 18 to a desired length and holding the stretched tungsten filament in place (e.g., by clamping or temporarily welding stop-wires) while sealing the envelope with the glass-ceramic sealing frits.
Envelope 14 must be sealed with suitable gas 42 inside to provide an essentially oxygen-free atmosphere inside the lamp. The lamp may be filled with a gas similar to that used in halogen lamps (e.g., iodine- or bromine-containing gas fills at >1 atm cold fill pressure) or with high pressure xenon (e.g., at about 10 bar) or krypton to minimize evaporation of the tungsten from the filament that will deposit on the relatively cool wall of envelope 14 and reduce light emission.
The sealing process used for silica glass envelopes is not suitable with PCA. The process used herein is a known process used to seal electrodes in a high pressure sodium lamp or a ceramic metal halide lamp. The process uses glass-ceramic sealing frit 38 to bond first and second leads 26 to end caps 30. End caps 30 and first and second leads 26 should have similar coefficients of expansion to reduce the stress that would otherwise be generated by a mismatch in thermal expansion of these components. An exact match is not required.
Spacers 46 and end caps 30 may be made of PCA and co-sintered with the envelope.
In a further embodiment, spacers 46 are places where the envelope is pinched or otherwise reduced in diameter to hold the filament in place. In this embodiment, the coiled tungsten filament of the filament assembly is stretched to expand the distance between the turns of the coil in those locations where the diameter is reduced so as to avoid too much contact between the filament and the envelope. That is, the coiled filament is unevenly stretched with the most stretched parts (greatest turn-turn separation) aligning with the pinched parts of the envelope. This procedure is used in halogen lamps with fused silica glass envelopes and is applicable to the present invention.
While embodiments of the present invention have been described in the foregoing specification and drawings, it is to be understood that the present invention is defined by the following claims when read in light of the specification and drawings.
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