Claims
- 1. A method for anionically polymerizing monomers, comprising:
a) forming a reaction mixture by contacting monomers with a mono- or multi-functional anionic polymerization initiator, wherein the polymerization initiator is an organo-substituted alkali metal compound in a suitable solvent; b) adding to (a) before, or at the beginning of polymerization, at least 0.01 equivalents of a metal alkyl compound per equivalent of alkali metal to reduce the viscosity of the reaction mixture, wherein the alkyl groups of the metal alkyl compound are chosen so that they will not exchange with the alkali metal.
- 2. The method of claim 1, wherein from 0.01 to 1.5 equivalents of the metal alkyl compound per equivalent of the alkali metal.
- 3. The method of claim 1, wherein from 0.01 to 1.0 equivalents of the metal alkyl compound per equivalent of the alkali metal.
- 4. The method of claim 1, wherein the metal alkyl compound is selected from the group consisting of aluminum, zinc, boron, and magnesium alkyls having from 1 to 20 carbon atoms per alkyl substituent.
- 5. The process of claim 4, wherein the metal alkyl compound is selected from the group consisting of triethylaluminum, trimethylaluminum, tri-n-propylaluminum, tri-n-butylaluminum, triisobutylaluminum, tri-n-hexylaluminum, trioctylaluminum, butylethyl-magnesium, di-n-butylmagnesium, di-n-hexylmagnesium, dimthylzinc, diethylzinc, di-n-propylzinc, diisobutylzinc, and di-n-butylzinc.
- 6. The process of claim 5, wherein the metal alkyl compound is triethyl aluminum.
- 7. The method of claim 1, wherein the organo substituent of the alkali metal compound is aliphatic, cycloaliphatic, aromatic, or alkyl-substituted aromatic.
- 8. The method of claim 7, wherein the alkali metal compound is sec-butyllithium.
- 9. The method of claim 7, wherein the initiator is a diinitiator.
- 10. The method of claim 9, wherein the alkali metal compound is the sec-butyl lithium adduct of diisopropenyl benzene.
CROSS-REFERENCE TO RELATED APPLICATIONS
[0001] This application is a divisional of co-pending U.S. patent application Ser. No. 09/537,500, filed Mar. 29, 2000, which claims benefit of U.S. provisional patent application Serial Number 60/130785 filed Apr. 23, 1999.
Provisional Applications (1)
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Number |
Date |
Country |
|
60130785 |
Apr 1999 |
US |
Divisions (1)
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Number |
Date |
Country |
Parent |
09537500 |
Mar 2000 |
US |
Child |
10106265 |
Mar 2002 |
US |