David Broek, "Elementary Engineering Fracture Mechanics", 1986, Martinus Nijhoff Publishers, pp. 3-32. |
W. P. Maszara, "Silicon-On-Insulator By Wafer Bonding: A Review", Jan. 1991, J. Electrochem. Soc., vol. 138, No. 1, pp. 341-347. |
W. H. Ko, J. T. Suminto and G. J. Yeh, "Bonding Techniques For Microsensors", 1985, Elsevier Science Publishers, pp. 198-207. |
M. Alavi, S. Buttgenbach, A. Schumacher and H.-J. Wagner, "Fabrication Of Microchannels By Laser Machining And Anisotropic Etching Of Silicon", 1992, Elsevier Sequoia, pp. 299-302. |
Jacob Fraden, "Piezoresistive Sensors", 1993, API Handbook of Modern Sensors, pp. 377-383. |
Yaoling Wang, Litian Liu, Xinyu Zheng and Zhijian Li, "A Novel Pressure Sensor Structure For Integrated Sensors", 1990, Elsevier Sequoia, pp. 62-64. |
Kurt Petersen, Phillip Barth, John Poydock, Joe Brown, Joseph Mallon, Jr., and Janusz Bryzek, "Silicon Fusion Bonding For Pressure Sensors", 1988, IEEE Press, pp. 209-212. |
Lee Christel, Kurt Petersen, Phillip Barth, Farzad Pourahmadi, Joseph Mallon, Jr., and Janusz Bryzek, "Single-crystal Silicon Pressure Sensors With 500.times. Overpressure Protection", 1990, Elsevier Sequoia, pp. 84-88. |
Farzad Pourahmadi, Phillip Barth and Kurt Petersen, "Modeling Of Thermal And Mechanical Stresses In Silicon Microstructures", 1990, Elsevier Sequoia, pp. 850-855. |
J. Binder, G. Ehrler, K. Heimer, B. Krisch, M. Poppinger, "Silicon Pressure Sensors For The 2 kPa To 40 MPa Range", 1984, Springer-Verlag, pp. 294-302. |
M. Alavi, S. Buttgenbach, A. Schumacher, H.-J. Wagner, "Laser Machining Of Silicon For Fabrication Of New Microstructures", 1991, IEEE Press, pp. 512-515. |
Farzad Pourahmadi, Dale Gee, Kurt Petersen, "The Effect Of Corner Radius Of Curvature On The Mechanical Strength Of Micromachined Single-Crystal Silicon Structures", 1991, IEEE Press, pp. 197-200. |