1. Field of the Invention
The present invention relates to laser diode arrays, and more specifically, it relates to techniques for wavefront phase locking across the face of large laser diode arrays.
2. Description of Related Art
The technology of high-power laser diode arrays used as laser pump sources has advanced in the last 25 years far beyond that of the flash lamp. Today these advancements, particularly the high efficiency and ruggedness of diode arrays, have enabled development in a wide range of areas including medical lasers, materials processing and directed energy. During this time Lawrence Livermore National Laboratory (LLNL) has led technology development of microchannel cooling, which enabled large diode arrays, and integrated optical conditioning, which enabled optical pumping with higher irradiance. This LLNL work has resulted in new applications for direct diodes as well as new classes of average-power lasers, including the ground-state-depleted laser and more recently the diode-pumped alkali laser.
High spatial and spectral radiance are key properties of laser diode arrays—properties of which LLNL has understood and taken advantage. The present invention furthers the spatial and spectral radiance of diode arrays via passive cavity designs that cause wavefront phase locking across the face of large arrays. This invention relies on techniques that are both spatially and spectrally selective in order to coherently link the individual emitters (or facets) that make up the diode array.
Inducing coherence among otherwise independent apertures is a well-recognized technique for increasing laser radiance. For applications that require high radiance, the potential simplicity of a phase-locked direct diode array is very attractive compared to the complexity of a system such as a diode-pumped solid-state laser. Specifically, this invention takes advantage of advancements made in the last five years in optical conditioning packages for diode arrays in two specific areas: (1) arrays of customized micro-optics that are now available to correct aberrations of the individual apertures of large diode arrays, and (2) highly spectrally selective partial reflectors that are now available and enable the deleterious effects of inhomogeneities in local thermal environments of the individual emitters that are being phase locked together to be overcome.
Exemplary uses of the present invention include defense applications, illuminator applications, power-beaming applications, material processing and machining applications such as cutting, welding, and surface treatment/modification, medical applications, scientific applications, and pump excitation of diode-pumped solid state lasers and diode-pumped alkali lasers.
The advantages of phase locking diode arrays were recognized early in their development and various approaches have been pursued for many years, but with only very limited success. Particularly in the late 1980s and early 1990s, the U.S. government funded a very aggressive campaign to phase lock large diode arrays for space-based applications. For a variety of technical reasons these phase-locking pursuits were largely unsuccessful. Near the end of this campaign, general opinion held that the phase locking of large 2-D arrays was not adequately developed. Then by the mid-1990s, the high power laser community had shifted its focus to solid-state lasers pumped by incoherent diode arrays—a situation that still dominates defense-oriented government investment.
For the last 25 years, conventional wisdom has advocated using the solid-state laser as a brightness converter—using low-radiance light from large 2-D diode arrays to pump the higher radiance solid-state laser. In contrast, this invention reevaluates several of the early phase locking approaches in light of recent progress in optical technologies applied to diode lasers; particularly the optical conditioning techniques that we have used on the diode arrays for high irradiance pump-excitation of diode-pumped lasers.
This invention is motivated by the need for robust techniques for phasing across diode array apertures. Such techniques are important to enable direct diode arrays to access applications that today require higher spatial radiance (or brightness) sources than available from incoherent arrays and from higher radiance sources such as diode-pumped solid state lasers that, from a system level, involve considerably more complexity and complication than could be realized with direct phase-locked diode arrays.
The accompanying drawings, which are incorporated into and form a part of the disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
This invention enables phase locking via the diffractive coupling of the individual facets on the laser diode bars, which are themselves stacked in two-dimensional arrays. High-average-power diode arrays, as they are used today, usually consist of diode bars that have 10 to 25 independent broad area facets spaced along the length of each bar, with individual facets emitting incoherently with respect to one another.
In recent years robust and reliable phase locking demonstrations have been hindered by two specific problems which can now be addressed with commercially available technologies. The focus of this invention is the recognition that with appropriately designed laser cavities that incorporate these two technologies, these existing problems can be mitigated and robust and reliable phase locked arrays realized.
The first issue is commonly referred to as the “smile” problem, which is caused by a slight bend in the nominally straight pattern of emitters on a diode bar. This bend is typically a result of imperfections in either the sub-mount flatness or in the uniformity of the solder layer attaching the bar to the sub mount, or both. Most proposed optically implemented phase locking schemes rely on fast-axis pointing accuracy being maintained from emitter to emitter, but the smile error causes emitter-to-emitter variation in fast-axis pointing accuracy after the light passes through the monolithic fast-axis collimating lens.
The solution to this problem is an advanced beam conditioning optic, often referred to as an advanced optic (AO), which is custom fabricated for a given diode array in order to correct for the smile errors that are specific to that array, thereby restoring pointing accuracy to the fast-axis radiation. AO's are designed by first diagnosing the smile error across individual diode bars after having their output conditioned by a FAC and SAC microlens. Using a wavefront sensing method to obtain the local tilt in the wavefront across a diode array, the AO's are designed to compensate for the local tilt error through a refractive correction. The AO's themselves are then fabricated in fused silica or other transparent substrate material using a direct write laser micro-machining process via a focused CO2 laser beam that is rastered across the surface to be machined. Machined microplates are then aligned to the operating diode bar using a micro-positioning stage, and finally fixed in place using a UV-cured glue. For a more detailed explanation see: J. F. Monjardin, K. M. Nowak, H. J. Baker, and D. R. Hall, “Correction of beam errors in high power laser diode bars and stacks,”/4 Sep. 2006/Vol. 14, No. 18/OPTICS EXPRESS 8178.
More specifically,
Fast-axis collimating lenses are widely available commercially, for example LIMO Lissotschenko Mikrooptik GmbH offers a complete line of microlenses appropriate for conditioning the fast-axis and slow-axis radiation of laser diode arrays. Although the AO corrector plates are a somewhat newer technology than are microlenses, such AO plates are now available commercially from PowerPhotonic Ltd. in the United Kingdom, which offers customized AO plates as a catalogue item.
The second issue that has been limiting phase locking is the tendency of the independent laser emitters to operate at slightly different center wavelengths. This wavelength variation is caused primarily by emitter-to-emitter differences in the local thermal environments. The solution to this problem is the use of an external resonant reflector for the diodes—a reflector in the form of a shallow Bragg grating fabricated in photosensitive glass. In essence, such resonant reflectors feedback only a single wavelength into the diode cavity, thereby overwhelming the small wavelength differences among emitters in their peak gain as long as the temperature excursions are not too large. Such resonant reflectors are commonly referred to as VBGs (volume Bragg gratings) and along a single diode bar can limit the bandwidth of emitted light to several tenths of a nanometer or less. As discussed above, the means provided by the present invention for the correction of the smile problem improves phase locking of laser diode arrays. Phase-locking of laser diode arrays is further improved by the present invention through the correction of local thermal inhomogeneities in large arrays. We note that alternate means, such as a reflection grating, may be used for correcting the wavelength variation of the emitters. Similar optical means for narrowing the line width will be apparent to those skilled in the art based on the teachings of the present invention, and such alternate means are within the scope of the invention.
Both of these technologies have been demonstrated and matured at the bar level in incoherently emitting diode arrays, and in fact are incorporated into the diode pump arrays used for existing laser systems such as the LLNL diode-pumped alkali laser system. This invention extends these same technologies in an optical design that establishes coherence among the individual facets in the array. To do this, as illustrated in
The first variation of this invention uses an intracavity complex spatial filter. The use of intracavity spatial filters to phase lock individual diode gain elements has already been demonstrated. More recently the benefits of an intracavity spatial filter to substantially improve beam quality from an individual broad area laser diode emitter has been shown. Such a filter limits the spatial and temporal instabilities in diodes that otherwise lead to transverse mode broadening.
More specifically,
Thus, this invention extends beyond previous works by introducing a specialized complex spatial filter, and using the optical conditioning of the diode array and the spectrally selective VBG reflector as described above.
As a specific example of this invention consider
One of the challenging technology areas associated with this invention is the fabrication of the contoured complex spatial filter mask. Another issue with the complex spatial filter masks is the management of high-power light that strikes the mask at locations where it is not intended, a situation requiring aggressive thermal management at those locations. To this end, we identify three well known and well developed fabrication options for the spatial filter masks and list the strengths and weaknesses associated with each option.
1. Silicon etching—this process is done by creating a mask then exposing resist on a silicon wafer. Small features can be made to very good repeatability but not absolute accuracy so a fabricate-measure-re-fabricate process would have to be invoked, which complicates the fabrication process. The strength of this process is the ability to make many copies of a design. Typical silicon wafers are 0.5 to 0.75 mm thick but the area around the mask features could be back-thinned to whatever degree is required. For removing heat from the mask, silicon has ˜150 W/m-K conductivity, so depending on the degree of heat to be removed, this may work sufficiently well. For more aggressive thermal management, a heat exchanger could be etched into the wafer using the same silicon based microchannel approach as used for silicon submounts for high power laser diode arrays.
2. Laser cutting—this process can achieve the desired accuracy, especially by feeding back accurate metrology of the feature size and location. This feedback iteration can be quick as the laser cut is guided by a computer program—a flexible process. There are different options for laser wavelength and these result in different edge quality on different materials. There are several different design options using laser cutting as the material removal process:
a. Molybdenum sheet—Moly is an attractive material in that it has moderately high thermal conductivity at 140 W/m-K, is available in sheet stock to even a few micron thickness and can withstand high temperatures. For significant heat loading on the mask, the foil will have to be thermally sunk to a heat sink. If the heat sink is copper, bonding isn't trivial with soldering/brazing but a thermally conductive epoxy could be used without too much thermal resistance at the joint.
b. A solid copper substrate can be used thereby allowing a monolithic structure. The copper block would be thinned in the area of the optical mask and heat transfer fins and fluid paths machined directly in the copper.
c. Silicon Carbide (SiC) is another advantageous material. For temperatures below about 500° C., its thermal conductivity is higher than that of Moly and approaches that of Copper at room temperature. In addition, SiC is more of a volumetric absorber of light. This leads to a smaller temperature rise (as compared to a surface absorber) for a given amount of power incident on the material.
3. Deposition methods—The mask can be made from a transparent material that then has an opaque material deposited on it to form the mask. Using a high thermal conductivity material such as CVD diamond for the transparent substrate would allow efficient transport of the heat away from absorbing mask locations.
At the level of accuracy required for these masks, two-dimensional metrology to a few microns (3-5 microns) is within the commercial product sector which uses tools that routinely work at this level.
This invention is also directly applicable to 2-D arrays. This is illustrated in
More specifically,
The reason for the simpler rectangular aperture in this case is that we are not attempting to restrict the laser cavity to the single “in phase” mode as we did for the single-bar setup in
This flexibility to shape the aperture in the complex spatial filter enables the optimization of the properties of the output beam of the system for a particular work piece or target. We view this freedom in particular as an attractive feature of this invention as it substantially increases the number of applications for such a system. Another very attractive feature of this proposed approach is that it applies to diode arrays almost regardless of their operating wavelength because spatial filters and VBG retro-reflectors can be made over a wide wavelength range.
This invention applies to another family of resonators in which the spatial filter cavity described above is replaced by a Talbot cavity construction. Talbot cavity resonators are somewhat more complicated than the already discussed complex spatial filter resonators, but they have the advantage over the spatial filter cavities that there is no high irradiance intracavity spot (focal spot) required. Rather, instead of diffractively coupling through a tightly focused spot, the Talbot cavity enables diffractive coupling between multiple apertures that are placed on a regularly spaced grid, relying on the self-imaging properties of coherent arrays.
Small fill factors are driven by the desire to have high transverse mode discrimination, while large fill factors are driven by the desire to have high Strehl ratio output beams. For the first time, this invention gives us the freedom to meet both of these requirements simultaneously by adding another set of optical corrector plates after the VBG, as shown in
Thus,
A final important aspect of the proposed structure shown in
A round trip cavity distance of ZT is advantageous as this cavity length gives large transverse mode discrimination, which is very desirable for high beam quality operation as already mentioned. But an undesirable feature of this cavity is that the lowest loss mode is the out-of-phase one in which there is phase change of π radians between adjacent emitters, at the location of the VBG. For high Strehl outputs the in-phase mode is most desirable as already discussed. The advantage of this invention here is that we can satisfy both requirements simultaneously, running the highest discrimination out-of-phase mode inside the cavity and then correcting the phase outside the cavity with the final adjusting plates to get back to an in-phase mode. Finally to give an idea of the cavity length scales we are talking about here, for a 1 mm aperture to aperture spacing, which is typical of this diode bars and bar stacking pitches, and 780 nm wavelength laser diode arrays, the Talbot distance is 256 cm giving an approximate cavity length for the system shown in
Finally, we note that the same technology approaches used above are applicable to arrays of other lasers such as for example, fiber lasers, or solid state lasers.
The foregoing description of the invention has been presented for purposes of illustration and description and is not intended to be exhaustive or to limit the invention to the precise form disclosed. Many modifications and variations are possible in light of the above teaching. The embodiments disclosed were meant only to explain the principles of the invention and its practical application to thereby enable others skilled in the art to best use the invention in various embodiments and with various modifications suited to the particular use contemplated. The scope of the invention is to be defined by the following claims.
The United States Government has rights in this invention pursuant to Contract No. DE-AC52-07NA27344 between the U.S. Department of Energy and Lawrence Livermore National Security, LLC, for the operation of Lawrence Livermore National Laboratory.