BRIEF DESCRIPTION OF THE DRAWINGS
The embodiments of this invention will be described in detail, with reference to the following figures, wherein like designations denote like elements, and wherein:
FIG. 1 shows a perspective view of a clamp system according to the invention.
FIG. 2 shows a cross-sectional view of a cathode positioning clamp including an opening according to the invention, with a mount portion of the cathode positioned to align the cathode and filament.
FIG. 3 shows a cross-sectional view of the cathode positioning clamp of FIG. 2 with a mount portion of the cathode in a final position relative to the filament.
DETAILED DESCRIPTION OF THE INVENTION
With reference to the accompanying drawings, FIG. 1 shows a perspective view of a clamp system 10 according to the invention coupled to a source 12 of an ion implanter system 14. Clamp system 10 aligns an indirectly heated cathode 16 and a filament 18, as will be described below. Clamp system 10 includes a cathode clamp 30 including a first clamp member 32 separably coupled to a second clamp member 34. As shown in FIG. 1, each clamp member 32, 34 includes a surface 36 to engage a mount portion 40, 140 of one of cathode 16 and filament 18, respectively. In one embodiment, each clamp 30 includes a sawcut-type clamp including at least one opening 38 for receiving a tool adapted to forcibly separate members of the sawcut-type clamp. However, it should be recognized that other type clamps are possible.
As illustrated, the teachings of the invention are applied to cathode positioning clamp 30 and, accordingly, mount portion 40 is that of cathode 16. However, as one with skill in the art will recognize the teachings of the invention could be applied equally to filament positioning clamp 130 and filament 18 mount portion 140, or a combination of both positioning clamps 30, 130.
Clamp system 10 further includes an opening 50 to mount portion 40 in at least one of clamp members 32, 34. Opening 50 is adapted to receive a positioning tool 60 to position cathode 16 relative to clamp 30 and, according, relative to filament 18. Mount portion 40 may include a tool receiving member 60 (FIGS. 2-3) for engagement by positioning tool 60. When clamp 30 is released cathode 16 and filament 18 can be positioned relative to one another by positioning tool 60 engaging mount portion 40. In one embodiment, positioning tool 60 engages a tool receiving member 62 in the form of a groove in mount portion 40 and aligns the groove with an edge of opening 50. The size of opening and position of the groove are such that the alignment positions cathode 16 and filament 18 in a predetermined position. For example, as shown in FIG. 2, filament 18 may be positioned in contact with a back surface 64 of cathode 16 in an initial setup position. When moved to an aligned position, shown in FIG. 3, by way of positioning tool 60 engaging the tool receiving member 62, filament 18 is positioned at a predefined distance D from back surface 64 based on the position of tool receiving member 62 on mount portion 40. Subsequently, clamp 30 can be re-clamped. Positioning tool 60 may take any form capable of insertion into opening 50 and engagement with mount portion 40. No special tool is required.
The above-described invention provides a method that allows alignment of an indirectly heated cathode 16 to filament 18 in-situ, using positioning tool 60 along with opening 50 in a clamp 30, 130. Utilization of these features and tools reduces alignment error during the assembly and installation of the apparatus. The invention allows in-situ, repeatable assembly and alignment, which are important for ion implanter system process success.
While this invention has been described in conjunction with the specific embodiments outlined above, it is evident that many alternatives, modifications and variations will be apparent to those skilled in the art. Accordingly, the embodiments of the invention as set forth above are intended to be illustrative, not limiting. Various changes may be made without departing from the spirit and scope of the invention as defined in the following claims.
Patent Application
20080072413
