TREA

Individual wafer package

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Information

  • Patent Grant
  • D338402
  • Patent Number
    D338,402
  • Date Filed
    Tuesday, January 21, 1992
    33 years ago
  • Date Issued
    Tuesday, August 17, 1993
    32 years ago
  • US Classifications
    Field of Search
    • US
    • D09 418
    • D09 415
    • D09 432
    • D09 337
    • D09 341
    • 206 454
    • 206 449
    • 206 4531
    • 206 4513
    • 206 216
    • 206 312
    • 206 313
    • 206 453
    • 206 444
    • 206 387
    • D03 35
    • D14 136
    • D14 160
    • D14 114
    • D14 164
    • D14 217
    • Term of Grant
      14Years
Information
Abstract
Description
Claims
  • The ornamental design for an individual wafer package, as shown and described.
US Referenced Citations (7)
Number Name Date Kind
D276215 Wang Nov 1984
3615006 Freed Oct 1971
3666140 Brefka May 1972
4511038 Miller et al. Apr 1985
4664254 Sitwell et al. May 1987
4724960 Goodrum et al. Feb 1988
5045173 Guadagno et al. Sep 1991