Not applicable.
The present invention generally relates to inductive devices and, more specifically, relates to inductive devices with granular magnetic materials.
Integrated on-chip and on-package inductors are often provided with thin films of a magnetic material to improve their inductance. When a high-permeability magnetic material is placed near a conductor carrying electric current, the inductance in the conductor is increased by a factor of the relative permeability μr. If the relative permeability is real (i.e., does not show any magnetic loss), then the gain in inductance can be significant.
In higher-frequency applications (e.g., operating above about 1 GHz), the magnetic materials used in these integrated devices experience increasing magnetic losses (e.g., an increasing imaginary component of relative permeability). Eddy currents in the magnetic materials contribute to these high frequency magnetic losses, as they contribute significantly to damping effects. These eddy currents are the result of magnetic materials with insufficiently high resistivity. While some amorphous magnetic alloys enjoy higher resistivity, this comes at a cost of lower magnetization (and accordingly lower performance in inductive applications.) Accordingly, to improve the high-frequency performance of integrated inductors, transformers and the like, it is desirable to provide magnetic materials with high resistivity and high magnetization for use therein.
According to one aspect of the present invention, granular magnetic alloy films are provided for use in integrated inductors, transformers, and other high frequency devices. The films include a plurality of magnetic grains embedded in an amorphous matrix of stoichiometric ceramic with a high dielectric constant. This structure allows integrated inductors to be designed with smaller sizes and enhanced inductance and Q factor.
In accordance with one embodiment of the present invention, an inductive device comprises a conductor configured in a spiral and a first layer of granular magnetic material having a plurality of magnetic grains embedded in an amorphous ceramic matrix. The amorphous ceramic matrix has a dielectric constant greater than 3.
In accordance with another embodiment of the present invention, an integrated device comprises a first inductor trace and a first layer of granular magnetic material having a plurality of magnetic grains embedded in an amorphous ceramic matrix. The amorphous ceramic matrix has a dielectric constant greater than 3.
In accordance with another embodiment of the present invention, a transformer comprises a core and a first inductor. The first inductor includes a first conductor configured in a spiral surrounding a first portion of the core, and a first layer of granular magnetic material. The transformer further comprises a second inductor. The second inductor includes a second conductor configured in a spiral surrounding a second portion of the core, and a second layer of granular magnetic material. The first and second layers of granular magnetic material have a plurality of magnetic grains embedded in an amorphous ceramic matrix. The amorphous ceramic matrix has a dielectric constant greater than 3.
It is to be understood that both the foregoing summary of the invention and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.
The accompanying drawings, which are included to provide further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. In the drawings:
In the following detailed description, numerous specific details are set forth to provide a full understanding of the present invention. It will be apparent, however, to one ordinarily skilled in the art that the present invention may be practiced without some of these specific details. In other instances, well-known structures and techniques have not been shown in detail to avoid unnecessarily obscuring the present invention.
Inductor 100 further includes granular magnetic alloy layers 102 disposed above portions of conductor 101.
In one aspect of the present invention, each granular magnetic alloy layer 102 is a soft magnetic material which includes a plurality of magnetic grains embedded in an amorphous ceramic matrix, as illustrated in greater detail in
In one aspect of the present invention, the ceramic matrix may comprise, for example, a stoichiometric material (e.g., if the ceramic material were a silicon oxide, the ratio of oxygen to silicon would be an integer ratio of, for example, 2:1, as opposed to 1.8:1). Any non-stoichiometry in the ceramic phase would either be electron (n-type) or hole (p-type) compensated, and would thus cause significant resistivity degradation (and concomitant higher eddy current losses at high frequency). Moreover, non-stoichiometry could generate paramagnetic charge centers (e.g., E′-type, etc.) which would increase the conductivity of the granular magnetic alloy, and thereby increase magnetic losses. Using an appropriately selected sputtering target (i.e., one with a desired amount of oxygen) in a reactive sputtering process (i.e., in the presence of oxygen), any potential non-stoichiometry can be compensated.
In
Amorphous ceramic matrix 102a forms a continuous three-dimensional structure, in accordance with one aspect of the present invention. This is shown in
In accordance with one aspect of the present invention, magnetic grains 102b comprise a material selected from the group consisting of cobalt (Co), iron (Fe), nickel (Ni) and various alloys thereof. Table 1, below, provides an exemplary, non-exhaustive list of various ferromagnetic materials and alloys for use in granular magnetic alloys in accordance with one aspect of the present invention.
In accordance with one aspect of the present invention, amorphous ceramic matrix 102a comprises a material with a dielectric constant greater than about 3. For example, the amorphous ceramic matrix may be an oxide, a nitride, a carbide, a silicate, an aluminate, a Perovskite, or any combination thereof. Table 2, below, provides an exemplary, non-exhaustive list of various ceramic systems suitable for use in a granular magnetic alloy in accordance with one aspect of the present invention.
Granular magnetic alloy layers 102 may be provided by any one of a number of methods, including physical vapor deposition (e.g., sputtering), in accordance with one aspect of the present invention. Accordingly, a sputter target comprising both the material of the magnetic grains and the material of the amorphous ceramic matrix may be sputtered over a spiral conductor to provide granular magnetic alloy layers over the desired regions of the package during fabrication, in accordance with one aspect of the present invention. Alternatively, two sputter targets, one comprising the material of the magnetic grains, the other comprising the material of the amorphous ceramic matrix, may both be sputtered at the same time and in the appropriate percentages (e.g., to provide an amorphous ceramic matrix of at least 10% by volume of the resultant layer) to provide a desired granular magnetic alloy layer. As one of skill in the art would readily understand the methods by which a film of material may be sputtered in desired regions of an integrated package, a detailed description thereof is omitted to avoid unnecessarily obscuring the description of the various embodiments of the present invention.
Several advantages are enjoyed by an inductive device (e.g., an inductor, a transformer, etc.) employing a granular magnetic alloy layer in accordance with one embodiment of the present invention. For example, an integrated inductor with a soft granular magnetic alloy provides enhanced inductance and a concomitant improvement in the Q factor when compared to a non-granular magnetic alloy of similar size. Accordingly, granular magnetic alloy layers 102 may be designed to be significantly smaller than non-granular magnetic alloys having the same inductance and Q factor. Furthermore, as the magnetic flux is better confined within the granular magnetic alloy than in a non-granular magnetic alloy, cross-talk between multiple inductors on the same chip or package is minimized. These advantages render the various embodiments of the present invention suitable for use in a number of applications, including portable power delivery, wireless communication, and other applications.
According to one aspect, the present invention is practiced with an integrated inductor having exactly two granular magnetic alloy layers in a single plane. The invention, however, is not limited to this configuration. For example, according to one aspect, the present invention has application to inductors with any number of granular magnetic alloy layers greater than or equal to one. For example,
According to one aspect, a configuration of the present invention can include granular magnetic alloy layers disposed on opposing sides of an approximately octagonal spiral conductor. The scope of the present invention, however, is not limited to this particular arrangement. Rather, as will be apparent to one of skill in the art, the present invention also has application to inductors and transformers in which granular magnetic alloy layers are provided in any configuration around a conductor. For example,
According to one aspect, a configuration of the present invention includes granular magnetic alloy layers disposed in a single plane parallel to (e.g., above or below) the plane in which the spiral conductor is disposed. The scope of the present invention, however, is not limited to this particular arrangement. Rather, the present invention also has application to arrangements in which several layers of granular magnetic alloy are provided in different planes and/or in various relationships with an inductive trace. For example,
In another aspect, the present invention has application to arrangements in which a single granular magnetic alloy layer is disposed in one plane above or below the plane in which the spiral conductor is disposed, and the single granular magnetic alloy layer is large enough to cover the entire spiral conductor (instead of covering only certain sections of a conductor, as shown in
As can be seen with reference to
In accordance with one aspect of the present invention,
According to one aspect, a configuration of the present invention includes conductors disposed within a layer of dielectric material. The scope of the present invention, however, is not limited to such an arrangement. Rather, as will be apparent to one of skill in the art, the present invention also has application to inductors in which the conductor is disposed directly upon the substrate, in a layer of material that is not dielectric, in multiple layers, or within or alongside a granular magnetic alloy layer.
According to one aspect, a configuration of the present invention includes one inductor. The scope of the present invention, however, is not limited to such an arrangement. Rather, as will be apparent to one of skill in the art, the present invention also has application to multiple inductors and to any one or more inductive devices, including transformers and the like. For example, in accordance with another embodiment of the present invention, an integrated transformer includes two inductors, each having one or more layers of granular magnetic alloy configured to improve the inductance and Q factor thereof. The inductors of a transformer may be configured in planar spirals, as illustrated with respect to the foregoing exemplary embodiments, or may alternatively be configured in three-dimensional helices (e.g., so that a core lying substantially in a single plane can pass through both spirals).
For example,
A transformer of the present invention is not limited to the configuration shown in
In yet another aspect, an inductor of the present invention may include multiple conductors. Moreover, the present invention is not limited to integrated inductors having only a single substrate layer and a single dielectric layer in which a conductor is disposed, but rather, as will be apparent to one of skill in the art, the present invention also has application to inductors with any number of additional layers not described or illustrated herein.
While the present invention has been particularly described with reference to the various figures and embodiments, it should be understood that these are for illustration purposes only and should not be taken as limiting the scope of the invention. There may be many other ways to implement the invention. Many changes and modifications may be made to the invention, by one having ordinary skill in the art, without departing from the spirit and scope of the invention.
The present application claims the benefit of priority under 35 U.S.C. § 119 from U.S. Provisional Patent Application Ser. No. 60/907,303 entitled “SOFT MAGNETIC ALLOY THIN FILMS FOR INTEGRATED INDUCTORS, TRANSFORMERS AND OTHER HIGH FREQUENCY APPLICATIONS,” filed on Mar. 28, 2007, the disclosure of which is hereby incorporated by reference in its entirety for all purposes.
Number | Date | Country | |
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60907303 | Mar 2007 | US |