The present invention relates to an inductor, and more particularly to an inductor having a controllable height. The present invention also relates to a base of the inductor.
Magnetic elements such as inductors are widely used in many electronic devices. Recently, the electronic devices are developed toward minimization. For reducing the overall volume of the electronic devices, the inductors and the conductive winding assemblies of the inductors are gradually reduced.
In the conventional inductor 1, the winding coil 111 is directly wound around the pins 121. In a case that the diameter of the winding coil 111 is relatively large, the pins 121 are readily suffered from deformation during the winding process. Under this circumstance, the performance of the inductor 1 is deteriorated. Moreover, the inductor 1 could be directly arranged on a circuit board according to a surface mount technology (SMT), and thus the inductor 1 could be also referred as a surface mount magnetic device (SMD). After the inductor 1 is placed on the circuit board by a placement machine, the inductor 1 and the circuit board are heated in a reflow furnace and thus the pins 121 of the inductor 1 are welded on the circuit board. If the pins 121 are suffered from deformation, a poor contact problem of the inductor 1 occurs.
Since the winding coil 111 is directly wound around the pins 121, the height h1 of the winding assembly 11 is also determined by the diameter of the winding coil 111. If the diameter of the winding coil 111 is relatively large, the height h1 of the winding assembly 11 is increased and thus the evenness of the winding assembly 11 is insufficient. In addition, since the winding assembly 11 is disposed on the upper surface 120 of the base 12, the total height of the inductor 1 is equal to the sum of the height h1 of the winding assembly 11 and the height h2 of the base 12. In other words, it is difficult to precisely control the overall height of the inductor 1. In addition, the layout space of the inductor 1 is very large.
For increasing throughput and yield, the inductor 1 should be mounted on the circuit board by an automatic placement process according to the surface mount technology (SMT). Since the evenness of the winding assembly 11 is insufficient, the upper surface of the winding coil 111 is not suitable as a sucking surface to be picked up by the automatic placement machine. In other words, the inductor 1 is manually mounted on the circuit board and thus the fabricating cost is increased.
There is a need of providing an improved inductor so as to obviate the drawbacks encountered from the prior art.
It is an object of the present invention to provide an inductor having a flat sucking surface, so that the inductor is suitable to be mounted on a circuit board by an automatic placement process and the overall height of the inductor could be precisely controlled.
Another object of the present invention provides a base of an inductor, in which the problem of causing deformation of the pins of the base is minimized.
In accordance with an aspect of the present invention, there is provided an inductor. The inductor includes a base and a winding assembly. The base includes an outer frame, a middle part and a connecting part. The outer frame has a first upper surface. The middle part is disposed within the outer frame and has a second upper surface. The connecting part is connected with the outer frame and the middle part and has a third upper surface. The connecting part, the outer frame and the middle part collectively define a receptacle. The winding assembly is accommodated within the receptacle and has a fourth upper surface. The second upper surface of the middle part is disposed at a higher level with respect to the first upper surface of the outer frame. A first height is defined by the level difference between the second upper surface of the middle part and the third upper surface of the connecting part. A second height of the winding assembly is smaller than the first height, so that the fourth upper surface of the winding assembly is disposed at a lower level with respect to the second upper surface of the middle part after the winding assembly is accommodated within the receptacle.
In accordance with another aspect of the present invention, there is provided a base of an inductor. The inductor includes a winding assembly. The base includes an outer frame, a middle part and a connecting part. The outer frame has a first upper surface. The middle part is disposed within the outer frame and has a second upper surface. The connecting part is connected with the outer frame and the middle part and has a third upper surface. The connecting part, the outer frame and the middle part collectively define a receptacle. The second upper surface of the middle part is disposed at a higher level with respect to the first upper surface of the outer frame. A first height is defined by the level difference between the second upper surface of the middle part and the third upper surface of the connecting part. A second height of the winding assembly is smaller than the first height, so that a fourth upper surface of the winding assembly is disposed at a lower level with respect to the second upper surface of the middle part after the winding assembly is accommodated within the receptacle.
In accordance with a further aspect of the present invention, there is provided a base of an inductor. The inductor includes a winding assembly. The base includes an outer frame, a middle part, a connecting part, a plurality of conducting parts and a plurality of pins. The middle part is disposed within the outer frame. The connecting part is connected with the outer frame and the middle part. Each conducting part has a first terminal connected with the winding assembly and a second terminal connected with a corresponding pin. The pin is electrically connected to a circuit board.
The above contents of the present invention will become more readily apparent to those ordinarily skilled in the art after reviewing the following detailed description and accompanying drawings, in which:
The present invention will now be described more specifically with reference to the following embodiments. It is to be noted that the following descriptions of preferred embodiments of this invention are presented herein for purpose of illustration and description only. It is not intended to be exhaustive or to be limited to the precise form disclosed.
The base 22 comprises an outer frame 220, a middle part 221 and a connecting part 222. The outer frame 220 is substantially a square structure having a central hollow portion. The outer frame 220 comprises a first upper surface 220a and a first lower surface 220b (see
In addition, the level difference between the second upper surface 221a of the middle part 221 and the third upper surface 222a of the connecting part 222 define a first height H1. The first height H1 is larger than the second height H2 of the winding assembly 21. After the winding assembly 21 is accommodated within the receptacle 223 of the base 22, the fourth upper surface 210a is disposed at a lower level with respect to the second upper surface 221a of the middle part 221. As such, the overall volume and the overall height of the inductor 2 are reduced and the layout space of the inductor 2 is saved.
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In addition, one of the conducting parts 224 is disposed on a first lateral surface 220c of the outer frame 220. The pin 225 corresponding to the conducting part 224 is disposed on a second lateral surface 220d of the outer frame 220, wherein the second lateral surface 220d is next to the first lateral surface 220c. In this embodiment, the base 22 is a SMD base. The pins 225 of the base 22 are trapezoid-shaped pins. Each of the pins 225 has a bottom surface 225b lying flat on the circuit board (not shown). After the inductor 2 is placed on the circuit board by a placement machine, the inductor 2 and the circuit board are heated in a reflow furnace and thus the bottom surfaces 225b of the pins 225 are welded on the circuit board. The pin 225 further comprises a slot 225a in the center thereof. The molten solder paste could be filled into the slot 225 in order to increase the adhesion of the pin 225 to the circuit board. In some embodiments, the base 22 further comprises several auxiliary posts 226. The auxiliary posts 226 are disposed on the first lower surface 220b of the outer frame 220 for marking the position of a specified pin. The method of marking the position of the specified pin could be varied according to the practical requirements.
In the first and second embodiments, the SMD base 22 and the DIP base 32 are substantially identical except that the pins 225 and 325 have different structures. Under this circumstance, a common mold could be employed to produce the bases 22 and 32. For producing the SMD base 22 and the DIP base 32, the trapezoid-shaped pins 225 and the stitch-shaped pins 325 are respectively used. Since the SMD base and the DIP base of the inductor could be produced by a common mold, the fabricating cost of the inductor is reduced.
Two notches 220e are respectively formed in the second lateral surface 220d of the outer frame 220 and the opposed lateral surface of the second lateral surface 220d. In addition, guiding grooves 220f and 220g are formed in the outer frame 220 and beside the protruding blocks 220h. The outer frame 220 has protruding blocks 220h above the notches 220e. After the winding assembly 21 is completely accommodated within the receptacle 223 of the base 22, the input terminals 210c and the output terminal 210d of the winding coil 210 will be fixed on corresponding conducting parts 224 through the notch 220e, the protruding blocks 220h and the guiding grooves 220f, 220g. By means of the protruding blocks 220h, the input terminals 210c and the output terminal 210d of the winding coil 210 will be horizontally guided to the conducting parts 224 and the winding assembly 21 within the receptacle 223 will not be uplifted. The inductor 2 is electrically connected with the circuit board through the conducting parts 224 and the pins 225.
In some embodiments, the conducting parts 224 further have respective openings 224a for initially fixing the input terminals 210c and the output terminal 210d of the winding coil 210 before the welding process. The openings 224a are elongated or circular in shapes. After the input terminals 210c and the output terminal 210d of the winding coil 210 penetrate through the openings 224a of corresponding conducting parts 224, the input terminals 210c and the output terminal 210d are welded on corresponding conducting parts 224. Since the winding coils 210 are connected with corresponding conducting parts 224 and the pins 225 are connected with the circuit board, the possibility of deforming the conducting parts 224 during the inductor 2 is mounted on the circuit board will be minimized. Under this circumstance, the poor contact problem encountered in the prior art will be overcome. In addition, the electrical connection between the inductor 2 and the circuit board is enhanced.
For increasing throughput and yield, the inductor 2 is mounted on the circuit board by an automatic placement process according to the surface mount technology (SMT). The inductor 2 is picked by an automatic placement machine and then placed on a predetermined location of the circuit board. Since the second upper surface 221a of the middle part 221 is very flat, the second upper surface 221a is served as a sucking surface to be picked up by the automatic placement machine. Moreover, the height and the evenness of the inductor 2 could be measured by placing the detecting probe of a measuring tool on the second upper surface 221a of the inductor 2. Since the processes of measuring the height and the evenness of the inductor 2 are very simple, the throughput and yield could be further enhanced.
From the above description, the inductor of the present invention includes a winding assembly and a base. A first height is defined by the level difference between the second upper surface of the middle part and the third upper surface of the connecting part. The second height of the winding assembly is smaller than the first height. After the winding assembly is accommodated within the receptacle, the fourth upper surface of the winding assembly is disposed at a lower level with respect to the second upper surface of the middle part. As a consequence, the overall height of the inductor is limited by the base. In addition, since the second upper surface of the middle part is very flat, the second upper surface is served as sucking surface to be picked up by the automatic placement machine according to the surface mount technology (SMT). By means of the connecting parts and the pins of the base, the electrical connection between the inductor and the circuit board will no longer be adversely affected by the winding coil of the winding assembly, so that the reliability of the inductor is increased. Since the processes of measuring the height and the evenness of the inductor are very simple, the throughput and yield could be further enhanced. Since the SMD base and the DIP base of the inductor could be produced by a common mold, the fabricating cost of the inductor is reduced. Moreover, since the winding assembly is accommodated within the receptacle and the fourth upper surface of the winding assembly is disposed at a lower level with respect to the second upper surface of the base, the overall volume and the overall height of the inductor are controllable.
While the invention has been described in terms of what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention needs not be limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.
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Number | Date | Country | |
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20110025441 A1 | Feb 2011 | US |